SG11202000166QA - Probe unit - Google Patents

Probe unit

Info

Publication number
SG11202000166QA
SG11202000166QA SG11202000166QA SG11202000166QA SG11202000166QA SG 11202000166Q A SG11202000166Q A SG 11202000166QA SG 11202000166Q A SG11202000166Q A SG 11202000166QA SG 11202000166Q A SG11202000166Q A SG 11202000166QA SG 11202000166Q A SG11202000166Q A SG 11202000166QA
Authority
SG
Singapore
Prior art keywords
probe unit
probe
unit
Prior art date
Application number
SG11202000166QA
Other languages
English (en)
Inventor
Kohei Hironaka
Tsuyoshi Inuma
Shuji Takahashi
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of SG11202000166QA publication Critical patent/SG11202000166QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
SG11202000166QA 2017-07-13 2018-07-12 Probe unit SG11202000166QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017137391 2017-07-13
PCT/JP2018/026351 WO2019013289A1 (fr) 2017-07-13 2018-07-12 Unité de sonde

Publications (1)

Publication Number Publication Date
SG11202000166QA true SG11202000166QA (en) 2020-02-27

Family

ID=65002374

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202000166QA SG11202000166QA (en) 2017-07-13 2018-07-12 Probe unit

Country Status (5)

Country Link
US (1) US11320461B2 (fr)
JP (1) JP6663084B2 (fr)
SG (1) SG11202000166QA (fr)
TW (1) TWI680302B (fr)
WO (1) WO2019013289A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111937254B (zh) * 2018-03-23 2023-05-12 史密斯互连美洲公司 阻抗受控的金属化塑料插座
US11782074B2 (en) * 2018-11-27 2023-10-10 Nhk Spring Co., Ltd. Probe unit
KR102153299B1 (ko) * 2019-05-31 2020-09-21 주식회사 이노글로벌 양방향 도전성 핀, 이를 이용한 양방향 도전성 모듈 및 그 제조방법
CN115882286A (zh) * 2021-09-27 2023-03-31 史密斯互连美洲公司 用于同轴测试插座和印刷电路板接口的系统和方法
TW202407348A (zh) 2022-04-11 2024-02-16 日商日本美可多龍股份有限公司 檢查治具和檢查治具的特性阻抗的調整方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6082271U (ja) 1983-11-09 1985-06-07 株式会社アドバンテスト 同軸プロ−ブコンタクト
JPH05126850A (ja) 1991-11-07 1993-05-21 Hitachi Electron Eng Co Ltd 配線基板の端子間接続ピンブロツク
AU2003207078A1 (en) * 2002-02-07 2003-09-02 Yokowo Co., Ltd. Capacity load type probe, and test jig using the same
JP4689196B2 (ja) * 2003-11-05 2011-05-25 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット
JP2005172464A (ja) * 2003-12-08 2005-06-30 Matsushita Electric Ind Co Ltd 半導体装置の検査装置
JP2007178163A (ja) 2005-12-27 2007-07-12 Yokowo Co Ltd 検査ユニットおよびそれに用いる検査プローブ用外皮チューブ組立体
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
CN101454676B (zh) * 2006-04-28 2011-12-07 日本发条株式会社 导电性触头支架
WO2008072699A1 (fr) * 2006-12-15 2008-06-19 Nhk Spring Co., Ltd. Support de contact conducteur, unité de contact conducteur et procédé pour fabriquer un support de contact conducteur
JP5960383B2 (ja) 2010-06-01 2016-08-02 スリーエム イノベイティブ プロパティズ カンパニー 接触子ホルダ
JP5572066B2 (ja) * 2010-11-08 2014-08-13 ルネサスエレクトロニクス株式会社 テスト用ボード
JP6625869B2 (ja) * 2015-11-18 2019-12-25 株式会社日本マイクロニクス 検査プローブおよびプローブカード

Also Published As

Publication number Publication date
US20200225265A1 (en) 2020-07-16
WO2019013289A1 (fr) 2019-01-17
TW201908742A (zh) 2019-03-01
JP6663084B2 (ja) 2020-03-11
JPWO2019013289A1 (ja) 2019-11-14
US11320461B2 (en) 2022-05-03
TWI680302B (zh) 2019-12-21

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