SG11202004067UA - Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications - Google Patents
Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applicationsInfo
- Publication number
- SG11202004067UA SG11202004067UA SG11202004067UA SG11202004067UA SG11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA SG 11202004067U A SG11202004067U A SG 11202004067UA
- Authority
- SG
- Singapore
- Prior art keywords
- low
- high reliability
- solder alloy
- tin based
- silver tin
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title 2
- 239000000956 alloy Substances 0.000 title 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title 1
- 229910052709 silver Inorganic materials 0.000 title 1
- 239000004332 silver Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762583934P | 2017-11-09 | 2017-11-09 | |
| US16/022,337 US11577343B2 (en) | 2017-11-09 | 2018-06-28 | Low-silver alternative to standard SAC alloys for high reliability applications |
| PCT/US2018/058463 WO2019094242A1 (en) | 2017-11-09 | 2018-10-31 | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202004067UA true SG11202004067UA (en) | 2020-05-28 |
Family
ID=66326662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202004067UA SG11202004067UA (en) | 2017-11-09 | 2018-10-31 | Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications |
Country Status (9)
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102187085B1 (ko) * | 2019-01-24 | 2020-12-04 | 주식회사 경동엠텍 | 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법 |
| TWI814081B (zh) | 2019-09-02 | 2023-09-01 | 美商阿爾發金屬化工公司 | 高溫超高可靠性合金、其製造方法及其應用 |
| WO2024034689A1 (ja) * | 2022-08-12 | 2024-02-15 | 千住金属工業株式会社 | はんだ合金、はんだペースト及びはんだ継手 |
| CN117798544B (zh) * | 2023-11-10 | 2024-09-20 | 苏州优诺电子材料科技有限公司 | 一种高强抗热疲劳无铅焊料合金及其制备方法 |
| WO2025131329A1 (en) | 2023-12-20 | 2025-06-26 | Alpha Assembly Solutions Inc. | Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy resin, and electronic device |
| CN119525811B (zh) * | 2025-01-20 | 2025-04-08 | 深圳市唯特偶新材料股份有限公司 | 一种防枝晶高可靠锡膏及其制备方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6176947B1 (en) | 1998-12-31 | 2001-01-23 | H-Technologies Group, Incorporated | Lead-free solders |
| SG98429A1 (en) * | 1999-10-12 | 2003-09-19 | Singapore Asahi Chemical & Solder Ind Pte Ltd | Lead-free solders |
| JP3599101B2 (ja) * | 2000-12-11 | 2004-12-08 | 株式会社トッパンＮｅｃサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
| US8216395B2 (en) * | 2001-06-28 | 2012-07-10 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| JP2004141910A (ja) * | 2002-10-23 | 2004-05-20 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
| GB2419137A (en) * | 2004-10-15 | 2006-04-19 | Alpha Fry Ltd | Solder alloy |
| US8691143B2 (en) * | 2005-06-03 | 2014-04-08 | Senju Metal Industry Co., Ltd. | Lead-free solder alloy |
| CN100453244C (zh) * | 2005-12-16 | 2009-01-21 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
| EP2177304B1 (en) * | 2007-07-13 | 2016-10-26 | Senju Metal Industry Co., Ltd | Vehicle-mounted electronic circuit |
| DE202009019184U1 (de) * | 2009-08-29 | 2017-11-14 | Umicore Ag & Co. Kg | Lotlegierung |
