SG11202111303WA - Method for manufacturing solder product, solder, soldered component, solder product, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin article, tin intermediate product, and conductive member - Google Patents
Method for manufacturing solder product, solder, soldered component, solder product, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin article, tin intermediate product, and conductive memberInfo
- Publication number
- SG11202111303WA SG11202111303WA SG11202111303WA SG11202111303WA SG11202111303WA SG 11202111303W A SG11202111303W A SG 11202111303WA SG 11202111303W A SG11202111303W A SG 11202111303WA SG 11202111303W A SG11202111303W A SG 11202111303WA SG 11202111303W A SG11202111303W A SG 11202111303WA
- Authority
- SG
- Singapore
- Prior art keywords
- product
- tin
- solder
- manufacturing
- soldered
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/08—Refining
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
- C22B9/02—Refining by liquating, filtering, centrifuging, distilling, or supersonic wave action including acoustic waves
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
- C22B9/02—Refining by liquating, filtering, centrifuging, distilling, or supersonic wave action including acoustic waves
- C22B9/023—By filtering
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019074215A JP2020172676A (ja) | 2019-04-09 | 2019-04-09 | はんだ製品の製造方法 |
JP2020043538A JP2021142548A (ja) | 2020-03-12 | 2020-03-12 | はんだ、はんだの製造方法及びはんだ付け部品 |
JP2020069965A JP7026907B2 (ja) | 2020-04-08 | 2020-04-08 | はんだ製品の製造方法、プリント回路板、線材、フレキシブルプリント基板および電子部品 |
JP2020069966A JP2021164948A (ja) | 2020-04-08 | 2020-04-08 | 錫成形品の製造方法、錫中間製品の製造方法、錫成形品、錫中間製品、導電部材、線材、フレキシブルプリント基板および電子部品 |
PCT/JP2020/015963 WO2020209330A1 (ja) | 2019-04-09 | 2020-04-09 | はんだ製品の製造方法、はんだ、はんだ付け部品、はんだ製品、プリント配線板、プリント回路板、線材、はんだ付け製品、フレキシブルプリント基板、電子部品、錫成形品の製造方法、錫中間製品の製造方法、錫成形品、錫中間製品および導電部材 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202111303WA true SG11202111303WA (en) | 2021-11-29 |
Family
ID=72751320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202111303WA SG11202111303WA (en) | 2019-04-09 | 2020-04-09 | Method for manufacturing solder product, solder, soldered component, solder product, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin article, tin intermediate product, and conductive member |
Country Status (10)
Country | Link |
---|---|
US (2) | US11802322B2 (ko) |
EP (1) | EP3954794A4 (ko) |
KR (2) | KR20230116963A (ko) |
CN (1) | CN113748221A (ko) |
CA (1) | CA3132711C (ko) |
IL (1) | IL286988B (ko) |
MX (5) | MX2021012401A (ko) |
MY (1) | MY191069A (ko) |
SG (1) | SG11202111303WA (ko) |
WO (1) | WO2020209330A1 (ko) |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5135620A (ja) * | 1974-09-20 | 1976-03-26 | Yoshimasa Ito | Chuzoyogokin |
JPH0747233B2 (ja) * | 1987-09-14 | 1995-05-24 | 古河電気工業株式会社 | 半田析出用組成物および半田析出方法 |
US5169128A (en) * | 1991-09-30 | 1992-12-08 | General Electric Company | Molten solder filter |
US6179935B1 (en) | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
JP3296289B2 (ja) | 1997-07-16 | 2002-06-24 | 富士電機株式会社 | はんだ合金 |
JP4231157B2 (ja) * | 1998-07-02 | 2009-02-25 | パナソニック株式会社 | はんだ粉末とその製造方法、およびソルダーペースト |
