WO2010110546A3 - Tuyère supersonique de type à fente et dispositif de traitement de surface doté de celle-ci - Google Patents

Tuyère supersonique de type à fente et dispositif de traitement de surface doté de celle-ci Download PDF

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Publication number
WO2010110546A3
WO2010110546A3 PCT/KR2010/001658 KR2010001658W WO2010110546A3 WO 2010110546 A3 WO2010110546 A3 WO 2010110546A3 KR 2010001658 W KR2010001658 W KR 2010001658W WO 2010110546 A3 WO2010110546 A3 WO 2010110546A3
Authority
WO
WIPO (PCT)
Prior art keywords
treated
nozzle
nozzle body
treatment device
surface treatment
Prior art date
Application number
PCT/KR2010/001658
Other languages
English (en)
Korean (ko)
Other versions
WO2010110546A2 (fr
Inventor
김상현
Original Assignee
주식회사 지디머신즈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 지디머신즈 filed Critical 주식회사 지디머신즈
Priority to CN2010800042771A priority Critical patent/CN102272900A/zh
Priority to JP2011547825A priority patent/JP2012516233A/ja
Publication of WO2010110546A2 publication Critical patent/WO2010110546A2/fr
Publication of WO2010110546A3 publication Critical patent/WO2010110546A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

La présente invention a trait à une tuyère supersonique de type à fente et dispositif de traitement de surface doté de celle-ci. En particulier, la tuyère supersonique de type à fente selon la présente invention pulvérise un gaz à grande vitesse afin de supprimer les contaminants de la surface d'un objet devant être traité (10), laquelle tuyère comprend : un corps de tuyère (111) s'étendant le long de la direction de la largeur de l'objet devant être traité (10); une ligne de distribution à pression égale (112) qui est formée à l'intérieur du corps de tuyère (111) et qui est dotée d'une voie de passage formée en continu dans la direction de la largeur de l'objet devant être traité (10) de manière à ce que le gaz à haute pression fourni au corps de tuyère (111) soit distribué de façon homogène dans la direction longitudinale du corps de tuyère (111); et une fente (113) qui est formée à une extrémité du corps de tuyère (111) et de la ligne de distribution à pression égale (112) dans un état ouvert dans la direction de la largeur de l'objet devant être traité (10), et qui génère un jet de gaz supersonique afin de produire une onde de choc à partir du gaz à haute pression fourni via la ligne de distribution à pression égale (112) puis pulvérisé vers l'objet devant être traité (10). La tuyère et le dispositif de traitement de surface doté de celle-ci selon la présente invention permettent de supprimer de façon efficace les micro-contaminants fermement fixés sur la surface d'un objet devant être traité, sans nécessairement endommager la surface de l'objet devant être traité.
PCT/KR2010/001658 2009-03-24 2010-03-18 Tuyère supersonique de type à fente et dispositif de traitement de surface doté de celle-ci WO2010110546A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800042771A CN102272900A (zh) 2009-03-24 2010-03-18 狭缝式超音速喷嘴及具备该喷嘴的表面处理装置
JP2011547825A JP2012516233A (ja) 2009-03-24 2010-03-18 スリット型超音速ノズルおよびこれを備えた表面処理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090024958A KR100928691B1 (ko) 2009-03-24 2009-03-24 슬릿형 초음속 노즐 및 이를 구비한 표면처리장치
KR10-2009-0024958 2009-03-24

Publications (2)

Publication Number Publication Date
WO2010110546A2 WO2010110546A2 (fr) 2010-09-30
WO2010110546A3 true WO2010110546A3 (fr) 2010-11-25

Family

ID=41605478

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001658 WO2010110546A2 (fr) 2009-03-24 2010-03-18 Tuyère supersonique de type à fente et dispositif de traitement de surface doté de celle-ci

Country Status (4)

Country Link
JP (1) JP2012516233A (fr)
KR (1) KR100928691B1 (fr)
CN (1) CN102272900A (fr)
WO (1) WO2010110546A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101768655B1 (ko) * 2011-06-20 2017-08-17 주식회사 엘지화학 플로트 유리 세정 시스템용 건조 장치
KR101824628B1 (ko) * 2015-10-16 2018-02-01 라온닉스 주식회사 표면 세정 장치
CN110130250B (zh) * 2019-05-21 2021-01-15 郭旋 一种气压式低损伤的路桩清泥装置
KR102459609B1 (ko) * 2020-12-04 2022-10-27 인하대학교 산학협력단 고압 수소 배관용 이음관 구조
CN113997205B (zh) * 2021-11-26 2022-11-18 山东大学 一种高压脉冲磨料射流发生装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08198431A (ja) * 1995-01-25 1996-08-06 Tsukasa Kogyo Kk 各種粉体処理機器内部自動洗浄システム
KR100328640B1 (ko) * 1999-06-21 2002-03-20 오자와 미토시 표면세정방법 및 장치
KR20060107841A (ko) * 2003-12-15 2006-10-16 코레플로우 사이언티픽 솔루션스 리미티드 표면 세척용 장치 및 방법
JP2007073615A (ja) * 2005-09-05 2007-03-22 Fukuoka Prefecture 洗浄ノズル及びそれを用いた洗浄方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0811224B2 (ja) * 1992-03-09 1996-02-07 三宝電機株式会社 物品清浄装置
JPH10211473A (ja) * 1997-01-29 1998-08-11 Shibaura Eng Works Co Ltd エアナイフ、エアナイフの支持装置およびエアナイフを用いた処理装置
JP3790627B2 (ja) * 1998-02-13 2006-06-28 住友重機械工業株式会社 表面洗浄方法及び装置
JP3856210B2 (ja) * 2002-01-21 2006-12-13 株式会社いけうち ノズル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08198431A (ja) * 1995-01-25 1996-08-06 Tsukasa Kogyo Kk 各種粉体処理機器内部自動洗浄システム
KR100328640B1 (ko) * 1999-06-21 2002-03-20 오자와 미토시 표면세정방법 및 장치
KR20060107841A (ko) * 2003-12-15 2006-10-16 코레플로우 사이언티픽 솔루션스 리미티드 표면 세척용 장치 및 방법
JP2007073615A (ja) * 2005-09-05 2007-03-22 Fukuoka Prefecture 洗浄ノズル及びそれを用いた洗浄方法

Also Published As

Publication number Publication date
KR100928691B1 (ko) 2009-11-27
WO2010110546A2 (fr) 2010-09-30
CN102272900A (zh) 2011-12-07
JP2012516233A (ja) 2012-07-19

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