SG11202105091PA - Cleaning module, substrate processing apparatus including cleaning module, and cleaning method - Google Patents
Cleaning module, substrate processing apparatus including cleaning module, and cleaning methodInfo
- Publication number
- SG11202105091PA SG11202105091PA SG11202105091PA SG11202105091PA SG11202105091PA SG 11202105091P A SG11202105091P A SG 11202105091PA SG 11202105091P A SG11202105091P A SG 11202105091PA SG 11202105091P A SG11202105091P A SG 11202105091PA SG 11202105091P A SG11202105091P A SG 11202105091PA
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning
- cleaning module
- processing apparatus
- substrate processing
- apparatus including
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 3
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/02087—Cleaning of wafer edges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018215456A JP7265858B2 (ja) | 2018-11-16 | 2018-11-16 | 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法 |
PCT/JP2019/042773 WO2020100609A1 (ja) | 2018-11-16 | 2019-10-31 | 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202105091PA true SG11202105091PA (en) | 2021-06-29 |
Family
ID=70730502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202105091PA SG11202105091PA (en) | 2018-11-16 | 2019-10-31 | Cleaning module, substrate processing apparatus including cleaning module, and cleaning method |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220013352A1 (ja) |
JP (1) | JP7265858B2 (ja) |
KR (1) | KR20210089671A (ja) |
CN (1) | CN113165142B (ja) |
SG (1) | SG11202105091PA (ja) |
TW (1) | TWI822901B (ja) |
WO (1) | WO2020100609A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112976266A (zh) * | 2021-03-04 | 2021-06-18 | 王仕英 | 一种陶瓷生产用胚体修复装置 |
CN114887976B (zh) * | 2022-05-25 | 2024-01-23 | 宁波芯丰精密科技有限公司 | 一种清洁装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2415580A1 (de) * | 1974-03-30 | 1975-10-02 | Schleifenbaum & Steinmetz | Verfahren zum reinigen von blechen und reinigungsmaschine zur durchfuehrung des verfahrens |
JP3030796B2 (ja) * | 1992-07-24 | 2000-04-10 | 東京エレクトロン株式会社 | 洗浄処理方法 |
US5861066A (en) | 1996-05-01 | 1999-01-19 | Ontrak Systems, Inc. | Method and apparatus for cleaning edges of contaminated substrates |
JP3577173B2 (ja) * | 1996-09-09 | 2004-10-13 | 昭和電工株式会社 | ディスク基板の洗浄ユニット及び連続洗浄装置 |
JP4843167B2 (ja) * | 2001-09-20 | 2011-12-21 | 株式会社東芝 | ローラ清掃装置 |
JP2003151925A (ja) | 2001-11-12 | 2003-05-23 | Yac Co Ltd | ウェーハエッジ研磨処理装置 |
JP2003151943A (ja) | 2001-11-19 | 2003-05-23 | Speedfam Clean System Co Ltd | スクラブ洗浄装置 |
JP3933670B2 (ja) | 2005-03-29 | 2007-06-20 | 東京エレクトロン株式会社 | 基板洗浄方法及び基板洗浄装置 |
JP2007317703A (ja) | 2006-05-23 | 2007-12-06 | Fujifilm Corp | ブラシ洗浄方法、半導体の製造方法及びブラシ洗浄装置 |
JP4858042B2 (ja) | 2006-09-26 | 2012-01-18 | ミツミ電機株式会社 | 半導体基板の洗浄方法 |
KR100853378B1 (ko) * | 2006-10-24 | 2008-08-21 | 주식회사 케이씨텍 | 대면적 기판의 접촉식 세정장치 |
JP5009253B2 (ja) | 2008-08-07 | 2012-08-22 | 東京エレクトロン株式会社 | 基板洗浄装置 |
US9700988B2 (en) * | 2014-08-26 | 2017-07-11 | Ebara Corporation | Substrate processing apparatus |
JP6910148B2 (ja) | 2017-01-13 | 2021-07-28 | 株式会社ディスコ | ウエーハ洗浄装置 |
-
2018
- 2018-11-16 JP JP2018215456A patent/JP7265858B2/ja active Active
-
2019
- 2019-10-31 US US17/294,212 patent/US20220013352A1/en active Pending
- 2019-10-31 CN CN201980075357.7A patent/CN113165142B/zh active Active
- 2019-10-31 WO PCT/JP2019/042773 patent/WO2020100609A1/ja active Application Filing
- 2019-10-31 SG SG11202105091PA patent/SG11202105091PA/en unknown
- 2019-10-31 KR KR1020217014827A patent/KR20210089671A/ko not_active Application Discontinuation
- 2019-11-08 TW TW108140562A patent/TWI822901B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN113165142B (zh) | 2023-12-22 |
TWI822901B (zh) | 2023-11-21 |
KR20210089671A (ko) | 2021-07-16 |
TW202027867A (zh) | 2020-08-01 |
JP2020088000A (ja) | 2020-06-04 |
WO2020100609A1 (ja) | 2020-05-22 |
US20220013352A1 (en) | 2022-01-13 |
CN113165142A (zh) | 2021-07-23 |
JP7265858B2 (ja) | 2023-04-27 |
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