SG11202108742VA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11202108742VA SG11202108742VA SG11202108742VA SG11202108742VA SG11202108742VA SG 11202108742V A SG11202108742V A SG 11202108742VA SG 11202108742V A SG11202108742V A SG 11202108742VA SG 11202108742V A SG11202108742V A SG 11202108742VA SG 11202108742V A SG11202108742V A SG 11202108742VA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019024751A JP7222750B2 (ja) | 2019-02-14 | 2019-02-14 | 研磨用組成物 |
PCT/JP2020/004203 WO2020166438A1 (ja) | 2019-02-14 | 2020-02-04 | 研磨用組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202108742VA true SG11202108742VA (en) | 2021-09-29 |
Family
ID=72044692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202108742VA SG11202108742VA (en) | 2019-02-14 | 2020-02-04 | Polishing composition |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP7222750B2 (ja) |
KR (1) | KR20210128378A (ja) |
CN (1) | CN113227310B (ja) |
DE (1) | DE112020000827T5 (ja) |
SG (1) | SG11202108742VA (ja) |
TW (1) | TWI846818B (ja) |
WO (1) | WO2020166438A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024043061A1 (ja) * | 2022-08-26 | 2024-02-29 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10063488A1 (de) * | 2000-12-20 | 2002-06-27 | Bayer Ag | Polierslurry für das chemisch-mechanische Polieren von Siliciumdioxid-Filmen |
US20080020680A1 (en) * | 2006-07-24 | 2008-01-24 | Cabot Microelectronics Corporation | Rate-enhanced CMP compositions for dielectric films |
CN102102008B (zh) * | 2009-12-18 | 2014-07-23 | 安集微电子(上海)有限公司 | 一种水基玻璃磨削液及其使用方法 |
US8431490B2 (en) * | 2010-03-31 | 2013-04-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal |
JP6250454B2 (ja) * | 2014-03-27 | 2017-12-20 | 株式会社フジミインコーポレーテッド | シリコン材料研磨用組成物 |
US9275899B2 (en) * | 2014-06-27 | 2016-03-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and method for polishing tungsten |
JP2017197590A (ja) * | 2014-09-08 | 2017-11-02 | ニッタ・ハース株式会社 | 研磨用組成物 |
JP6482234B2 (ja) * | 2014-10-22 | 2019-03-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
WO2016143323A1 (ja) * | 2015-03-11 | 2016-09-15 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びシリコン基板の研磨方法 |
JP2017132944A (ja) * | 2016-01-29 | 2017-08-03 | 株式会社フジミインコーポレーテッド | 濃縮研磨用組成物の製造方法および安定化方法 |
US11897081B2 (en) * | 2016-03-01 | 2024-02-13 | Fujimi Incorporated | Method for polishing silicon substrate and polishing composition set |
US10676646B2 (en) * | 2017-05-25 | 2020-06-09 | Fujifilm Electronic Materials U.S.A., Inc. | Chemical mechanical polishing slurry for cobalt applications |
-
2019
- 2019-02-14 JP JP2019024751A patent/JP7222750B2/ja active Active
-
2020
- 2020-02-04 DE DE112020000827.4T patent/DE112020000827T5/de active Pending
- 2020-02-04 WO PCT/JP2020/004203 patent/WO2020166438A1/ja active Application Filing
- 2020-02-04 CN CN202080007445.6A patent/CN113227310B/zh active Active
- 2020-02-04 SG SG11202108742VA patent/SG11202108742VA/en unknown
- 2020-02-04 KR KR1020217018929A patent/KR20210128378A/ko active Search and Examination
- 2020-02-13 TW TW109104434A patent/TWI846818B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2020132695A (ja) | 2020-08-31 |
CN113227310A (zh) | 2021-08-06 |
JP7222750B2 (ja) | 2023-02-15 |
TWI846818B (zh) | 2024-07-01 |
KR20210128378A (ko) | 2021-10-26 |
CN113227310B (zh) | 2022-10-28 |
TW202035644A (zh) | 2020-10-01 |
WO2020166438A1 (ja) | 2020-08-20 |
DE112020000827T5 (de) | 2021-11-04 |
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