SG11202005846XA - Liquid chemical for forming water repellent protective film and surface treatment method for wafers - Google Patents

Liquid chemical for forming water repellent protective film and surface treatment method for wafers

Info

Publication number
SG11202005846XA
SG11202005846XA SG11202005846XA SG11202005846XA SG11202005846XA SG 11202005846X A SG11202005846X A SG 11202005846XA SG 11202005846X A SG11202005846X A SG 11202005846XA SG 11202005846X A SG11202005846X A SG 11202005846XA SG 11202005846X A SG11202005846X A SG 11202005846XA
Authority
SG
Singapore
Prior art keywords
wafers
protective film
surface treatment
treatment method
water repellent
Prior art date
Application number
SG11202005846XA
Other languages
English (en)
Inventor
Yuki Fukui
Yoshiharu Terui
Shuhei Yamada
Yuzo Okumura
Soichi Kumon
Saori Shiota
Katsuya Kondo
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Priority claimed from PCT/JP2018/047754 external-priority patent/WO2019138870A1/ja
Publication of SG11202005846XA publication Critical patent/SG11202005846XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/18—Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16—Antifouling paints; Underwater paints
    • C09D5/1606—Antifouling paints; Underwater paints characterised by the anti-fouling agent
    • C09D5/1612—Non-macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11202005846XA 2018-01-15 2018-12-26 Liquid chemical for forming water repellent protective film and surface treatment method for wafers SG11202005846XA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018003977 2018-01-15
JP2018231703A JP7277700B2 (ja) 2018-01-15 2018-12-11 撥水性保護膜形成用薬液、及びウェハの表面処理方法
PCT/JP2018/047754 WO2019138870A1 (ja) 2018-01-15 2018-12-26 撥水性保護膜形成用薬液、及びウェハの表面処理方法

Publications (1)

Publication Number Publication Date
SG11202005846XA true SG11202005846XA (en) 2020-07-29

Family

ID=67398155

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005846XA SG11202005846XA (en) 2018-01-15 2018-12-26 Liquid chemical for forming water repellent protective film and surface treatment method for wafers

Country Status (5)

Country Link
JP (1) JP7277700B2 (ja)
KR (1) KR102465276B1 (ja)
CN (1) CN111630633B (ja)
SG (1) SG11202005846XA (ja)
TW (1) TWI707030B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115110094A (zh) * 2021-03-18 2022-09-27 江苏筑磊电子科技有限公司 一缩二丙二醇在火灾后金属表面处理的方法
WO2023199824A1 (ja) * 2022-04-11 2023-10-19 セントラル硝子株式会社 表面処理組成物、およびウェハの製造方法
WO2024070526A1 (ja) * 2022-09-30 2024-04-04 富士フイルム株式会社 薬液、修飾基板の製造方法、積層体の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821844B2 (ja) 1975-04-03 1983-05-04 日本電気株式会社 マイクロハタダンフイルタ
US6824879B2 (en) * 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
US9228120B2 (en) * 2010-06-07 2016-01-05 Central Glass Company, Limited Liquid chemical for forming protecting film
WO2011155407A1 (ja) * 2010-06-07 2011-12-15 セントラル硝子株式会社 保護膜形成用薬液
JP2012015335A (ja) * 2010-06-30 2012-01-19 Central Glass Co Ltd 保護膜形成用薬液、および、ウェハ表面の洗浄方法
WO2012002200A1 (ja) * 2010-06-30 2012-01-05 セントラル硝子株式会社 ウェハの洗浄方法
JP2013118347A (ja) * 2010-12-28 2013-06-13 Central Glass Co Ltd ウェハの洗浄方法
JP2013104954A (ja) * 2011-11-11 2013-05-30 Central Glass Co Ltd ウェハの表面処理方法及び表面処理液
JP2017168828A (ja) * 2016-03-15 2017-09-21 セントラル硝子株式会社 撥水性保護膜形成用薬液

Also Published As

Publication number Publication date
JP7277700B2 (ja) 2023-05-19
KR20200108887A (ko) 2020-09-21
CN111630633A (zh) 2020-09-04
KR102465276B1 (ko) 2022-11-10
TW201932575A (zh) 2019-08-16
CN111630633B (zh) 2023-09-19
JP2019123860A (ja) 2019-07-25
TWI707030B (zh) 2020-10-11

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