SG11201903715XA - High sensitivity repeater defect detection - Google Patents

High sensitivity repeater defect detection

Info

Publication number
SG11201903715XA
SG11201903715XA SG11201903715XA SG11201903715XA SG11201903715XA SG 11201903715X A SG11201903715X A SG 11201903715XA SG 11201903715X A SG11201903715X A SG 11201903715XA SG 11201903715X A SG11201903715X A SG 11201903715XA SG 11201903715X A SG11201903715X A SG 11201903715XA
Authority
SG
Singapore
Prior art keywords
california
international
image processing
processing components
defect detection
Prior art date
Application number
SG11201903715XA
Other languages
English (en)
Inventor
Bjorn Brauer
Santosh Bhattacharyya
Eugene Shifrin
Hucheng Lee
Benjamin Murray
Ashok Mathew
Chetana Bhaskar
Lisheng Gao
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201903715XA publication Critical patent/SG11201903715XA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20076—Probabilistic image processing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
SG11201903715XA 2016-11-10 2017-11-08 High sensitivity repeater defect detection SG11201903715XA (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662420409P 2016-11-10 2016-11-10
US201762443810P 2017-01-09 2017-01-09
US201762455948P 2017-02-07 2017-02-07
US15/804,980 US10395358B2 (en) 2016-11-10 2017-11-06 High sensitivity repeater defect detection
PCT/US2017/060589 WO2018089459A1 (en) 2016-11-10 2017-11-08 High sensitivity repeater defect detection

Publications (1)

Publication Number Publication Date
SG11201903715XA true SG11201903715XA (en) 2019-05-30

Family

ID=62064714

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903715XA SG11201903715XA (en) 2016-11-10 2017-11-08 High sensitivity repeater defect detection

Country Status (7)

Country Link
US (1) US10395358B2 (zh)
KR (1) KR102295269B1 (zh)
CN (1) CN109964115B (zh)
IL (1) IL265905B (zh)
SG (1) SG11201903715XA (zh)
TW (1) TWI726169B (zh)
WO (1) WO2018089459A1 (zh)

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DE102018207880A1 (de) * 2018-05-18 2019-11-21 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Bewerten einer unbekannten Auswirkung von Defekten eines Elements eines Photolithographieprozesses
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US10957034B2 (en) * 2019-01-17 2021-03-23 Applied Materials Israel Ltd. Method of examination of a specimen and system thereof
US11276161B2 (en) * 2019-02-26 2022-03-15 KLA Corp. Reference image generation for semiconductor applications
US11120546B2 (en) 2019-09-24 2021-09-14 Kla Corporation Unsupervised learning-based reference selection for enhanced defect inspection sensitivity
US11551344B2 (en) * 2019-12-09 2023-01-10 University Of Central Florida Research Foundation, Inc. Methods of artificial intelligence-assisted infrastructure assessment using mixed reality systems
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US11328411B2 (en) * 2020-05-04 2022-05-10 KLA Corp. Print check repeater defect detection
US11150200B1 (en) 2020-06-15 2021-10-19 Mitutoyo Corporation Workpiece inspection and defect detection system indicating number of defect images for training
US11430105B2 (en) 2020-06-15 2022-08-30 Mitutoyo Corporation Workpiece inspection and defect detection system including monitoring of workpiece images
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Also Published As

Publication number Publication date
CN109964115A (zh) 2019-07-02
IL265905B (en) 2021-02-28
CN109964115B (zh) 2021-04-13
WO2018089459A1 (en) 2018-05-17
KR20190069597A (ko) 2019-06-19
TWI726169B (zh) 2021-05-01
KR102295269B1 (ko) 2021-08-27
TW201830134A (zh) 2018-08-16
US20180130199A1 (en) 2018-05-10
US10395358B2 (en) 2019-08-27
IL265905A (en) 2019-06-30

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