WO2010110546A3 - Slit type supersonic nozzle and surface treatment device having the same - Google Patents

Slit type supersonic nozzle and surface treatment device having the same Download PDF

Info

Publication number
WO2010110546A3
WO2010110546A3 PCT/KR2010/001658 KR2010001658W WO2010110546A3 WO 2010110546 A3 WO2010110546 A3 WO 2010110546A3 KR 2010001658 W KR2010001658 W KR 2010001658W WO 2010110546 A3 WO2010110546 A3 WO 2010110546A3
Authority
WO
WIPO (PCT)
Prior art keywords
treated
nozzle
nozzle body
treatment device
surface treatment
Prior art date
Application number
PCT/KR2010/001658
Other languages
French (fr)
Korean (ko)
Other versions
WO2010110546A2 (en
Inventor
김상현
Original Assignee
주식회사 지디머신즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 지디머신즈 filed Critical 주식회사 지디머신즈
Priority to JP2011547825A priority Critical patent/JP2012516233A/en
Priority to CN2010800042771A priority patent/CN102272900A/en
Publication of WO2010110546A2 publication Critical patent/WO2010110546A2/en
Publication of WO2010110546A3 publication Critical patent/WO2010110546A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a slit type supersonic nozzle and a surface treatment device having the same. In particular, the slit type supersonic nozzle of the present invention sprays high speed gas to remove contaminants from the surface of a an object to be treated (10), the nozzle comprising: a nozzle body (111) extendedly formed along the width direction of the object to be treated (10); an equal pressure-distribution line (112) which is formed inside the nozzle body (111) and has a flow path formed continuously in the width direction of the object to be treated (10) such that high-pressure gas supplied to the nozzle body (111) is equally distributed in the longitudinal direction of the nozzle body (111); and a slit (113) which is formed at one end of the nozzle body (111) and the equal pressure-distribution line (112) in an open state in the lateral direction of the object to be treated (10), and generates a supersonic gas jet for producing a shock wave out of high-pressure gas supplied via the equal pressure-distribution line (112) and then spraying towards the object to be treated (10). The present invention nozzle and the surface treatment device having the same can effectively remove micro-contaminants firmly attached to the surface of an object to be treated, without necessarily damaging the surface of the object to be treated.
PCT/KR2010/001658 2009-03-24 2010-03-18 Slit type supersonic nozzle and surface treatment device having the same WO2010110546A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011547825A JP2012516233A (en) 2009-03-24 2010-03-18 Slit-type supersonic nozzle and surface treatment apparatus equipped with the same
CN2010800042771A CN102272900A (en) 2009-03-24 2010-03-18 Slit type supersonic nozzle and surface treatment device having the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0024958 2009-03-24
KR1020090024958A KR100928691B1 (en) 2009-03-24 2009-03-24 Slit type supersonic nozzle and surface-cleaning apparatus having the same

Publications (2)

Publication Number Publication Date
WO2010110546A2 WO2010110546A2 (en) 2010-09-30
WO2010110546A3 true WO2010110546A3 (en) 2010-11-25

Family

ID=41605478

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001658 WO2010110546A2 (en) 2009-03-24 2010-03-18 Slit type supersonic nozzle and surface treatment device having the same

Country Status (4)

Country Link
JP (1) JP2012516233A (en)
KR (1) KR100928691B1 (en)
CN (1) CN102272900A (en)
WO (1) WO2010110546A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101768655B1 (en) * 2011-06-20 2017-08-17 주식회사 엘지화학 Drying apparatus for cleaning system of float glass
KR101824628B1 (en) * 2015-10-16 2018-02-01 라온닉스 주식회사 Surface cleaning apparatus
CN110130250B (en) * 2019-05-21 2021-01-15 郭旋 Pneumatic low-damage road pile mud removing device
KR102459609B1 (en) * 2020-12-04 2022-10-27 인하대학교 산학협력단 Structure of connecting pipe for pipe of the high pressure hydrogen
CN113997205B (en) * 2021-11-26 2022-11-18 山东大学 High-voltage pulse abrasive jet flow generation device and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08198431A (en) * 1995-01-25 1996-08-06 Tsukasa Kogyo Kk Automatic interior washing system for various kind of powder processing apparatus
KR100328640B1 (en) * 1999-06-21 2002-03-20 오자와 미토시 Surface Cleaning Method and Device Therefor
KR20060107841A (en) * 2003-12-15 2006-10-16 코레플로우 사이언티픽 솔루션스 리미티드 Apparatus and method for cleaning surfaces
JP2007073615A (en) * 2005-09-05 2007-03-22 Fukuoka Prefecture Cleaning nozzle and cleaning method using it

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0811224B2 (en) * 1992-03-09 1996-02-07 三宝電機株式会社 Article cleaning equipment
JPH10211473A (en) * 1997-01-29 1998-08-11 Shibaura Eng Works Co Ltd Air knife, supporting apparatus for air knife, and treatment apparatus using the same
JP3790627B2 (en) * 1998-02-13 2006-06-28 住友重機械工業株式会社 Surface cleaning method and apparatus
JP3856210B2 (en) * 2002-01-21 2006-12-13 株式会社いけうち nozzle

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08198431A (en) * 1995-01-25 1996-08-06 Tsukasa Kogyo Kk Automatic interior washing system for various kind of powder processing apparatus
KR100328640B1 (en) * 1999-06-21 2002-03-20 오자와 미토시 Surface Cleaning Method and Device Therefor
KR20060107841A (en) * 2003-12-15 2006-10-16 코레플로우 사이언티픽 솔루션스 리미티드 Apparatus and method for cleaning surfaces
JP2007073615A (en) * 2005-09-05 2007-03-22 Fukuoka Prefecture Cleaning nozzle and cleaning method using it

Also Published As

Publication number Publication date
KR100928691B1 (en) 2009-11-27
CN102272900A (en) 2011-12-07
JP2012516233A (en) 2012-07-19
WO2010110546A2 (en) 2010-09-30

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