SG11202008943VA - Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication - Google Patents

Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication

Info

Publication number
SG11202008943VA
SG11202008943VA SG11202008943VA SG11202008943VA SG11202008943VA SG 11202008943V A SG11202008943V A SG 11202008943VA SG 11202008943V A SG11202008943V A SG 11202008943VA SG 11202008943V A SG11202008943V A SG 11202008943VA SG 11202008943V A SG11202008943V A SG 11202008943VA
Authority
SG
Singapore
Prior art keywords
wafer
auto
correlation
generation
semiconductor device
Prior art date
Application number
SG11202008943VA
Other languages
English (en)
Inventor
Shivam Agarwal
Hariharasudhan Koteeswaran
Priyank Jain
Suvi Murugan
Yuan Zhong
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11202008943VA publication Critical patent/SG11202008943VA/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Artificial Intelligence (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11202008943VA 2018-03-28 2019-03-26 Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication SG11202008943VA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
IN201841011799 2018-03-28
US201862728712P 2018-09-07 2018-09-07
US16/254,951 US11454949B2 (en) 2018-03-28 2019-01-23 Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication
PCT/US2019/024156 WO2019191152A1 (en) 2018-03-28 2019-03-26 Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication

Publications (1)

Publication Number Publication Date
SG11202008943VA true SG11202008943VA (en) 2020-10-29

Family

ID=68054296

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008943VA SG11202008943VA (en) 2018-03-28 2019-03-26 Auto-correlation of wafer characterization data and generation of composite wafer metrics during semiconductor device fabrication

Country Status (8)

Country Link
US (1) US11454949B2 (ja)
JP (1) JP7366920B2 (ja)
KR (1) KR20200127047A (ja)
CN (1) CN111868904B (ja)
IL (1) IL277400B2 (ja)
SG (1) SG11202008943VA (ja)
TW (1) TW201946099A (ja)
WO (1) WO2019191152A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10585419B1 (en) * 2016-04-27 2020-03-10 Beneficial Machine Tools Llc Methods and devices for performing in-situ inspections during a computer assisted setup of a machine tool table
DE102019216267A1 (de) * 2019-10-23 2021-04-29 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
US11847127B2 (en) * 2021-05-12 2023-12-19 Toyota Research Institute, Inc. Device and method for discovering causal patterns
US11653003B2 (en) * 2021-07-16 2023-05-16 City University Of Hong Kong System and method for processing a stream of images

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240866A (en) * 1992-02-03 1993-08-31 At&T Bell Laboratories Method for characterizing failed circuits on semiconductor wafers
US6442445B1 (en) 1999-03-19 2002-08-27 International Business Machines Corporation, User configurable multivariate time series reduction tool control method
US7760929B2 (en) * 2005-05-13 2010-07-20 Applied Materials, Inc. Grouping systematic defects with feedback from electrical inspection
JP2014150170A (ja) 2013-02-01 2014-08-21 Renesas Electronics Corp 電気特性測定装置および方法
CN104766808B (zh) * 2014-01-07 2017-04-26 无锡华润上华半导体有限公司 晶圆缺陷密度获得方法、测试方法及半导体装置形成方法
US9087176B1 (en) 2014-03-06 2015-07-21 Kla-Tencor Corporation Statistical overlay error prediction for feed forward and feedback correction of overlay errors, root cause analysis and process control
US10576603B2 (en) 2014-04-22 2020-03-03 Kla-Tencor Corporation Patterned wafer geometry measurements for semiconductor process controls
WO2016086138A1 (en) * 2014-11-25 2016-06-02 Stream Mosaic, Inc. Improved process control techniques for semiconductor manufacturing processes
US9558545B2 (en) * 2014-12-03 2017-01-31 Kla-Tencor Corporation Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometry
US9779202B2 (en) * 2015-06-22 2017-10-03 Kla-Tencor Corporation Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements
US9824852B2 (en) * 2015-12-31 2017-11-21 Applied Materials Israel Ltd CD-SEM technique for wafers fabrication control
US10503850B2 (en) * 2016-11-22 2019-12-10 Tokyo Electron Limited Generation of a map of a substrate using iterative calculations of non-measured attribute data
US10957608B2 (en) * 2017-04-28 2021-03-23 Kla-Tencor Corporation Guided scanning electron microscopy metrology based on wafer topography

Also Published As

Publication number Publication date
TW201946099A (zh) 2019-12-01
KR20200127047A (ko) 2020-11-09
JP7366920B2 (ja) 2023-10-23
WO2019191152A1 (en) 2019-10-03
IL277400A (en) 2020-11-30
IL277400B1 (en) 2024-02-01
US20190302734A1 (en) 2019-10-03
JP2021519518A (ja) 2021-08-10
IL277400B2 (en) 2024-06-01
CN111868904B (zh) 2024-06-11
CN111868904A (zh) 2020-10-30
US11454949B2 (en) 2022-09-27

Similar Documents

Publication Publication Date Title
IL277400A (en) Automatic coordination of chunk characterization data and production of composite chunk gauges during semiconductor device manufacturing
SG10202007030PA (en) Semiconductor Memory Devices And Methods Of Operating The Semiconductor Memory Devices
TWI800665B (zh) 半導體晶圓的加工方法
SG10201907458SA (en) Semiconductor device and method of manufacturing the same
SG11202111703YA (en) Methods of semiconductor device fabrication
JP2017146968A5 (ja) 半導体装置、電子機器、半導体ウェハ
SG10201904480SA (en) Semiconductor chips and methods of manufacturing the same
SG10201905833RA (en) Semiconductor device and manufacturing method of the semiconductor device
EP3734666C0 (en) SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD THEREOF
SG11202001663XA (en) Method and apparatus for cleaning semiconductor wafer
SG10201907013YA (en) Semiconductor Device And Method Of Manufacturing The Same
SG11201808637XA (en) Methods and apparatus for cleaning semiconductor wafers
TWI799651B (zh) 半導體矽晶圓之清洗處理裝置及清洗方法
SG11202012288PA (en) Semiconductor device and method of manufacturing same
SG11202010143VA (en) Semiconductor wafer mass metrology apparatus and semiconductor wafer mass metrology method
SG10202003386QA (en) Semiconductor Memory Devices And Methods Of Operating Semiconductor Memory Devices
GB201910234D0 (en) Semiconductor etching methods
SG11202109419WA (en) Dry etching method, method for manufacturing semiconductor device, and etching device
SG11202011718XA (en) Apparatus and method for cleaning semiconductor wafers
SG10201503181VA (en) Semiconductor Wafer Composed Of Silicon And Method For Producing Same
SG11202109169TA (en) Dry etching method and method for producing semiconductor device
SG11202109726TA (en) Semiconductor wafer and method of manufacturing semiconductor apparatus
JP2017139047A5 (ja) データのリフレッシュの方法、半導体ウェハ、電子機器
SG11202001755PA (en) Method for evaluating silicon wafer and method for manufacturing silicon wafer
SG10202010251PA (en) Semiconductor memory device and method of operating the same