SG11201811323XA - Fluidic devices and methods of manufacturing the same - Google Patents
Fluidic devices and methods of manufacturing the sameInfo
- Publication number
- SG11201811323XA SG11201811323XA SG11201811323XA SG11201811323XA SG11201811323XA SG 11201811323X A SG11201811323X A SG 11201811323XA SG 11201811323X A SG11201811323X A SG 11201811323XA SG 11201811323X A SG11201811323X A SG 11201811323XA SG 11201811323X A SG11201811323X A SG 11201811323XA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- illumina
- radiation
- bonding interface
- san diego
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 6
- 230000005855 radiation Effects 0.000 abstract 3
- 239000011358 absorbing material Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 230000008520 organization Effects 0.000 abstract 1
Classifications
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- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
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- B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
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- G01N15/1484—Optical investigation techniques, e.g. flow cytometry microstructural devices
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- G01N27/416—Systems
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- G01N27/44756—Apparatus specially adapted therefor
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- G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
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- B81B2201/04—Optical MEMS
- B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/054—Microvalves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/037—Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
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Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 111111111111111111111111111111111111111111111111111111111111111111# Organization (10) International Publication Number International Bureau (43) International Publication Date ......0\" WO 2018/144138 Al 09 August 2018 (09.08.2018) WIP0 I PCT (51) International Patent Classification: (81) Designated States (unless otherwise indicated, for every BOIL 3/00 (2006.01) GO1N 15/14 (2006.01) kind of national protection available): AE, AG, AL, AM, (21) International Application Number: AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, PCT/US2017/065855 CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, (22) International Filing Date: HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, 12 December 2017 (12.12.2017) KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, (25) Filing Language: English OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, (26) Publication Language: English SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, (30) Priority Data: TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. 62/452,923 31 January 2017 (31.01.2017) US (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, (71) Applicant: ILLUMINA, INC. [US/US]; 5200 Illumina GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, Way, San Diego, CA 92122 (US). UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, (72) Inventors: EARNEY, John, Gerhardt; 5200 Illumina TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, Way, San Diego, CA 92122 (US). FULLERTON, Justin; EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, 5200 Illumina Way, San Diego, CA 92122 (US). SMITH, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, Kaleb; 5200 Illumina Way, San Diego, CA 92122 (US). TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, _ VENKATESAN, Bala, Murali, K.; 499 Illinois Street, KM, ML, MR, NE, SN, TD, TG). Suite 210, San Francisco, CA 94158 (US). = Declarations under Rule 4.17: (74) Agent: DIERKER, Julia, Church et al.; Dierker & Ka- — as to the identity of the inventor (Rule 4.17(i)) = vanaugh, P.C., 3331 W. Big Beaver Road, Suite 109, Troy, _ as to applicant's entitlement to apply for and be granted a MI 48084 (US). patent (Rule 4.1700) = = (54) Title: FLUIDIC DEVICES AND METHODS OF MANUFACTURING THE SAME (57) : An example method includes providing a working stack having a = first substrate layer, a second substrate layer, and a radiation-absorbing material = disposed between the first and second substrate layers. The working stack includes = 104 c--100 a cavity therein having a designated liquid. A bonding interface is defined between = = = the radiation-absorbing material and at least one of the first substrate layer or the second substrate layer. The bonding interface has a film of the designated liquid. The method also includes directing radiation onto the bonding interface to form a seal. The seal separates the cavity from an outer area of the perimeter perimeter 112 0 bonding interface. The method also includes directing the radiation the outer onto = = = area of the bonding interface to secure the first and second substrate layers together. The perimeter seal impedes an ingress of bubbles from the outer area into the cavity — = as the radiation is directed onto the outer area. _ = L Il GC M Il 7r 71' FIG. 1 1-1 --.... 00 1-1 0 ei C [Continued on next page] WO 2018/144138 Al MIDEDIMOMMIONEEMOMMMOIVOMMODEVOIMI Published: — with international search report (Art. 21(3))
Applications Claiming Priority (2)
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US201762452923P | 2017-01-31 | 2017-01-31 | |
PCT/US2017/065855 WO2018144138A1 (en) | 2017-01-31 | 2017-12-12 | Fluidic devices and methods of manufacturing the same |
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SG11201811323XA true SG11201811323XA (en) | 2019-01-30 |
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SG11201811323XA SG11201811323XA (en) | 2017-01-31 | 2017-12-12 | Fluidic devices and methods of manufacturing the same |
