TW200631666A - Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices - Google Patents

Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices

Info

Publication number
TW200631666A
TW200631666A TW094139173A TW94139173A TW200631666A TW 200631666 A TW200631666 A TW 200631666A TW 094139173 A TW094139173 A TW 094139173A TW 94139173 A TW94139173 A TW 94139173A TW 200631666 A TW200631666 A TW 200631666A
Authority
TW
Taiwan
Prior art keywords
fluid streams
manufacture
nozzle design
microelectronic devices
generating fluid
Prior art date
Application number
TW094139173A
Other languages
Chinese (zh)
Inventor
James F Weygand
Pamela A Kunkel
Gregory P Thomes
Original Assignee
Fsi Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fsi Int Inc filed Critical Fsi Int Inc
Publication of TW200631666A publication Critical patent/TW200631666A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Arrangements of several outlets along elongated bodies, e.g. perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/003—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material which dissolves or changes phase after the treatment, e.g. ice, CO2
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C3/00—Abrasive blasting machines or devices; Plants
    • B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
    • B24C3/322—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00—Devices or accessories for generating abrasive blasts
    • B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
    • B24C5/04—Nozzles therefor

Abstract

Improved nozzle design that discharges fluid streams through a series of nozzle orifices distributed along a length of the nozzle. The present invention may be incorporated into a wide range of microelectronic device manufacturing processes and equipment types for which an array of process streams are desired for treating microelectronic workpieces. The present invention is particularly useful to cryogenically clean microelectronic workpieces.
TW094139173A 2004-11-12 2005-11-08 Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices TW200631666A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62731004P 2004-11-12 2004-11-12

Publications (1)

Publication Number Publication Date
TW200631666A true TW200631666A (en) 2006-09-16

Family

ID=35911311

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094139173A TW200631666A (en) 2004-11-12 2005-11-08 Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices

Country Status (3)

Country Link
US (1) US20060105683A1 (en)
TW (1) TW200631666A (en)
WO (1) WO2006055345A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561343B (en) * 2010-06-04 2016-12-11 Sintokogio Ltd

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036273A1 (en) * 2007-12-18 2009-06-19 Asml Netherlands Bv Lithographic apparatus and method of cleaning a surface or an immersion lithographic apparatus.
US10082461B2 (en) 2014-07-29 2018-09-25 Nanometrics Incorporated Optical metrology with purged reference chip
US10625280B2 (en) * 2014-10-06 2020-04-21 Tel Fsi, Inc. Apparatus for spraying cryogenic fluids
US10014191B2 (en) 2014-10-06 2018-07-03 Tel Fsi, Inc. Systems and methods for treating substrates with cryogenic fluid mixtures
TWI707729B (en) 2014-10-06 2020-10-21 美商東京威力科創Ｆｓｉ股份有限公司 Systems and methods for treating substrates with cryogenic fluid mixtures
DE102017107030A1 (en) * 2017-03-31 2018-10-04 Fm Marketing Gmbh Refurbishing with dry ice blasting

