SG11202006512TA - Rotational indexer with additional rotational axes - Google Patents

Rotational indexer with additional rotational axes

Info

Publication number
SG11202006512TA
SG11202006512TA SG11202006512TA SG11202006512TA SG11202006512TA SG 11202006512T A SG11202006512T A SG 11202006512TA SG 11202006512T A SG11202006512T A SG 11202006512TA SG 11202006512T A SG11202006512T A SG 11202006512TA SG 11202006512T A SG11202006512T A SG 11202006512TA
Authority
SG
Singapore
Prior art keywords
rotational
indexer
additional
axes
rotational axes
Prior art date
Application number
SG11202006512TA
Other languages
English (en)
Inventor
Richard M Blank
Karl F Leeser
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG11202006512TA publication Critical patent/SG11202006512TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
SG11202006512TA 2018-01-10 2019-01-10 Rotational indexer with additional rotational axes SG11202006512TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/867,599 US10109517B1 (en) 2018-01-10 2018-01-10 Rotational indexer with additional rotational axes
PCT/US2019/013000 WO2019140057A1 (en) 2018-01-10 2019-01-10 Rotational indexer with additional rotational axes

Publications (1)

Publication Number Publication Date
SG11202006512TA true SG11202006512TA (en) 2020-08-28

Family

ID=63833290

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202006512TA SG11202006512TA (en) 2018-01-10 2019-01-10 Rotational indexer with additional rotational axes

Country Status (7)

Country Link
US (3) US10109517B1 (ko)
EP (1) EP3738142B1 (ko)
JP (3) JP7096540B2 (ko)
KR (3) KR20240046277A (ko)
CN (1) CN111566796A (ko)
SG (1) SG11202006512TA (ko)
WO (1) WO2019140057A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10851457B2 (en) 2017-08-31 2020-12-01 Lam Research Corporation PECVD deposition system for deposition on selective side of the substrate
US10109517B1 (en) 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
US10796940B2 (en) 2018-11-05 2020-10-06 Lam Research Corporation Enhanced automatic wafer centering system and techniques for same
EP3672040A1 (en) * 2018-12-17 2020-06-24 Nexperia B.V. Device for enabling a rotating and translating movement by means of a single motor; apparatus and system comprising such a device
JP2022540607A (ja) 2019-07-12 2022-09-16 アプライド マテリアルズ インコーポレイテッド 同時基板移送用ロボット
US11443973B2 (en) * 2019-07-12 2022-09-13 Applied Materials, Inc. Robot for simultaneous substrate transfer
US11574826B2 (en) * 2019-07-12 2023-02-07 Applied Materials, Inc. High-density substrate processing systems and methods
KR102696424B1 (ko) 2019-07-12 2024-08-16 어플라이드 머티어리얼스, 인코포레이티드 동시 기판 이송을 위한 로봇
US11117265B2 (en) 2019-07-12 2021-09-14 Applied Materials, Inc. Robot for simultaneous substrate transfer
CN114207798A (zh) * 2019-08-08 2022-03-18 朗姆研究公司 多站处理模块中用于晶片传送的主轴组件
KR102697639B1 (ko) 2019-08-16 2024-08-22 램 리써치 코포레이션 웨이퍼 내에서 차동 보우를 보상하기 위한 공간적으로 튜닝 가능한 증착
TW202117067A (zh) 2019-09-19 2021-05-01 美商應用材料股份有限公司 用於改善均勻性的抖動或動態偏移
CN113314447B (zh) * 2021-02-01 2024-04-02 中科晶源微电子技术（北京）有限公司 晶片转移装置、腔体装置、晶片处理设备
JP2024519460A (ja) * 2021-04-27 2024-05-14 ラム リサーチ コーポレーション ウエハセンタリング機能を備えた回転インデクサ
KR20230080046A (ko) 2021-11-29 2023-06-07 주식회사 원익아이피에스 기판처리장치
JP7399933B2 (ja) * 2021-12-22 2023-12-18 株式会社Kokusai Electric 基板処理装置、基板処理方法、半導体製造方法、プログラム
CN114695227B (zh) * 2022-03-29 2023-02-03 苏州矽行半导体技术有限公司 一种载台系统及采用该载台系统的晶圆驱动方法

