SG11201902750WA - Methods and systems for chucking a warped wafer - Google Patents
Methods and systems for chucking a warped waferInfo
- Publication number
- SG11201902750WA SG11201902750WA SG11201902750WA SG11201902750WA SG11201902750WA SG 11201902750W A SG11201902750W A SG 11201902750WA SG 11201902750W A SG11201902750W A SG 11201902750WA SG 11201902750W A SG11201902750W A SG 11201902750WA SG 11201902750W A SG11201902750W A SG 11201902750WA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- chuck
- international
- california
- chucking
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662409880P | 2016-10-19 | 2016-10-19 | |
US15/383,207 US10468288B2 (en) | 2016-10-19 | 2016-12-19 | Methods and systems for chucking a warped wafer |
PCT/US2017/057244 WO2018075675A1 (en) | 2016-10-19 | 2017-10-18 | Methods and systems for chucking a warped wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201902750WA true SG11201902750WA (en) | 2019-05-30 |
Family
ID=61904091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201902750WA SG11201902750WA (en) | 2016-10-19 | 2017-10-18 | Methods and systems for chucking a warped wafer |
Country Status (8)
Country | Link |
---|---|
US (1) | US10468288B2 (zh) |
EP (1) | EP3507827B1 (zh) |
KR (1) | KR102442238B1 (zh) |
CN (1) | CN109891571B (zh) |
IL (1) | IL265746B2 (zh) |
SG (1) | SG11201902750WA (zh) |
TW (1) | TWI751209B (zh) |
WO (1) | WO2018075675A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10468288B2 (en) * | 2016-10-19 | 2019-11-05 | Kla-Tencor Corporation | Methods and systems for chucking a warped wafer |
US11304290B2 (en) * | 2017-04-07 | 2022-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structures and methods |
TWI766105B (zh) | 2017-09-28 | 2022-06-01 | 美商魯道夫科技股份有限公司 | 晶圓級封裝組裝體處置 |
DE102018007307A1 (de) * | 2018-09-17 | 2020-03-19 | Vat Holding Ag | Stifthubvorrichtung |
WO2020076949A1 (en) * | 2018-10-10 | 2020-04-16 | Nordson Corporation | Vacuum clamping apparatus and method |
US11209373B2 (en) | 2019-06-21 | 2021-12-28 | Kla Corporation | Six degree of freedom workpiece stage |
US11587818B2 (en) * | 2019-07-18 | 2023-02-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chuck design and method for wafer |
JP2021044445A (ja) * | 2019-09-12 | 2021-03-18 | 株式会社ディスコ | リングフレームの保持機構 |
DE102020109996B3 (de) * | 2020-04-09 | 2021-05-20 | Frt Gmbh | Spannvorrichtung und Verfahren zur Glättung einer gebogenen Probe, sowie Verwendung der Spannvorrichtung |
US11508608B2 (en) * | 2020-08-20 | 2022-11-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Vacuum wafer chuck for manufacturing semiconductor devices |
JP2022099516A (ja) * | 2020-12-23 | 2022-07-05 | 東京エレクトロン株式会社 | 基板の受け渡し方法及び基板受け渡し装置 |
EP4227738A1 (en) | 2022-02-14 | 2023-08-16 | ASML Netherlands B.V. | Clamp |
WO2023222198A1 (en) * | 2022-05-17 | 2023-11-23 | Applied Materials, Inc. | Carrier for holding a substrate, apparatus for depositing a layer on a substrate, and method for supporting a substrate |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5177857A (en) * | 1990-05-17 | 1993-01-12 | Fsk Inc. | Method for holding an object to a surface using valve controlled vacuum force |
WO1999020437A1 (de) * | 1997-10-22 | 1999-04-29 | J. Schmalz Gmbh | Vakuumspannsystem |
