SG11201903415VA - Ultrasonic inspection device and ultrasonic inspection method - Google Patents

Ultrasonic inspection device and ultrasonic inspection method

Info

Publication number
SG11201903415VA
SG11201903415VA SG11201903415VA SG11201903415VA SG11201903415VA SG 11201903415V A SG11201903415V A SG 11201903415VA SG 11201903415V A SG11201903415V A SG 11201903415VA SG 11201903415V A SG11201903415V A SG 11201903415VA SG 11201903415V A SG11201903415V A SG 11201903415VA
Authority
SG
Singapore
Prior art keywords
semiconductor device
ultrasonic
ultrasonic inspection
ultrasonic transducer
stage
Prior art date
Application number
SG11201903415VA
Inventor
Toru Matsumoto
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of SG11201903415VA publication Critical patent/SG11201903415VA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/303—Contactless testing of integrated circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/225—Supports, positioning or alignment in moving situation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/27—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the material relative to a stationary sensor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/28—Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/34—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor
    • G01N29/341—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics
    • G01N29/343—Generating the ultrasonic, sonic or infrasonic waves, e.g. electronic circuits specially adapted therefor with time characteristics pulse waves, e.g. particular sequence of pulses, bursts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4454—Signal recognition, e.g. specific values or portions, signal events, signatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts

Abstract

This ultrasonic inspection device , for inspecting a packaged semiconductor device D, is provided with: an ultrasonic transducer 2 5 which outputs ultrasonic waves W2 to a semiconductor device D; a receiver (a reflection detection unit) 13 which detects reflected waves of the ultrasonic waves W reflected on the semiconductor device D; a stage 3 which moves the positions of the semiconductor device D relative to the ultrasonic transducer 2; a stage control unit 21 which controls 10 driving of the stage 3; and an analysis unit 22 which analyzes the reaction of the semiconductor device D to the input of the ultrasonic waves W from the ultrasonic transducer 2. The stage control unit 21 controls the distance between the semiconductor device D and the ultrasonic transducer 2 on the basis of a peak occurring in time 15 waveform K of the reflected wave detected by the receiver 13. Figure 4 30
SG11201903415VA 2016-11-04 2017-09-08 Ultrasonic inspection device and ultrasonic inspection method SG11201903415VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016216028A JP6745197B2 (en) 2016-11-04 2016-11-04 Ultrasonic inspection apparatus and ultrasonic inspection method
PCT/JP2017/032546 WO2018083883A1 (en) 2016-11-04 2017-09-08 Ultrasonic inspection device and ultrasonic inspection method

Publications (1)

Publication Number Publication Date
SG11201903415VA true SG11201903415VA (en) 2019-05-30

Family

ID=62075932

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903415VA SG11201903415VA (en) 2016-11-04 2017-09-08 Ultrasonic inspection device and ultrasonic inspection method

Country Status (8)

Country Link
US (1) US11105777B2 (en)
JP (1) JP6745197B2 (en)
KR (1) KR102279569B1 (en)
CN (1) CN109891231B (en)
DE (1) DE112017005569T5 (en)
SG (1) SG11201903415VA (en)
TW (1) TWI725242B (en)
WO (1) WO2018083883A1 (en)

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* Cited by examiner, † Cited by third party
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JP6745196B2 (en) * 2016-11-04 2020-08-26 浜松ホトニクス株式会社 Ultrasonic inspection equipment
JP7276744B2 (en) * 2019-02-26 2023-05-18 国立大学法人豊橋技術科学大学 Ultrasonic inspection device and ultrasonic inspection method
US20220221430A1 (en) * 2019-04-15 2022-07-14 Mitsubishi Heavy Industries, Ltd. Ultrasonic flaw detection device and method for controlling same
TWI750901B (en) * 2020-11-18 2021-12-21 同致電子企業股份有限公司 Superficial foreign bodies detecting system for ultrasonic sensor
US11933763B2 (en) 2021-06-29 2024-03-19 Verifi Technologies, Llc Cylindrical ultrasonic scanning apparatus

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JPS58151555A (en) * 1982-03-05 1983-09-08 Sumitomo Metal Ind Ltd Ultrasonic flaw detecting method
JP2666772B2 (en) * 1995-05-26 1997-10-22 日本電気株式会社 Inspection method and apparatus for semiconductor integrated circuit wiring system using ultrasonic heating
US6430728B1 (en) 1999-09-30 2002-08-06 Advanced Micro Devices, Inc. Acoustic 3D analysis of circuit structures
US6880387B2 (en) * 2001-08-22 2005-04-19 Sonoscan, Inc. Acoustic micro imaging method providing improved information derivation and visualization
US6439728B1 (en) * 2001-08-28 2002-08-27 Network Photonics, Inc. Multimirror stack for vertical integration of MEMS devices in two-position retroreflectors
JP2004077341A (en) * 2002-08-20 2004-03-11 Hitachi Kenki Fine Tech Co Ltd Ultrasound image inspection method and apparatus
CN1707764A (en) * 2004-10-11 2005-12-14 资重兴 Method for testing wafer packaging
JP2008003014A (en) * 2006-06-26 2008-01-10 Matsushita Electric Ind Co Ltd Ultrasonic inspection method and device
JP2008102071A (en) * 2006-10-20 2008-05-01 Matsushita Electric Ind Co Ltd Ultrasonic flaw detecting method and ultrasonic imaging device
DE102007020491A1 (en) * 2007-04-27 2008-10-30 Hydrometer Gmbh Method for determining a property of a flowing medium and ultrasonic meters
JP5221314B2 (en) * 2007-12-26 2013-06-26 パナソニック株式会社 Ultrasonic measurement method and electronic component manufacturing method
JP2009276215A (en) * 2008-05-15 2009-11-26 Tokyo Electron Ltd Probe apparatus and method for correcting contact position
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Also Published As

Publication number Publication date
DE112017005569T5 (en) 2019-08-29
US11105777B2 (en) 2021-08-31
KR20190079619A (en) 2019-07-05
JP2018072285A (en) 2018-05-10
US20200057032A1 (en) 2020-02-20
KR102279569B1 (en) 2021-07-21
CN109891231A (en) 2019-06-14
CN109891231B (en) 2022-01-11
TW201818087A (en) 2018-05-16
JP6745197B2 (en) 2020-08-26
WO2018083883A1 (en) 2018-05-11
TWI725242B (en) 2021-04-21

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