SG11202005387XA - Photoresist remover compositions - Google Patents

Photoresist remover compositions

Info

Publication number
SG11202005387XA
SG11202005387XA SG11202005387XA SG11202005387XA SG11202005387XA SG 11202005387X A SG11202005387X A SG 11202005387XA SG 11202005387X A SG11202005387X A SG 11202005387XA SG 11202005387X A SG11202005387X A SG 11202005387XA SG 11202005387X A SG11202005387X A SG 11202005387XA
Authority
SG
Singapore
Prior art keywords
photoresist remover
remover compositions
compositions
photoresist
remover
Prior art date
Application number
SG11202005387XA
Other languages
English (en)
Inventor
Hengpeng Wu
Original Assignee
Merck Patent Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh filed Critical Merck Patent Gmbh
Publication of SG11202005387XA publication Critical patent/SG11202005387XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11202005387XA 2018-02-14 2018-10-31 Photoresist remover compositions SG11202005387XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862630470P 2018-02-14 2018-02-14
PCT/EP2018/079848 WO2019158234A1 (en) 2018-02-14 2018-10-31 Photoresist remover compositions

Publications (1)

Publication Number Publication Date
SG11202005387XA true SG11202005387XA (en) 2020-07-29

Family

ID=64500320

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202005387XA SG11202005387XA (en) 2018-02-14 2018-10-31 Photoresist remover compositions

Country Status (8)

Country Link
US (1) US11168288B2 (ja)
EP (1) EP3752887B1 (ja)
JP (1) JP7204760B2 (ja)
KR (1) KR102349076B1 (ja)
CN (1) CN110383179B (ja)
SG (1) SG11202005387XA (ja)
TW (1) TWI768144B (ja)
WO (1) WO2019158234A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202005387XA (en) 2018-02-14 2020-07-29 Merck Patent Gmbh Photoresist remover compositions
JP7172771B2 (ja) * 2019-03-18 2022-11-16 荒川化学工業株式会社 洗浄剤組成物用原液、及び該洗浄剤組成物用原液を含む洗浄剤組成物

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6060439A (en) 1997-09-29 2000-05-09 Kyzen Corporation Cleaning compositions and methods for cleaning resin and polymeric materials used in manufacture
EP1160313A1 (en) * 2000-06-02 2001-12-05 The Procter & Gamble Company Cleaning composition and device for electronic equipment
CN100338530C (zh) * 2001-11-02 2007-09-19 三菱瓦斯化学株式会社 剥离抗蚀剂的方法
KR101017738B1 (ko) * 2002-03-12 2011-02-28 미츠비시 가스 가가쿠 가부시키가이샤 포토레지스트 박리제 조성물 및 세정 조성물
JP4085262B2 (ja) * 2003-01-09 2008-05-14 三菱瓦斯化学株式会社 レジスト剥離剤
US6951710B2 (en) * 2003-05-23 2005-10-04 Air Products And Chemicals, Inc. Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof
SG118380A1 (en) * 2004-06-15 2006-01-27 Air Prod & Chem Composition and method comprising same for removing residue from a substrate
KR101088568B1 (ko) * 2005-04-19 2011-12-05 아반토르 퍼포먼스 머티리얼스, 인크. 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼
US7601482B2 (en) 2006-03-28 2009-10-13 Az Electronic Materials Usa Corp. Negative photoresist compositions
KR101488265B1 (ko) * 2007-09-28 2015-02-02 삼성디스플레이 주식회사 박리 조성물 및 박리 방법
CN101614971B (zh) * 2008-06-27 2013-06-12 安集微电子（上海）有限公司 一种光刻胶清洗剂
WO2011012559A2 (en) 2009-07-30 2011-02-03 Basf Se Post ion implant stripper for advanced semiconductor application
JP6233779B2 (ja) * 2013-11-18 2017-11-22 富士フイルム株式会社 変性レジストの剥離方法、これに用いる変性レジストの剥離液および半導体基板製品の製造方法
US10301580B2 (en) * 2014-12-30 2019-05-28 Versum Materials Us, Llc Stripping compositions having high WN/W etching selectivity
TWI690780B (zh) * 2014-12-30 2020-04-11 美商富士軟片電子材料美國股份有限公司 用於自半導體基板去除光阻之剝離組成物
CN108473801B (zh) * 2016-05-10 2019-11-26 德国艾托特克公司 非水性剥离组合物及从衬底剥离有机涂层的方法
CN109195720B (zh) * 2016-05-23 2021-10-29 富士胶片电子材料美国有限公司 用于从半导体基板去除光刻胶的剥离组合物
KR102111307B1 (ko) * 2016-06-02 2020-05-15 후지필름 가부시키가이샤 처리액, 기판의 세정 방법 및 레지스트의 제거 방법
TWI692679B (zh) * 2017-12-22 2020-05-01 美商慧盛材料美國責任有限公司 光阻剝除劑
SG11202005387XA (en) 2018-02-14 2020-07-29 Merck Patent Gmbh Photoresist remover compositions
US11460778B2 (en) * 2018-04-12 2022-10-04 Versum Materials Us, Llc Photoresist stripper

Also Published As

Publication number Publication date
TW201937311A (zh) 2019-09-16
TWI768144B (zh) 2022-06-21
US20210071120A1 (en) 2021-03-11
JP7204760B2 (ja) 2023-01-16
WO2019158234A1 (en) 2019-08-22
EP3752887A1 (en) 2020-12-23
EP3752887B1 (en) 2022-04-13
KR20200119801A (ko) 2020-10-20
US11168288B2 (en) 2021-11-09
JP2021513583A (ja) 2021-05-27
CN110383179A (zh) 2019-10-25
CN110383179B (zh) 2021-10-29
KR102349076B1 (ko) 2022-01-10

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