SG11202003861RA - Process for forming inkjet nozzle chambers - Google Patents
Process for forming inkjet nozzle chambersInfo
- Publication number
- SG11202003861RA SG11202003861RA SG11202003861RA SG11202003861RA SG11202003861RA SG 11202003861R A SG11202003861R A SG 11202003861RA SG 11202003861R A SG11202003861R A SG 11202003861RA SG 11202003861R A SG11202003861R A SG 11202003861RA SG 11202003861R A SG11202003861R A SG 11202003861RA
- Authority
- SG
- Singapore
- Prior art keywords
- inkjet nozzle
- nozzle chambers
- forming inkjet
- forming
- chambers
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/7684—Smoothing; Planarisation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762591093P | 2017-11-27 | 2017-11-27 | |
PCT/EP2018/081277 WO2019101605A1 (en) | 2017-11-27 | 2018-11-14 | Process for forming inkjet nozzle chambers |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202003861RA true SG11202003861RA (en) | 2020-05-28 |
Family
ID=64426875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202003861RA SG11202003861RA (en) | 2017-11-27 | 2018-11-14 | Process for forming inkjet nozzle chambers |
Country Status (8)
Country | Link |
---|---|
US (2) | US20190160818A1 (zh) |
EP (1) | EP3676098B1 (zh) |
JP (1) | JP7111813B2 (zh) |
CN (1) | CN111655494B (zh) |
AU (1) | AU2018371072A1 (zh) |
SG (1) | SG11202003861RA (zh) |
TW (1) | TW201924950A (zh) |
WO (1) | WO2019101605A1 (zh) |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4558333A (en) | 1981-07-09 | 1985-12-10 | Canon Kabushiki Kaisha | Liquid jet recording head |
DE69027363T2 (de) * | 1989-03-24 | 1996-11-14 | Canon Kk | Verfahren für die Herstellung von Tintenstrahl-Aufzeichnungsköpfen |
JP3143307B2 (ja) * | 1993-02-03 | 2001-03-07 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JPH08142339A (ja) * | 1994-11-16 | 1996-06-04 | Canon Inc | インクジェット記録装置における液体噴射記録ヘッドの製造方法 |
JP3368094B2 (ja) * | 1995-04-21 | 2003-01-20 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JP3343875B2 (ja) * | 1995-06-30 | 2002-11-11 | キヤノン株式会社 | インクジェットヘッドの製造方法 |
US5872058A (en) | 1997-06-17 | 1999-02-16 | Novellus Systems, Inc. | High aspect ratio gapfill process by using HDP |
JP4570178B2 (ja) * | 1998-11-26 | 2010-10-27 | 富士フイルム株式会社 | インクジェットヘッドとその製造方法、印刷装置 |
US6474795B1 (en) * | 1999-12-21 | 2002-11-05 | Eastman Kodak Company | Continuous ink jet printer with micro-valve deflection mechanism and method of controlling same |
EP1297959A1 (en) * | 2001-09-28 | 2003-04-02 | Hewlett-Packard Company | Inkjet printheads |
KR100396559B1 (ko) * | 2001-11-05 | 2003-09-02 | 삼성전자주식회사 | 일체형 잉크젯 프린트헤드의 제조 방법 |
US6755509B2 (en) | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
JP2005125577A (ja) * | 2003-10-23 | 2005-05-19 | Canon Inc | 液体噴射記録ヘッド及びその製造方法 |
JP2005186528A (ja) * | 2003-12-26 | 2005-07-14 | Canon Inc | 液体吐出ヘッドおよびその製造方法 |
US7441865B2 (en) | 2004-01-21 | 2008-10-28 | Silverbrook Research Pty Ltd | Printhead chip having longitudinal ink supply channels |
JP4646610B2 (ja) * | 2004-12-01 | 2011-03-09 | キヤノン株式会社 | インクジェット記録ヘッド |
KR100708142B1 (ko) * | 2005-06-20 | 2007-04-16 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
US7857428B2 (en) * | 2005-10-11 | 2010-12-28 | Silverbrook Research Pty Ltd | Printhead with side entry ink chamber |
US7699441B2 (en) * | 2006-12-12 | 2010-04-20 | Eastman Kodak Company | Liquid drop ejector having improved liquid chamber |
US7819503B2 (en) | 2007-06-15 | 2010-10-26 | Silverbrook Research Pty Ltd | Printhead integrated circuit comprising inkjet nozzle assemblies having connector posts |
CN101821104A (zh) * | 2007-10-24 | 2010-09-01 | 西尔弗布鲁克研究股份有限公司 | 制造具有平喷嘴板的喷墨打印头的方法 |
DK2237960T3 (da) | 2008-01-16 | 2013-01-14 | Silverbrook Res Pty Ltd | Printhovedpatron med to fluidkoblinger |
US7923379B2 (en) | 2008-11-12 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-step process for forming high-aspect-ratio holes for MEMS devices |
US8967772B2 (en) | 2009-10-22 | 2015-03-03 | Memjet Technology Ltd. | Inkjet printhead having low-loss contact for thermal actuators |
US8596774B2 (en) | 2010-05-17 | 2013-12-03 | Zamtec Ltd | Fluid container with internal filtration |
US8469488B2 (en) | 2010-05-17 | 2013-06-25 | Zamtec Ltd | Printer having waste fluid container |
JP6132652B2 (ja) * | 2013-05-02 | 2017-05-24 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP6128991B2 (ja) * | 2013-06-28 | 2017-05-17 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP2015202587A (ja) * | 2014-04-11 | 2015-11-16 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
JP2016095373A (ja) * | 2014-11-13 | 2016-05-26 | キヤノン株式会社 | 光造形物の製造方法、液体吐出ヘッドの製造方法及び感光性樹脂組成物 |
TWI687987B (zh) | 2015-02-17 | 2020-03-11 | 愛爾蘭商滿捷特科技公司 | 填充蝕刻洞的製程 |
-
2018
- 2018-10-16 TW TW107136301A patent/TW201924950A/zh unknown
- 2018-11-14 JP JP2020528209A patent/JP7111813B2/ja active Active
- 2018-11-14 WO PCT/EP2018/081277 patent/WO2019101605A1/en unknown
- 2018-11-14 CN CN201880072892.2A patent/CN111655494B/zh active Active
- 2018-11-14 EP EP18807237.5A patent/EP3676098B1/en active Active
- 2018-11-14 SG SG11202003861RA patent/SG11202003861RA/en unknown
- 2018-11-14 AU AU2018371072A patent/AU2018371072A1/en not_active Abandoned
- 2018-11-26 US US16/200,415 patent/US20190160818A1/en not_active Abandoned
-
2020
- 2020-06-26 US US16/914,139 patent/US20210031512A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2019101605A1 (en) | 2019-05-31 |
AU2018371072A1 (en) | 2020-05-14 |
US20210031512A1 (en) | 2021-02-04 |
CN111655494A (zh) | 2020-09-11 |
JP2021504184A (ja) | 2021-02-15 |
EP3676098B1 (en) | 2021-01-06 |
US20190160818A1 (en) | 2019-05-30 |
JP7111813B2 (ja) | 2022-08-02 |
CN111655494B (zh) | 2022-06-14 |
EP3676098A1 (en) | 2020-07-08 |
TW201924950A (zh) | 2019-07-01 |
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