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619543A (en) * 1970-02-18 1971-11-09 Int Harvester Co Positioning fixture to facilitate nozzle drilling by edm
US4747421A (en) * 1985-03-13 1988-05-31 Research Development Corporation Of Japan Apparatus for removing covering film
US4806171A (en) * 1987-04-22 1989-02-21 The Boc Group, Inc. Apparatus and method for removing minute particles from a substrate
US4893754A (en) * 1987-11-13 1990-01-16 Francisco Ruiz Generation of flat liquid sheet and sprays by means of simple cylindrical orifices
JPH02130921A (en) * 1988-11-11 1990-05-18 Taiyo Sanso Co Ltd Cleaning equipment for solid surface
US5009240A (en) * 1989-07-07 1991-04-23 United States Of America Wafer cleaning method
US5062898A (en) * 1990-06-05 1991-11-05 Air Products And Chemicals, Inc. Surface cleaning using a cryogenic aerosol
US5209028A (en) * 1992-04-15 1993-05-11 Air Products And Chemicals, Inc. Apparatus to clean solid surfaces using a cryogenic aerosol
US5294261A (en) * 1992-11-02 1994-03-15 Air Products And Chemicals, Inc. Surface cleaning using an argon or nitrogen aerosol
US5377911A (en) * 1993-06-14 1995-01-03 International Business Machines Corporation Apparatus for producing cryogenic aerosol
IL106803A (en) * 1993-08-25 1998-02-08 Scitex Corp Ltd Ink jet print head
US6173916B1 (en) * 1994-12-15 2001-01-16 Eco-Snow Systems, Inc. CO2jet spray nozzles with multiple orifices
US5942037A (en) * 1996-12-23 1999-08-24 Fsi International, Inc. Rotatable and translatable spray nozzle
JP3183214B2 (en) * 1997-05-26 2001-07-09 日本電気株式会社 Cleaning method and cleaning device
US5961732A (en) * 1997-06-11 1999-10-05 Fsi International, Inc Treating substrates by producing and controlling a cryogenic aerosol
TW391895B (en) * 1998-10-02 2000-06-01 Ultra Clean Technology Asia Pt Method and apparatus for washing and drying semi-conductor devices
KR100469133B1 (en) * 1999-06-24 2005-01-29 스미도모쥬기가이고교 가부시키가이샤 Method and device for washing by fluid spraying
US6578369B2 (en) * 2001-03-28 2003-06-17 Fsi International, Inc. Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561343B (en) * 2010-06-04 2016-12-11 Sintokogio Ltd

Also Published As

Publication number Publication date
US20060105683A1 (en) 2006-05-18
WO2006055345A1 (en) 2006-05-26

Similar Documents

Publication Publication Date Title
TW200631666A (en) Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices
WO2002079705A3 (en) Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices
EP2011897B8 (en) Method for cleaning deposition chamber parts using selective spray etch
IL182891A0 (en) Method and device for generating a jet of fluid for material peocessing and fluid nozzle for use in said device
TW200718802A (en) Method of using NF3 for removing surface deposits
WO2009019156A3 (en) Method and device for the plasma-aided treatment of surfaces
TWI264062B (en) Plasma treatment apparatus
AU2003292678A8 (en) Plasma generator, ozone generator, substrate processing apparatus, and method for manufacturing semiconductor device
WO2004098259A3 (en) Plasma treatment for purifying copper or nickel
DE50306633D1 (en) Method and apparatus for cold gas spraying
DE602006003419D1 (en) SPIRAL MIXER NOZZLE AND METHOD FOR MIXING TWO OR MORE FLUIDS AND METHOD FOR PRODUCING ISOCYANATES
WO2004066359A3 (en) Apparatus and method for treating surfaces of semiconductor wafers using ozone
WO2011109266A3 (en) Method and apparatus for single step selective nitridation
WO2005090638A8 (en) Remote chamber methods for removing surface deposits
TW200608453A (en) Object treating device and method
TW200718479A (en) Method of using sulfur fluoride for removing surface deposits
SG132602A1 (en) Apparatus and methods for slurry cleaning of etch chambers
TW200833430A (en) Methods and apparatus for cleaning chamber components
MY140907A (en) Arcing electron stream apparatus and method
MX2009012487A (en) Flotation water treatment plant and corresponding water treatment method.
ATE521692T1 (en) SEMICONDUCTOR SURFACE TREATMENT AND MIXTURE USED
WO2010110546A3 (en) Slit type supersonic nozzle and surface treatment device having the same
ITMI20022336A1 (en) PROCEDURE AND MIXING EQUIPMENT WITH
AU2002366920A8 (en) Cleaning gas composition for semiconductor production equipment and cleaning method using the gas
TW200709863A (en) Nozzle for supplying treatment liquid and substrate treating apparatus