SG11201903418QA - Ultrasonic inspection device - Google Patents
Ultrasonic inspection deviceInfo
- Publication number
- SG11201903418QA SG11201903418QA SG11201903418QA SG11201903418QA SG11201903418QA SG 11201903418Q A SG11201903418Q A SG 11201903418QA SG 11201903418Q A SG11201903418Q A SG 11201903418QA SG 11201903418Q A SG11201903418Q A SG 11201903418QA SG 11201903418Q A SG11201903418Q A SG 11201903418QA
- Authority
- SG
- Singapore
- Prior art keywords
- ultrasonic
- inspection device
- semiconductor device
- ultrasonic transducer
- ultrasonic inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/11—Analysing solids by measuring attenuation of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/225—Supports, positioning or alignment in moving situation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/27—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the material relative to a stationary sensor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/28—Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/015—Attenuation, scattering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016216025A JP6745196B2 (ja) | 2016-11-04 | 2016-11-04 | 超音波検査装置 |
PCT/JP2017/032545 WO2018083882A1 (ja) | 2016-11-04 | 2017-09-08 | 超音波検査装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201903418QA true SG11201903418QA (en) | 2019-05-30 |
Family
ID=62076873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201903418QA SG11201903418QA (en) | 2016-11-04 | 2017-09-08 | Ultrasonic inspection device |
Country Status (8)
Country | Link |
---|---|
US (1) | US11428673B2 (ja) |
JP (1) | JP6745196B2 (ja) |
KR (1) | KR102279570B1 (ja) |
CN (1) | CN109863394A (ja) |
DE (1) | DE112017005573T5 (ja) |
SG (1) | SG11201903418QA (ja) |
TW (1) | TWI731181B (ja) |
WO (1) | WO2018083882A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI686618B (zh) * | 2018-11-23 | 2020-03-01 | 行政院原子能委員會核能研究所 | 單探頭式非線性超音波檢測裝置及其方法 |
JP7276744B2 (ja) | 2019-02-26 | 2023-05-18 | 国立大学法人豊橋技術科学大学 | 超音波検査装置及び超音波検査方法 |
KR102406801B1 (ko) * | 2021-09-07 | 2022-06-10 | 주식회사 엠아이티 | 초음파 프로브를 이용한 불량 소자 검사방법 및 이를 이용하는 검사장치 |
EP4290250A1 (de) * | 2022-06-08 | 2023-12-13 | Siemens Aktiengesellschaft | Verfahren zur prüfung einer elektronischen baugruppe sowie elektronischen baugruppe mit vorrichtung zur prüfung |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0329848A (ja) * | 1989-06-28 | 1991-02-07 | Kyushu Electric Power Co Inc | 局部水浸用探触子 |
DE59207203D1 (de) * | 1991-08-16 | 1996-10-24 | Krautkraemer Gmbh | Ultraschallprüfkopf, geeignet für schallankopplung über eine wasservorlaufstrecke |
JPH08320259A (ja) * | 1995-05-25 | 1996-12-03 | Nikon Corp | 赤外線検出装置 |
US6072327A (en) * | 1995-05-26 | 2000-06-06 | Nec Corporation | Method and device of testing semiconductor integrated circuit chip capable of preventing electron-hole pairs |
JP2666772B2 (ja) | 1995-05-26 | 1997-10-22 | 日本電気株式会社 | 超音波加熱を用いた半導体集積回路配線系の検査法および装置 |
US7421900B2 (en) * | 2001-11-14 | 2008-09-09 | Kabushiki Kaisha Toshiba | Ultrasonograph, ultrasonic transducer, examining instrument, and ultrasonographing device |
JP2003254953A (ja) * | 2002-03-05 | 2003-09-10 | Hitachi Kenki Fine Tech Co Ltd | 超音波映像検査装置 |
JP2004077341A (ja) * | 2002-08-20 | 2004-03-11 | Hitachi Kenki Fine Tech Co Ltd | 超音波映像検査方法および超音波映像検査装置 |
US7518251B2 (en) * | 2004-12-03 | 2009-04-14 | General Electric Company | Stacked electronics for sensors |
WO2007007500A1 (ja) * | 2005-07-11 | 2007-01-18 | Matsushita Electric Industrial Co., Ltd. | 超音波探傷方法と超音波探傷装置 |
US9121817B1 (en) * | 2009-03-10 | 2015-09-01 | Sandia Corporation | Ultrasonic testing device having an adjustable water column |
JP2011053126A (ja) * | 2009-09-03 | 2011-03-17 | Disco Abrasive Syst Ltd | 超音波検査方法及び超音波検査装置 |
JP5919884B2 (ja) * | 2012-02-28 | 2016-05-18 | 日産自動車株式会社 | ドライ式超音波探傷検査装置とその方法 |
CN102928516B (zh) * | 2012-10-23 | 2014-11-19 | 沈阳黎明航空发动机(集团)有限责任公司 | 一种检测复合材料制件的超声探头水囊 |
JP6220990B2 (ja) * | 2013-12-23 | 2017-10-25 | ポスコPosco | 鋼板の欠陥検出のための超音波探傷装置および方法 |
JP5650339B1 (ja) * | 2014-02-06 | 2015-01-07 | 株式会社日立パワーソリューションズ | 超音波検査装置 |
US10302600B2 (en) * | 2016-01-19 | 2019-05-28 | Northrop Grumman Innovation Systems, Inc. | Inspection devices and related systems and methods |
JP6745197B2 (ja) * | 2016-11-04 | 2020-08-26 | 浜松ホトニクス株式会社 | 超音波検査装置及び超音波検査方法 |
JP6927690B2 (ja) * | 2016-11-04 | 2021-09-01 | 浜松ホトニクス株式会社 | 半導体デバイス検査装置及び半導体デバイス検査方法 |
-
2016
- 2016-11-04 JP JP2016216025A patent/JP6745196B2/ja active Active
-
2017
- 2017-09-08 US US16/346,585 patent/US11428673B2/en active Active
- 2017-09-08 KR KR1020197012767A patent/KR102279570B1/ko active IP Right Grant
- 2017-09-08 SG SG11201903418QA patent/SG11201903418QA/en unknown
- 2017-09-08 WO PCT/JP2017/032545 patent/WO2018083882A1/ja active Application Filing
- 2017-09-08 CN CN201780066138.3A patent/CN109863394A/zh active Pending
- 2017-09-08 DE DE112017005573.3T patent/DE112017005573T5/de active Pending
- 2017-10-17 TW TW106135391A patent/TWI731181B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102279570B1 (ko) | 2021-07-21 |
US20190257798A1 (en) | 2019-08-22 |
CN109863394A (zh) | 2019-06-07 |
WO2018083882A1 (ja) | 2018-05-11 |
JP6745196B2 (ja) | 2020-08-26 |
TW201818086A (zh) | 2018-05-16 |
KR20190077373A (ko) | 2019-07-03 |
JP2018072284A (ja) | 2018-05-10 |
US11428673B2 (en) | 2022-08-30 |
DE112017005573T5 (de) | 2019-08-29 |
TWI731181B (zh) | 2021-06-21 |
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