SG11201909474XA - Chemical-mechanical processing slurry and methods for processing a nickel substrate surface - Google Patents

Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

Info

Publication number
SG11201909474XA
SG11201909474XA SG11201909474XA SG11201909474XA SG 11201909474X A SG11201909474X A SG 11201909474XA SG 11201909474X A SG11201909474X A SG 11201909474XA SG 11201909474X A SG11201909474X A SG 11201909474XA
Authority
SG
Singapore
Prior art keywords
international
polish
platen
aurora
illinois
Prior art date
Application number
Other languages
English (en)
Inventor
Tong Li
Hon Wu Lau
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of SG11201909474XA publication Critical patent/SG11201909474XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201909474X 2017-04-14 2018-04-12 Chemical-mechanical processing slurry and methods for processing a nickel substrate surface SG11201909474XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762485444P 2017-04-14 2017-04-14
PCT/US2018/027281 WO2018191485A1 (fr) 2017-04-14 2018-04-12 Suspension épaisse pour le traitement chimico-mécanique et procédés de traitement d'une surface de substrat en nickel

Publications (1)

Publication Number Publication Date
SG11201909474XA true SG11201909474XA (en) 2019-11-28

Family

ID=63791573

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909474X SG11201909474XA (en) 2017-04-14 2018-04-12 Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

Country Status (5)

Country Link
US (1) US10968377B2 (fr)
MY (1) MY199592A (fr)
SG (1) SG11201909474XA (fr)
TW (1) TWI672396B (fr)
WO (1) WO2018191485A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024155533A1 (fr) * 2023-01-20 2024-07-25 Entegris, Inc. Compositions pour polir des masques durs et systèmes et procédés associés

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6152976A (en) * 1996-08-30 2000-11-28 Showa Denko Kabushiki Kaisha Abrasive composition for disc substrate, and process for polishing disc substrate
US6007592A (en) * 1996-11-14 1999-12-28 Nissan Chemical Industries, Ltd. Polishing composition for aluminum disk and polishing process therewith
US6957511B1 (en) 1999-11-12 2005-10-25 Seagate Technology Llc Single-step electromechanical mechanical polishing on Ni-P plated discs
US6334880B1 (en) * 1999-12-07 2002-01-01 Silbond Corporation Abrasive media and aqueous slurries for chemical mechanical polishing and planarization
KR100393204B1 (ko) * 2000-05-16 2003-07-31 삼성전자주식회사 씨엠피용 슬러리의 공급 방법 및 장치
US6977030B2 (en) * 2000-11-21 2005-12-20 Leonard Nanis Method of coating smooth electroless nickel on magnetic memory disks and related memory devices
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US8062096B2 (en) * 2005-06-30 2011-11-22 Cabot Microelectronics Corporation Use of CMP for aluminum mirror and solar cell fabrication
US8251777B2 (en) * 2005-06-30 2012-08-28 Cabot Microelectronics Corporation Polishing slurry for aluminum and aluminum alloys
JP2008238375A (ja) * 2007-03-28 2008-10-09 Tokyo Seimitsu Co Ltd Ｃｍｐ装置のプラテン
US8226841B2 (en) * 2009-02-03 2012-07-24 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous memory disks
US8334190B2 (en) 2010-05-07 2012-12-18 Texas Instruments Incorporated Single step CMP for polishing three or more layer film stacks
CN103119122B (zh) * 2010-09-24 2014-10-08 花王株式会社 研磨液组合物的制造方法
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
WO2015057433A1 (fr) * 2013-10-18 2015-04-23 Cabot Microelectronics Corporation Composition de polissage et procédé pour des disques de mémoire enrobés de nickel phosphoreux
US10358579B2 (en) * 2013-12-03 2019-07-23 Cabot Microelectronics Corporation CMP compositions and methods for polishing nickel phosphorous surfaces
SG10201602672UA (en) * 2015-04-06 2016-11-29 Cabot Microelectronics Corp Cmp composition and method for polishing rigid disks

Also Published As

Publication number Publication date
US20180298257A1 (en) 2018-10-18
TWI672396B (zh) 2019-09-21
MY199592A (en) 2023-11-08
US10968377B2 (en) 2021-04-06
WO2018191485A1 (fr) 2018-10-18
TW201842232A (zh) 2018-12-01

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