Family Cites Families (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727686A (en) * 1980-07-21 1982-02-15 Hitachi Ltd Industrial articular robot
US4921395A (en) * 1982-04-16 1990-05-01 Sahlin International, Inc. Apparatus for loading and/or unloading industrial presses
FR2527967B1 (fr) * 1982-06-07 1985-07-19 Merlin Gerin Robot industriel perfectionne pilote par un automate programmable
US4551058A (en) * 1983-07-20 1985-11-05 Robotics, Inc. Low cost articulating/articulating and rotating wrist mechanism for automatic machine tool and automatic machine tool employing the same
US4629860A (en) * 1984-10-30 1986-12-16 Lindbom Torsten H Robotic apparatus and method for automatically moving a tool through three dimensions and manually to an extended position
US4787813A (en) * 1987-08-26 1988-11-29 Watkins-Johnson Company Industrial robot for use in clean room environment
JPH0734928Y2 (ja) * 1988-07-19 1995-08-09 日新電機株式会社 処理物保持装置
IT1241621B (it) * 1990-10-04 1994-01-25 Comau Spa Robot articolato
KR0145258B1 (ko) * 1993-11-16 1998-08-17 모리시타 요이찌 전자부품의 본딩장치
DE19514037C2 (de) * 1995-04-13 1997-09-04 Leybold Ag Transportvorrichtung
US5804507A (en) * 1995-10-27 1998-09-08 Applied Materials, Inc. Radially oscillating carousel processing system for chemical mechanical polishing
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5795448A (en) * 1995-12-08 1998-08-18 Sony Corporation Magnetic device for rotating a substrate
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
US5855465A (en) * 1996-04-16 1999-01-05 Gasonics International Semiconductor wafer processing carousel
US6126381A (en) 1997-04-01 2000-10-03 Kensington Laboratories, Inc. Unitary specimen prealigner and continuously rotatable four link robot arm mechanism
US5951770A (en) 1997-06-04 1999-09-14 Applied Materials, Inc. Carousel wafer transfer system
US6318957B1 (en) * 1998-07-10 2001-11-20 Asm America, Inc. Method for handling of wafers with minimal contact
JP2000042953A (ja) * 1998-07-29 2000-02-15 Janome Sewing Mach Co Ltd 水平多関節ロボット
US6143082A (en) * 1998-10-08 2000-11-07 Novellus Systems, Inc. Isolation of incompatible processes in a multi-station processing chamber
JP3652211B2 (ja) 2000-04-07 2005-05-25 川崎重工業株式会社 搬送装置
US6570356B2 (en) * 2000-04-07 2003-05-27 Kawasaki Jukogyo Kabushiki Kaisha Robot system
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
US6860965B1 (en) 2000-06-23 2005-03-01 Novellus Systems, Inc. High throughput architecture for semiconductor processing
US20020098072A1 (en) * 2001-01-19 2002-07-25 Applied Materials, Inc. Dual bladed robot apparatus and associated method
US6949466B2 (en) * 2001-09-18 2005-09-27 Oriol Inc. CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
US7189647B2 (en) 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
US6827789B2 (en) * 2002-07-01 2004-12-07 Semigear, Inc. Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry
KR100512179B1 (ko) * 2003-06-19 2005-09-02 삼성전자주식회사 반도체 소자를 제조하기 위한 화학적 기계적 연마장치
JP4951201B2 (ja) * 2004-08-24 2012-06-13 株式会社Ｓｅｎ ビーム照射方法およびビーム照射装置
US8137465B1 (en) * 2005-04-26 2012-03-20 Novellus Systems, Inc. Single-chamber sequential curing of semiconductor wafers
CN100358097C (zh) * 2005-08-05 2007-12-26 中微半导体设备(上海)有限公司 半导体工艺处理系统及其处理方法
CN100362620C (zh) * 2005-08-11 2008-01-16 中微半导体设备(上海)有限公司 半导体工艺件装卸装置及其装载和卸载方法
US7374525B2 (en) * 2006-01-25 2008-05-20 Protedyne Corporation SCARA-type robotic system
