SG11201906423YA - Identifying process variations during product manufacture - Google Patents

Identifying process variations during product manufacture

Info

Publication number
SG11201906423YA
SG11201906423YA SG11201906423YA SG11201906423YA SG11201906423YA SG 11201906423Y A SG11201906423Y A SG 11201906423YA SG 11201906423Y A SG11201906423Y A SG 11201906423YA SG 11201906423Y A SG11201906423Y A SG 11201906423YA SG 11201906423Y A SG11201906423Y A SG 11201906423YA
Authority
SG
Singapore
Prior art keywords
product
international
contrast
images
imaging parameter
Prior art date
Application number
SG11201906423YA
Other languages
English (en)
Inventor
Tzahi Grunzweig
Nadav Gutman
Claire E Staniunas
Tal Marciano
Nimrod Shuall
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201906423YA publication Critical patent/SG11201906423YA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70681Metrology strategies
    • G03F7/70683Mark designs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70616Monitoring the printed patterns
    • G03F7/70641Focus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106General arrangement of respective parts
    • G01N2021/0118Apparatus with remote processing
    • G01N2021/0143Apparatus with remote processing with internal and external computer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Automation & Control Theory (AREA)
  • Health & Medical Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Complex Calculations (AREA)
SG11201906423YA 2017-02-10 2018-02-07 Identifying process variations during product manufacture SG11201906423YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762457781P 2017-02-10 2017-02-10
US201762591088P 2017-11-27 2017-11-27
PCT/US2018/017273 WO2018148318A1 (en) 2017-02-10 2018-02-07 Identifying process variations during product manufacture

Publications (1)

Publication Number Publication Date
SG11201906423YA true SG11201906423YA (en) 2019-08-27

Family

ID=63107157

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906423YA SG11201906423YA (en) 2017-02-10 2018-02-07 Identifying process variations during product manufacture

Country Status (8)

Country Link
US (1) US10379449B2 (de)
JP (1) JP6941176B2 (de)
KR (1) KR102267996B1 (de)
CN (1) CN110301032B (de)
DE (1) DE112018000764T5 (de)
SG (1) SG11201906423YA (de)
TW (1) TWI738968B (de)
WO (1) WO2018148318A1 (de)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140140A (en) * 1998-09-16 2000-10-31 Advanced Micro Devices, Inc. Method for detecting process sensitivity to integrated circuit layout by compound processing
TW432452B (en) 1998-10-15 2001-05-01 Applied Materials Inc Detection of wafer fragments in a wafer processing apparatus
JP2003332396A (ja) * 2002-05-13 2003-11-21 Mitsubishi Electric Corp 半導体装置の検査方法
EP1517183A1 (de) * 2003-08-29 2005-03-23 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und damit erzeugter Artikel
NO20040756L (no) * 2004-02-20 2005-08-22 Renewable Energy Corp Fremgangsmate og system for a etablere samsvar og sporbarhet mellom vaffere og solceller
US7355689B2 (en) * 2005-01-31 2008-04-08 Applied Materials, Inc. Automatic optical inspection using multiple objectives
JP4320308B2 (ja) * 2005-03-15 2009-08-26 株式会社ルネサステクノロジ 欠陥検査方法
JP4812484B2 (ja) * 2006-03-24 2011-11-09 株式会社日立ハイテクノロジーズ ボルテージコントラストを伴った欠陥をレビューする方法およびその装置
US20080062385A1 (en) 2006-04-07 2008-03-13 Asml Netherlands B.V. Method of monitoring polarization performance, polarization measurement assembly, lithographic apparatus and computer program product using the same
US7673278B2 (en) * 2007-11-29 2010-03-02 Tokyo Electron Limited Enhanced process yield using a hot-spot library
WO2015080858A1 (en) * 2013-12-01 2015-06-04 Kla-Tencor Corporation Target element types for process parameter metrology
JP6532479B2 (ja) 2014-03-31 2019-06-19 ケーエルエー−テンカー コーポレイション スキャタロメトリ計測法を用いた焦点測定

Also Published As

Publication number Publication date
WO2018148318A1 (en) 2018-08-16
US10379449B2 (en) 2019-08-13
CN110301032B (zh) 2021-02-05
TW201841280A (zh) 2018-11-16
JP6941176B2 (ja) 2021-09-29
KR20190108184A (ko) 2019-09-23
KR102267996B1 (ko) 2021-06-22
JP2020507928A (ja) 2020-03-12
DE112018000764T5 (de) 2019-12-19
US20190033730A1 (en) 2019-01-31
CN110301032A (zh) 2019-10-01
TWI738968B (zh) 2021-09-11

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