| JP5722302B2 (ja) * | 2010-02-16 | 2015-05-20 | 株式会社タムラ製作所 | 鉛フリーはんだ合金と、これを用いたソルダペースト及び実装品 |
| JP2011251310A (ja) | 2010-06-02 | 2011-12-15 | Nippon Genma:Kk | 鉛フリーはんだ合金 |
| JP5413926B2 (ja) * | 2010-08-18 | 2014-02-12 | 新日鉄住金マテリアルズ株式会社 | 半導体実装用半田ボール及び電子部材 |
| WO2012127642A1 (ja) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| KR101455967B1 (ko) * | 2012-06-30 | 2014-10-31 | 센주긴조쿠고교 가부시키가이샤 | 납프리 땜납 볼 |
| JP5893528B2 (ja) * | 2012-07-27 | 2016-03-23 | 新日鉄住金マテリアルズ株式会社 | 無鉛はんだバンプ接合構造 |
| KR101738007B1 (ko) | 2012-10-09 | 2017-05-29 | 알파 어셈블리 솔루션스 인크. | 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜 |
| JP2015077601A (ja) | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
| JP5730354B2 (ja) | 2013-07-17 | 2015-06-10 | ハリマ化成株式会社 | はんだ組成物、ソルダペーストおよび電子回路基板 |
| US9559543B2 (en) * | 2013-07-19 | 2017-01-31 | Apple Inc. | Adaptive effective C-rate charging of batteries |
| KR20160053838A (ko) * | 2013-09-11 | 2016-05-13 | 센주긴조쿠고교 가부시키가이샤 | 무연 땜납, 무연 땜납 볼, 이 무연 땜납을 사용한 땜납 조인트 및 이 땜납 조인트를 갖는 반도체 회로 |
| JP2016019992A (ja) | 2014-07-14 | 2016-02-04 | 株式会社日本スペリア社 | アルミニウム用はんだ及びはんだ継手 |
| JP5723056B1 (ja) * | 2014-12-15 | 2015-05-27 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| US20160279741A1 (en) | 2015-03-24 | 2016-09-29 | Tamura Corporation | Lead-free solder alloy, electronic circuit board, and electronic control device |
| WO2017018167A1 (ja) * | 2015-07-24 | 2017-02-02 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
| US10195698B2 (en) | 2015-09-03 | 2019-02-05 | AIM Metals & Alloys Inc. | Lead-free high reliability solder alloys |
| JP6402127B2 (ja) * | 2016-03-09 | 2018-10-10 | 株式会社タムラ製作所 | 電子部品の接合方法 |
| PH12018500431B1 (en) * | 2016-03-22 | 2023-07-12 | Tamura Seisakusho Kk | Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device |
| US20180102464A1 (en) * | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
-
2018
- 2018-06-28 US US16/022,337 patent/US11577343B2/en active Active
- 2018-10-31 WO PCT/US2018/058463 patent/WO2019094242A1/en unknown
- 2018-10-31 EP EP23202671.6A patent/EP4299238A3/en active Pending
- 2018-10-31 SG SG11202004067UA patent/SG11202004067UA/en unknown
- 2018-10-31 HU HUE18804799A patent/HUE065228T2/hu unknown
- 2018-10-31 KR KR1020207015369A patent/KR102667732B1/ko active Active
- 2018-10-31 EP EP18804799.7A patent/EP3707285B1/en active Active
- 2018-10-31 JP JP2020544348A patent/JP2021502259A/ja active Pending
- 2018-10-31 CN CN201880072408.6A patent/CN111542624A/zh active Pending
- 2018-11-08 TW TW107139607A patent/TWI782134B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3707285B1 (en) | 2023-11-29 |
| TWI782134B (zh) | 2022-11-01 |
| CN111542624A (zh) | 2020-08-14 |
| KR102667732B1 (ko) | 2024-05-20 |
| US11577343B2 (en) | 2023-02-14 |
| TW201923103A (zh) | 2019-06-16 |
| US20190134758A1 (en) | 2019-05-09 |
| WO2019094242A1 (en) | 2019-05-16 |
| KR20200089273A (ko) | 2020-07-24 |
| HUE065228T2 (hu) | 2024-05-28 |
| EP4299238A3 (en) | 2024-03-27 |
| JP2021502259A (ja) | 2021-01-28 |
| EP4299238A2 (en) | 2024-01-03 |
| EP3707285A1 (en) | 2020-09-16 |
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