JP2007242648A (ja) * 2006-03-04 2007-09-20 Masato Toshima 基板の処理装置
US20070261726A1 (en) * 2006-05-11 2007-11-15 Rye Jason A Multiple workpiece processor
US7166016B1 (en) * 2006-05-18 2007-01-23 Applied Materials, Inc. Six headed carousel
US8137162B2 (en) * 2007-07-25 2012-03-20 Edmond Arzuman Abrahamians Semiconductor wafer polishing machine
US8069322B2 (en) * 2008-08-15 2011-11-29 International Business Machines Corporation Active-active remote configuration of a storage system
US9050623B1 (en) * 2008-09-12 2015-06-09 Novellus Systems, Inc. Progressive UV cure
KR101235539B1 (ko) * 2009-04-28 2013-02-21 페로텍 (유에스에이) 코포레이션 기상 증착 장치, 리프트오프 증착 장치 및 그 방법
US8397785B2 (en) * 2009-11-17 2013-03-19 Asm Assembly Automation Ltd Transfer apparatus for multiple adhesives
WO2011080897A1 (ja) * 2009-12-28 2011-07-07 株式会社アルバック 駆動装置及び搬送装置
JP5606279B2 (ja) * 2010-11-08 2014-10-15 株式会社ダイヘン 搬送装置
TWI552824B (zh) * 2011-10-18 2016-10-11 千住金屬工業股份有限公司 焊料凸塊形成方法及裝置
US8961099B2 (en) 2012-01-13 2015-02-24 Novellus Systems, Inc. Dual arm vacuum robot with common drive pulley
US20130210238A1 (en) 2012-01-31 2013-08-15 Joseph Yudovsky Multi-Injector Spatial ALD Carousel and Methods of Use
US9190307B2 (en) * 2012-02-16 2015-11-17 Asm Technology Singapore Pte Ltd Apparatus for transferring a solar wafer or solar cell during its fabrication
US9966298B2 (en) * 2013-08-27 2018-05-08 Cleaning Technologies Group, Llc Multiple-stage processing devices
US9190907B2 (en) 2013-08-29 2015-11-17 Intersil Americas LLC System and method of equivalent series inductance cancellation
US9522790B2 (en) * 2013-09-20 2016-12-20 Morrison Timing Screw Co. Rotary orienter
US9299598B2 (en) 2013-12-23 2016-03-29 Lam Research Corp. Robot with integrated aligner
US9511348B2 (en) 2014-01-07 2016-12-06 University Of South Florida Functionalized porous organic polymers for olefin/paraffin separations
US9778561B2 (en) 2014-01-31 2017-10-03 Lam Research Corporation Vacuum-integrated hardmask processes and apparatus
US9797042B2 (en) * 2014-05-15 2017-10-24 Lam Research Corporation Single ALD cycle thickness control in multi-station substrate deposition systems
JPWO2016035837A1 (ja) * 2014-09-03 2017-04-27 株式会社アルバック 搬送装置及び真空装置
JP6330623B2 (ja) * 2014-10-31 2018-05-30 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6330630B2 (ja) 2014-11-13 2018-05-30 東京エレクトロン株式会社 成膜装置
JP2017513036A (ja) * 2014-11-14 2017-05-25 マッパー・リソグラフィー・アイピー・ビー．ブイ． 貨物固定システムおよびリソグラフィシステム内で基板を移送するための方法
US20170076972A1 (en) * 2015-09-15 2017-03-16 Veeco Instruments Inc. Planetary wafer carriers
WO2018004646A1 (en) 2016-07-01 2018-01-04 Intel Corporation Metal oxide resist materials
CN106409739B (zh) * 2016-09-29 2019-12-06 中国电子科技集团公司第四十八研究所 一种晶片真空自动传输系统及传输方法
RU2719226C1 (ru) * 2016-12-06 2020-04-17 Тмт Тэппинг-Межеринг-Текнолоджи Сарль Манипулятор для поворачивания манипулируемого объекта
KR102030056B1 (ko) 2017-05-02 2019-11-11 세메스 주식회사 챔버 세정 방법, 기판 처리 방법, 그리고 기판 처리 장치
US10109517B1 (en) 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
CN108217166B (zh) * 2018-01-15 2021-01-08 京东方科技集团股份有限公司 一种uv固化传送方法和系统
US20210013034A1 (en) 2018-05-11 2021-01-14 Lam Research Corporation Methods for making euv patternable hard masks
US20200326627A1 (en) 2019-04-12 2020-10-15 Inpria Corporation Organometallic photoresist developer compositions and processing methods
KR102696424B1 (ko) * 2019-07-12 2024-08-16 어플라이드 머티어리얼스, 인코포레이티드 동시 기판 이송을 위한 로봇

