JP6745196B2 - 超音波検査装置 - Google Patents
超音波検査装置 Download PDFInfo
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- JP6745196B2 JP6745196B2 JP2016216025A JP2016216025A JP6745196B2 JP 6745196 B2 JP6745196 B2 JP 6745196B2 JP 2016216025 A JP2016216025 A JP 2016216025A JP 2016216025 A JP2016216025 A JP 2016216025A JP 6745196 B2 JP6745196 B2 JP 6745196B2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/11—Analysing solids by measuring attenuation of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/225—Supports, positioning or alignment in moving situation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/27—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the material relative to a stationary sensor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/28—Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/015—Attenuation, scattering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0258—Structural degradation, e.g. fatigue of composites, ageing of oils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
Claims (9)
- パッケージ化された半導体デバイスを検査対象とする超音波検査装置であって、
前記半導体デバイスに対向して配置される超音波振動子と、
前記超音波振動子において前記半導体デバイスに対向する端部に設けられ、前記超音波を伝搬させる媒質を保持する媒質保持部と、
前記半導体デバイスと前記超音波振動子との相対位置を移動させるステージと、
前記超音波振動子による超音波の入力に応じた前記半導体デバイスの反応を解析する解析部と、を備え、
前記媒質保持部は、表面張力によって前記媒質保持部から盛り上がる程度に前記媒質の供給を受けることにより、前記媒質の盛り上がり部分を前記半導体デバイスの検査面に接触させる超音波検査装置。 - 前記媒質保持部は、前記超音波振動子の前記端部に設けられた筒状部材によって構成されている、請求項1記載の超音波検査装置。
- 前記媒質保持部は、前記超音波振動子の前記端部にスライド自在に嵌合されている、請求項1又は2記載の超音波検査装置。
- 前記媒質保持部は、前記媒質の保持量を調整する媒質流通口を有している、請求項1〜3のいずれか一項記載の超音波検査装置。
- 前記媒質保持部は、前記媒質の保持量を検出する保持量検出部を有している、請求項1〜4のいずれか一項記載の超音波検査装置。
- 前記半導体デバイスに定電圧又は定電流を印加する電源装置と、
前記定電圧又は前記定電流の印加状態において、前記超音波の入力に応じた前記半導体デバイスの電流又は電圧を検出する反応検出部と、を更に備え、
前記解析部は、前記反応検出部からの検出信号に基づいて解析画像を生成する、請求項1〜5のいずれか一項記載の超音波検査装置。 - 前記超音波振動子に対して駆動信号を入力すると共に、前記駆動信号に応じた参照信号を出力する信号発生部を更に備え、
前記解析部は、前記検出信号と前記参照信号とに基づいて前記解析画像を生成する、請求項6記載の超音波検査装置。 - 前記半導体デバイスで反射した前記超音波の反射波を検出する反射検出部を更に備え、
前記解析部は、前記反射検出部からの検出信号に基づいて反射画像を生成する、請求項6又は7記載の超音波検査装置。 - 前記解析部は、前記解析画像と前記反射画像とを重畳した重畳画像を生成する、請求項8記載の超音波検査装置。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016216025A JP6745196B2 (ja) | 2016-11-04 | 2016-11-04 | 超音波検査装置 |
DE112017005573.3T DE112017005573T5 (de) | 2016-11-04 | 2017-09-08 | Ultraschallprüfvorrichtung |
KR1020197012767A KR102279570B1 (ko) | 2016-11-04 | 2017-09-08 | 초음파 검사 장치 |
PCT/JP2017/032545 WO2018083882A1 (ja) | 2016-11-04 | 2017-09-08 | 超音波検査装置 |
US16/346,585 US11428673B2 (en) | 2016-11-04 | 2017-09-08 | Ultrasonic inspection device |
CN201780066138.3A CN109863394A (zh) | 2016-11-04 | 2017-09-08 | 超声波检查装置 |
SG11201903418QA SG11201903418QA (en) | 2016-11-04 | 2017-09-08 | Ultrasonic inspection device |
TW106135391A TWI731181B (zh) | 2016-11-04 | 2017-10-17 | 超音波檢查裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016216025A JP6745196B2 (ja) | 2016-11-04 | 2016-11-04 | 超音波検査装置 |
Publications (2)
Publication Number | Publication Date |