US6196532B1 (en) * | 1999-08-27 | 2001-03-06 | Applied Materials, Inc. | 3 point vacuum chuck with non-resilient support members |
US6502808B1 (en) * | 1999-09-30 | 2003-01-07 | The Boeing Company | Vacuum cup with precision hard stop |
US6757059B2 (en) | 2001-04-30 | 2004-06-29 | Therma-Wave, Inc. | Wafer chuck with integrated reference sample |
TW200303593A (en) * | 2002-02-19 | 2003-09-01 | Olympus Optical Co | Substrate sucking apparatus |
US20060105182A1 (en) | 2004-11-16 | 2006-05-18 | Applied Materials, Inc. | Erosion resistant textured chamber surface |
US7292427B1 (en) | 2004-10-12 | 2007-11-06 | Kla-Tencor Technologies Corporation | Pin lift chuck assembly for warped substrates |
US7192017B2 (en) * | 2005-04-18 | 2007-03-20 | Anderson Industrial Corp. | Mechanical suction device |
US8079578B2 (en) * | 2007-09-05 | 2011-12-20 | Hgs Aerospace, Inc. | Universal holding fixture |
US9401299B2 (en) | 2010-09-24 | 2016-07-26 | Rudolph Technologies, Inc. | Support for semiconductor substrate |
DE102011001879A1 (de) * | 2011-04-07 | 2012-10-11 | Jenoptik Automatisierungstechnik Gmbh | Vorrichtung zum Spannen verformter Wafer |
AT511627B1 (de) * | 2011-07-01 | 2015-05-15 | Mechatronic Systemtechnik Gmbh | Vorrichtung zum halten eines flächigen substrats |
JP5485958B2 (ja) * | 2011-09-16 | 2014-05-07 | 東京エレクトロン株式会社 | 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム |
US9851643B2 (en) | 2012-03-27 | 2017-12-26 | Kla-Tencor Corporation | Apparatus and methods for reticle handling in an EUV reticle inspection tool |
JP6535206B2 (ja) * | 2014-05-08 | 2019-06-26 | 株式会社ブイ・テクノロジー | 露光方法及び露光装置 |
US10082461B2 (en) | 2014-07-29 | 2018-09-25 | Nanometrics Incorporated | Optical metrology with purged reference chip |
US9740109B2 (en) * | 2014-11-28 | 2017-08-22 | Canon Kabushiki Kaisha | Holding device, lithography apparatus, and method for manufacturing item |
US9960070B2 (en) | 2014-12-06 | 2018-05-01 | Kla-Tencor Corporation | Chucking warped wafer with bellows |
CN107004574B (zh) * | 2014-12-12 | 2020-06-30 | 佳能株式会社 | 基板保持装置、光刻设备以及物品制造方法 |
US10468288B2 (en) * | 2016-10-19 | 2019-11-05 | Kla-Tencor Corporation | Methods and systems for chucking a warped wafer |
-
2016
- 2016-12-19 US US15/383,207 patent/US10468288B2/en active Active
-
2017
- 2017-10-18 CN CN201780064161.9A patent/CN109891571B/zh active Active
- 2017-10-18 WO PCT/US2017/057244 patent/WO2018075675A1/en unknown
- 2017-10-18 KR KR1020197013811A patent/KR102442238B1/ko active IP Right Grant
- 2017-10-18 EP EP17862450.8A patent/EP3507827B1/en active Active
- 2017-10-18 SG SG11201902750WA patent/SG11201902750WA/en unknown
- 2017-10-19 TW TW106135848A patent/TWI751209B/zh active
-
2019
- 2019-04-01 IL IL265746A patent/IL265746B2/en unknown
Also Published As
Publication number | Publication date |
---|---|
IL265746B1 (en) | 2023-03-01 |
US10468288B2 (en) | 2019-11-05 |
EP3507827A1 (en) | 2019-07-10 |
KR102442238B1 (ko) | 2022-09-08 |
WO2018075675A1 (en) | 2018-04-26 |
IL265746B2 (en) | 2023-07-01 |
US20180108559A1 (en) | 2018-04-19 |
TWI751209B (zh) | 2022-01-01 |
TW201820525A (zh) | 2018-06-01 |
CN109891571B (zh) | 2023-09-01 |
KR20190058664A (ko) | 2019-05-29 |
EP3507827A4 (en) | 2020-04-08 |
IL265746A (en) | 2019-06-30 |
EP3507827B1 (en) | 2024-04-17 |
CN109891571A (zh) | 2019-06-14 |
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