Also Published As

Publication number Publication date
EP3738142A4 (en) 2021-09-15
WO2019140057A1 (en) 2019-07-18
US20230063281A1 (en) 2023-03-02
EP3738142A1 (en) 2020-11-18
JP2022123004A (ja) 2022-08-23
US11482436B2 (en) 2022-10-25
KR102110726B1 (ko) 2020-06-09
JP7096540B2 (ja) 2022-07-06
US20210118715A1 (en) 2021-04-22
JP2021510237A (ja) 2021-04-15
JP2023123665A (ja) 2023-09-05
KR102652423B1 (ko) 2024-03-27
US10109517B1 (en) 2018-10-23
EP3738142B1 (en) 2024-09-11
KR20190086657A (ko) 2019-07-23
KR20200099124A (ko) 2020-08-21
CN111566796A (zh) 2020-08-21
US11699610B2 (en) 2023-07-11
JP7303926B2 (ja) 2023-07-05
KR20240046277A (ko) 2024-04-08

Similar Documents

Publication Publication Date Title
SG11202006512TA (en) Rotational indexer with additional rotational axes
GB201807286D0 (en) New use
EP3579794A4 (en) MAXILLO-MANDIBULAR FIXATION DEVICES
GB201901651D0 (en) The geness project
AU201813307S (en) Lighthead
GB201901639D0 (en) The blockworld project
EP3581049A4 (en) GLOVE STRUCTURE
EP3857552A4 (en) BACKUP-RESTORE CIRCUITS WITH METAL-FERROELECTRIC-METAL DEVICES
EP3813581A4 (en) COATED GLOVES WITH GRIP ELEMENTS
EP3545765A4 (en) USE OF AGRIMONIA PILOSA
EP3713465A4 (en) MULTIFUNCTIONAL BASE
ZA202100322B (en) Polytunnel structure
GB202018462D0 (en) Earlpugs with cord
GB201902311D0 (en) The nautica project
GB201807046D0 (en) Combination
GB201820652D0 (en) Rotational advantage
GB2572342B (en) Torque Increaser
GB2576916B (en) Polytunnel structure
GB2575634B (en) Polytunnel structure
EP3790842C0 (de) Solarer receiver-reaktor
GB201902722D0 (en) The Krishi project
GB201808686D0 (en) The dogtooth
GB201818676D0 (en) Polytunnel structure
GB201800634D0 (en) The Tasteaire
GB201814429D0 (en) Cornetioes etc