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US (1) | US10688488B2 (en) |
EP (1) | EP3468719A4 (en) |
JP (1) | JP7048516B2 (en) |
KR (1) | KR102578932B1 (en) |
CN (1) | CN109311013B (en) |
AU (1) | AU2017396784B2 (en) |
BR (1) | BR112018074099B1 (en) |
CA (2) | CA3101710C (en) |
IL (1) | IL262688B (en) |
MX (1) | MX2019007949A (en) |
MY (1) | MY193117A (en) |
RU (1) | RU2710567C1 (en) |
SA (1) | SA518400532B1 (en) |
SG (1) | SG11201811323XA (en) |
TW (1) | TWI753065B (en) |
WO (1) | WO2018144138A1 (en) |
Families Citing this family (5)
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WO2021035044A1 (en) * | 2019-08-20 | 2021-02-25 | Pattern Bioscience, Inc. | Microfluidic chips including a gutter to facilitate loading thereof and related methods |
TW202138866A (en) | 2019-12-06 | 2021-10-16 | 美商伊路米納有限公司 | Apparatus and method of estimating values from images |
TW202138867A (en) | 2019-12-06 | 2021-10-16 | 美商伊路米納有限公司 | Apparatus and method of providing parameter estimation |
CN113371676A (en) * | 2020-03-10 | 2021-09-10 | 上海新微技术研发中心有限公司 | Microstructure and processing method thereof |
WO2022155087A1 (en) * | 2021-01-12 | 2022-07-21 | Corning Incorporated | Liquid lenses with concentric laser bond paths and methods of making the same |
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WO1996039260A1 (en) * | 1995-06-06 | 1996-12-12 | David Sarnoff Research Center, Inc. | Method of producing micro-electrical conduits |
JPH11326891A (en) * | 1998-05-08 | 1999-11-26 | Matsushita Electric Ind Co Ltd | Liquid crystal display panel and liquid crystal display using the same |
EP1048972A3 (en) * | 1999-04-30 | 2004-03-10 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal display element and manufacturing method thereof |
WO2002028509A2 (en) * | 2000-10-06 | 2002-04-11 | Protasis Corporation | Fluid separation conduit cartridge |
TW556044B (en) * | 2001-02-15 | 2003-10-01 | Sipix Imaging Inc | Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web |
US6816226B2 (en) * | 2001-05-22 | 2004-11-09 | Koninklijke Philips Electronics N.V. | Plastic display device with peripheral seal |
IL159682A0 (en) | 2001-07-02 | 2004-06-20 | Aimsco Ltd | Use of polyclonal anti-hiv goat serum as a therapeutic agent |
JP2003216059A (en) * | 2002-01-24 | 2003-07-30 | Sharp Corp | Indicating element and method of manufacturing the same |
US20060234042A1 (en) * | 2002-09-05 | 2006-10-19 | Rui Yang | Etched dielectric film in microfluidic devices |
AU2003287876A1 (en) * | 2002-12-11 | 2004-06-30 | Inverness Medical Switzerland Gmbh | Micro-fluidic structure, method and apparatus for its production, and use thereof |
CN104525072A (en) * | 2005-03-23 | 2015-04-22 | 维罗西股份有限公司 | Surface features in microprocess technology |
JP3798419B2 (en) | 2005-08-29 | 2006-07-19 | シャープ株式会社 | Manufacturing method of liquid crystal display panel |
US8445840B2 (en) * | 2007-09-07 | 2013-05-21 | Bruker Biospin Corporation | Imaging target for testing quality of multiple-magnification focus and image co-registration |
EP2070594A1 (en) | 2007-12-14 | 2009-06-17 | Koninklijke Philips Electronics N.V. | Microfluidic device and method of making the same and sensor incorporating the same |
CN102834763B (en) * | 2010-02-02 | 2015-07-22 | 皮克斯特罗尼克斯公司 | Methods for manufacturing cold seal fluid-filled display apparatus |
US8796109B2 (en) | 2010-12-23 | 2014-08-05 | Medtronic, Inc. | Techniques for bonding substrates using an intermediate layer |
JP2012223889A (en) * | 2011-04-15 | 2012-11-15 | Hitachi Ltd | Method for laser bonding |
EP2608255A1 (en) * | 2011-12-23 | 2013-06-26 | Micronit Microfluidics B.V. | Method of bonding two substrates and device manufactured thereby |
DE102012212650A1 (en) * | 2012-07-19 | 2014-01-23 | Robert Bosch Gmbh | A microfluidic storage device for pre-storing a fluid, a method of making the same, and a use thereof |
US20160023208A1 (en) * | 2013-03-13 | 2016-01-28 | Illumina, Inc. | Multilayer fluidic devices and methods for their fabrication |
CN105377783B (en) * | 2013-05-10 | 2019-03-08 | 康宁股份有限公司 | Laser welding is carried out to transparent glass sheet using low melt glass or thin absorbing film |
EP2851121B1 (en) | 2013-09-20 | 2022-11-02 | thinXXS Microtechnology GmbH | Devices for and methods of forming microchannels or microfluid reservoirs |
KR102019973B1 (en) | 2013-11-20 | 2019-11-04 | (주)바이오니아 | Micro Chamber Plate |
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2017
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- 2017-12-12 US US15/839,509 patent/US10688488B2/en active Active
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2018
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- 2018-11-27 SA SA518400532A patent/SA518400532B1/en unknown
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CA3101710A1 (en) | 2018-08-09 |
KR102578932B1 (en) | 2023-09-14 |
US10688488B2 (en) | 2020-06-23 |
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EP3468719A1 (en) | 2019-04-17 |
CN109311013A (en) | 2019-02-05 |
AU2017396784A1 (en) | 2018-11-22 |
WO2018144138A1 (en) | 2018-08-09 |
SA518400532B1 (en) | 2022-07-24 |
NZ747846A (en) | 2021-01-29 |
CA3022831A1 (en) | 2018-08-09 |
IL262688A (en) | 2018-12-31 |
RU2710567C1 (en) | 2019-12-27 |
CN109311013B (en) | 2021-06-04 |
MX2019007949A (en) | 2019-11-12 |
EP3468719A4 (en) | 2019-11-13 |
JP2020507444A (en) | 2020-03-12 |
AU2017396784B2 (en) | 2022-06-02 |
KR20190104863A (en) | 2019-09-11 |
CA3101710C (en) | 2023-05-09 |
JP7048516B2 (en) | 2022-04-05 |
BR112018074099A2 (en) | 2019-08-13 |
MY193117A (en) | 2022-09-26 |
TWI753065B (en) | 2022-01-21 |
CA3022831C (en) | 2021-02-02 |
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