SG11202012983PA - Electrode for the electroplating or electrodeposition of a metal - Google Patents

Electrode for the electroplating or electrodeposition of a metal

Info

Publication number
SG11202012983PA
SG11202012983PA SG11202012983PA SG11202012983PA SG11202012983PA SG 11202012983P A SG11202012983P A SG 11202012983PA SG 11202012983P A SG11202012983P A SG 11202012983PA SG 11202012983P A SG11202012983P A SG 11202012983PA SG 11202012983P A SG11202012983P A SG 11202012983PA
Authority
SG
Singapore
Prior art keywords
electrodeposition
electroplating
electrode
metal
Prior art date
Application number
SG11202012983PA
Other languages
English (en)
Inventor
Valentina Bonometti
Original Assignee
Industrie De Nora Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Industrie De Nora Spa filed Critical Industrie De Nora Spa
Publication of SG11202012983PA publication Critical patent/SG11202012983PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1225—Deposition of multilayers of inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Laser Beam Processing (AREA)
  • Paints Or Removers (AREA)
SG11202012983PA 2018-08-03 2019-07-18 Electrode for the electroplating or electrodeposition of a metal SG11202012983PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102018000007835A IT201800007835A1 (it) 2018-08-03 2018-08-03 Elettrodo per la galvanotecnica o l’elettrodeposizione di un metallo
PCT/EP2019/069443 WO2020025351A1 (en) 2018-08-03 2019-07-18 Electrode for the electroplating or electrodeposition of a metal

Publications (1)

Publication Number Publication Date
SG11202012983PA true SG11202012983PA (en) 2021-02-25

Family

ID=63762930

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202012983PA SG11202012983PA (en) 2018-08-03 2019-07-18 Electrode for the electroplating or electrodeposition of a metal

Country Status (13)

Country Link
US (1) US20210269931A1 (pt)
EP (1) EP3830319A1 (pt)
JP (1) JP7426984B2 (pt)
KR (1) KR20210035897A (pt)
CN (1) CN112513340A (pt)
AU (1) AU2019316092A1 (pt)
BR (1) BR112021001637A2 (pt)
CA (1) CA3105586A1 (pt)
IT (1) IT201800007835A1 (pt)
PH (1) PH12021550107A1 (pt)
SG (1) SG11202012983PA (pt)
TW (1) TWI802731B (pt)
WO (1) WO2020025351A1 (pt)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5004626A (en) * 1986-10-27 1991-04-02 Huron Technologies, Inc. Anodes and method of making
US5419824A (en) * 1992-11-12 1995-05-30 Weres; Oleh Electrode, electrode manufacturing process and electrochemical cell
JPH06306670A (ja) * 1993-04-27 1994-11-01 Daiso Co Ltd 酸素発生用電極の製法
US6527939B1 (en) 1999-06-28 2003-03-04 Eltech Systems Corporation Method of producing copper foil with an anode having multiple coating layers
US7247229B2 (en) 1999-06-28 2007-07-24 Eltech Systems Corporation Coatings for the inhibition of undesirable oxidation in an electrochemical cell
US6589405B2 (en) 2000-05-15 2003-07-08 Oleh Weres Multilayer oxide coated valve metal electrode for water purification
US7156962B2 (en) 2001-06-21 2007-01-02 Sanyo Electric Co., Ltd. Electrolyzing electrode and production method therefor and electrolysis method using electrolyzing electrode and electrolysis solution producing device
JP4873695B2 (ja) * 2006-04-14 2012-02-08 ダイソー株式会社 電着塗装用膜付き中空電極
JP5345155B2 (ja) * 2008-12-26 2013-11-20 日本パーカライジング株式会社 金属の電解セラミックスコーティング方法、金属の電解セラミックスコーティング用電解液および金属材料
DE102013202143A1 (de) 2013-02-08 2014-08-14 Bayer Materialscience Ag Katalysatorbeschichtung und Verfahren zu ihrer Herstellung
TWI595119B (zh) 2016-08-17 2017-08-11 Boardtek Electronics Corp Photocatalyst and its anode
CN107369829A (zh) * 2017-06-30 2017-11-21 陕西科技大学 一种锂离子电池用毛丹状氧化铌电极材料的制备方法

Also Published As

Publication number Publication date
WO2020025351A1 (en) 2020-02-06
JP7426984B2 (ja) 2024-02-02
CN112513340A (zh) 2021-03-16
IT201800007835A1 (it) 2020-02-03
PH12021550107A1 (en) 2021-09-27
CA3105586A1 (en) 2020-02-06
US20210269931A1 (en) 2021-09-02
EP3830319A1 (en) 2021-06-09
KR20210035897A (ko) 2021-04-01
AU2019316092A1 (en) 2021-01-28
TW202010876A (zh) 2020-03-16
JP2021533257A (ja) 2021-12-02
TWI802731B (zh) 2023-05-21
BR112021001637A2 (pt) 2021-05-04

Similar Documents

Publication Publication Date Title
PT3575434T (pt) Produto de aço com revestimento metálico
EP3575433A4 (en) PLATED STEEL MATERIAL
SG11202104479WA (en) Electrodeposition of nanotwinned copper structures
SG11202104746XA (en) Corrosion resistant carbon coatings
PL3791003T3 (pl) Stopy tytanu o wysokiej wytrzymałości
RS62127B1 (sr) Postupak galvanizacije neprevučene čelične trake sa slojem za oblaganje
PT3356579T (pt) Banho de galvanoplastia para deposição eletroquímica de uma camada de liga de cu-sn-zn-pd, método para a deposição eletroquímica da referida camada de liga, substrato que compreende a referida camada de liga e utilizações do substrato revestido
SG11202013166YA (en) Electrolyte for the cyanide-free deposition of silver
EP3178968A4 (en) Copper-nickel alloy electroplating bath
ZA202109108B (en) Metallic can lid
ZA202100266B (en) An assembly of at least 2 metallic substrates
SG11202012983PA (en) Electrode for the electroplating or electrodeposition of a metal
PT3741701T (pt) Processo para o fabrico de uma tampa metálica da lata
GB202215736D0 (en) Improved electrodeposition
IL281952A (en) A hard metal with a microstructure that increases rigidity
ZA202100379B (en) An assembly of at least 2 metallic substrates
SG11202004564XA (en) Enhanced nickel plating process
GB201813911D0 (en) A new type of metal plating device
GB202004279D0 (en) Metal Battery
GB202305650D0 (en) Electroplating solutions
PL3712302T3 (pl) Skład do niklowania elektrolitycznego i sposób niklowania elektrolitycznego z użyciem takiego składu
CA192120S (en) Electrolytic generator
HK1244852A1 (zh) 用於有色金屬的電沉積的電極結構
SG11202106964WA (en) Integrated epitaxial metal electrodes
PL3659458T3 (pl) Oczko metalowe