JP2000192112A (ja) | 1998-12-25 | 2000-07-11 | Nippon Steel Corp | 微小金属球の製造方法及び装置 |
JP2001181709A (ja) * | 1999-12-23 | 2001-07-03 | Nippon Steel Corp | 微小金属球の製造方法及び装置 |
JP3788335B2 (ja) * | 2001-12-07 | 2006-06-21 | 千住金属工業株式会社 | ソルダペースト |
JP2005131703A (ja) * | 2003-10-31 | 2005-05-26 | Nippon Joint Kk | 球形状ハンダ及びその製造方法 |
ES2435717T3 (es) * | 2005-07-26 | 2013-12-23 | Nihon Superior Sha Co., Ltd | Dispositivo para la precipitación de cobre en suelda sin plomo, para la granulación y separación de compuestos (CuX)6Sn5 y para la recuperación de estaño |
JP4895328B2 (ja) * | 2007-04-26 | 2012-03-14 | 新日鉄マテリアルズ株式会社 | 表面処理はんだボール及びはんだボールの表面処理方法 |
JP5234902B2 (ja) * | 2007-10-10 | 2013-07-10 | エヌイーシー ショット コンポーネンツ株式会社 | 可溶合金型温度ヒューズ |
JP4375485B2 (ja) * | 2008-02-22 | 2009-12-02 | 日本ジョイント株式会社 | 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法 |
US8138576B2 (en) * | 2009-02-09 | 2012-03-20 | Nippon Joint Co., Ltd. | Production method and production apparatus of tin or solder alloy for electronic components, and solder alloy |
CN103100805A (zh) * | 2013-02-17 | 2013-05-15 | 云南锡业锡材有限公司 | 一种高纯净无铅焊料的制备方法 |
JP6132716B2 (ja) * | 2013-09-10 | 2017-05-24 | 株式会社東芝 | 金属粒子ペースト、これを用いた硬化物、および半導体装置 |
KR101627315B1 (ko) * | 2014-04-23 | 2016-06-03 | 덕산하이메탈(주) | 주석 필터링 방법, 이를 이용한 합금 제조방법 및 솔더볼 제조방법 |
CN105171277B (zh) | 2015-09-25 | 2017-07-07 | 天津大学 | 一种锡基银石墨烯无铅复合钎料的制备方法 |
CN106956091A (zh) * | 2017-05-02 | 2017-07-18 | 泰州朗瑞新能源科技有限公司 | 一种焊接材料及其制备方法 |
-
2020
- 2020-04-09 SG SG11202111303WA patent/SG11202111303WA/en unknown
- 2020-04-09 EP EP20787890.1A patent/EP3954794A4/en active Pending
- 2020-04-09 KR KR1020237025541A patent/KR20230116963A/ko active Application Filing
- 2020-04-09 MX MX2021012401A patent/MX2021012401A/es unknown
- 2020-04-09 CN CN202080027367.6A patent/CN113748221A/zh active Pending
- 2020-04-09 CA CA3132711A patent/CA3132711C/en active Active
- 2020-04-09 WO PCT/JP2020/015963 patent/WO2020209330A1/ja unknown
- 2020-04-09 KR KR1020217035727A patent/KR102561654B1/ko active IP Right Grant
- 2020-04-09 MY MYPI2021006014A patent/MY191069A/en unknown
-
2021
- 2021-10-05 IL IL286988A patent/IL286988B/en unknown
- 2021-10-07 US US17/496,756 patent/US11802322B2/en active Active
- 2021-10-08 MX MX2023006895A patent/MX2023006895A/es unknown
- 2021-10-08 MX MX2023006887A patent/MX2023006887A/es unknown
- 2021-10-08 MX MX2023006894A patent/MX2023006894A/es unknown
- 2021-10-08 MX MX2023006889A patent/MX2023006889A/es unknown
-
2023
- 2023-09-18 US US18/469,534 patent/US20240002979A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
MX2023006889A (es) | 2023-06-23 |
US20220025484A1 (en) | 2022-01-27 |
CA3132711A1 (en) | 2020-10-15 |
MX2023006887A (es) | 2023-06-23 |
MX2023006894A (es) | 2023-06-26 |
EP3954794A4 (en) | 2022-10-26 |
US11802322B2 (en) | 2023-10-31 |
KR102561654B1 (ko) | 2023-07-31 |
EP3954794A1 (en) | 2022-02-16 |
KR20230116963A (ko) | 2023-08-04 |
CA3132711C (en) | 2022-05-17 |
US20240002979A1 (en) | 2024-01-04 |
MX2021012401A (es) | 2021-11-12 |
IL286988A (en) | 2021-12-01 |
MY191069A (en) | 2022-05-30 |
KR20210150453A (ko) | 2021-12-10 |
CN113748221A (zh) | 2021-12-03 |
MX2023006895A (es) | 2023-06-26 |
IL286988B (en) | 2022-04-01 |
WO2020209330A1 (ja) | 2020-10-15 |
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