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JP2018072284A JP2018072284A (ja) | 2018-05-10 |
JP6745196B2 true JP6745196B2 (ja) | 2020-08-26 |
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JP2016216025A Active JP6745196B2 (ja) | 2016-11-04 | 2016-11-04 | 超音波検査装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11428673B2 (ja) |
JP (1) | JP6745196B2 (ja) |
KR (1) | KR102279570B1 (ja) |
CN (1) | CN109863394A (ja) |
DE (1) | DE112017005573T5 (ja) |
SG (1) | SG11201903418QA (ja) |
TW (1) | TWI731181B (ja) |
WO (1) | WO2018083882A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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TWI686618B (zh) * | 2018-11-23 | 2020-03-01 | 行政院原子能委員會核能研究所 | 單探頭式非線性超音波檢測裝置及其方法 |
JP7276744B2 (ja) | 2019-02-26 | 2023-05-18 | 国立大学法人豊橋技術科学大学 | 超音波検査装置及び超音波検査方法 |
KR102406801B1 (ko) * | 2021-09-07 | 2022-06-10 | 주식회사 엠아이티 | 초음파 프로브를 이용한 불량 소자 검사방법 및 이를 이용하는 검사장치 |
EP4290250A1 (de) * | 2022-06-08 | 2023-12-13 | Siemens Aktiengesellschaft | Verfahren zur prüfung einer elektronischen baugruppe sowie elektronischen baugruppe mit vorrichtung zur prüfung |
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JPH08320259A (ja) * | 1995-05-25 | 1996-12-03 | Nikon Corp | 赤外線検出装置 |
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JP2011053126A (ja) * | 2009-09-03 | 2011-03-17 | Disco Abrasive Syst Ltd | 超音波検査方法及び超音波検査装置 |
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JP5650339B1 (ja) | 2014-02-06 | 2015-01-07 | 株式会社日立パワーソリューションズ | 超音波検査装置 |
US10302600B2 (en) * | 2016-01-19 | 2019-05-28 | Northrop Grumman Innovation Systems, Inc. | Inspection devices and related systems and methods |
JP6927690B2 (ja) * | 2016-11-04 | 2021-09-01 | 浜松ホトニクス株式会社 | 半導体デバイス検査装置及び半導体デバイス検査方法 |
JP6745197B2 (ja) * | 2016-11-04 | 2020-08-26 | 浜松ホトニクス株式会社 | 超音波検査装置及び超音波検査方法 |
-
2016
- 2016-11-04 JP JP2016216025A patent/JP6745196B2/ja active Active
-
2017
- 2017-09-08 CN CN201780066138.3A patent/CN109863394A/zh active Pending
- 2017-09-08 DE DE112017005573.3T patent/DE112017005573T5/de active Pending
- 2017-09-08 US US16/346,585 patent/US11428673B2/en active Active
- 2017-09-08 SG SG11201903418QA patent/SG11201903418QA/en unknown
- 2017-09-08 WO PCT/JP2017/032545 patent/WO2018083882A1/ja active Application Filing
- 2017-09-08 KR KR1020197012767A patent/KR102279570B1/ko active IP Right Grant
- 2017-10-17 TW TW106135391A patent/TWI731181B/zh active
Also Published As
Publication number | Publication date |
---|---|
US11428673B2 (en) | 2022-08-30 |
KR102279570B1 (ko) | 2021-07-21 |
TWI731181B (zh) | 2021-06-21 |
WO2018083882A1 (ja) | 2018-05-11 |
US20190257798A1 (en) | 2019-08-22 |
SG11201903418QA (en) | 2019-05-30 |
CN109863394A (zh) | 2019-06-07 |
JP2018072284A (ja) | 2018-05-10 |
KR20190077373A (ko) | 2019-07-03 |
TW201818086A (zh) | 2018-05-16 |
DE112017005573T5 (de) | 2019-08-29 |
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