SG11201811752WA - Edge exposure device and method - Google Patents
Edge exposure device and methodInfo
- Publication number
- SG11201811752WA SG11201811752WA SG11201811752WA SG11201811752WA SG11201811752WA SG 11201811752W A SG11201811752W A SG 11201811752WA SG 11201811752W A SG11201811752W A SG 11201811752WA SG 11201811752W A SG11201811752W A SG 11201811752WA SG 11201811752W A SG11201811752W A SG 11201811752WA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- edge exposure
- units
- exposure device
- edge
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
- G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610506802.9A CN107561864B (zh) | 2016-06-30 | 2016-06-30 | 边缘曝光装置和方法 |
PCT/CN2017/091008 WO2018001347A1 (zh) | 2016-06-30 | 2017-06-30 | 边缘曝光装置和方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201811752WA true SG11201811752WA (en) | 2019-01-30 |
Family
ID=60785949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201811752WA SG11201811752WA (en) | 2016-06-30 | 2017-06-30 | Edge exposure device and method |
Country Status (7)
Country | Link |
---|---|
US (1) | US10782614B2 (zh) |
JP (1) | JP6810170B2 (zh) |
KR (1) | KR102177237B1 (zh) |
CN (1) | CN107561864B (zh) |
SG (1) | SG11201811752WA (zh) |
TW (1) | TWI639061B (zh) |
WO (1) | WO2018001347A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111752108A (zh) * | 2019-03-28 | 2020-10-09 | 上海微电子装备(集团)股份有限公司 | 一种led照明装置及曝光机 |
CN111092039B (zh) * | 2019-12-30 | 2022-04-15 | 武汉大学 | 一种晶片传输系统 |
CN113467202B (zh) * | 2020-03-30 | 2023-02-07 | 上海微电子装备(集团)股份有限公司 | 光刻设备及硅片预对准方法 |
CN114972237A (zh) * | 2022-05-20 | 2022-08-30 | 苏州康钛检测科技有限公司 | 晶圆检测模型构建方法及检测方法 |
CN115547915B (zh) * | 2022-11-28 | 2023-02-14 | 四川上特科技有限公司 | 一种晶圆曝光夹具及曝光装置 |
CN117111414B (zh) * | 2023-10-23 | 2023-12-22 | 张家港中贺自动化科技有限公司 | 一种光刻图像的在线自动生成方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58139144A (ja) * | 1982-02-13 | 1983-08-18 | Nec Corp | 目合せ露光装置 |
US5168304A (en) * | 1988-08-22 | 1992-12-01 | Nikon Corporation | Exposure apparatus |
JPH03153020A (ja) * | 1989-11-10 | 1991-07-01 | Seiko Epson Corp | 露光装置 |
JPH05343294A (ja) * | 1992-06-10 | 1993-12-24 | Nec Corp | 縮小投影露光装置 |
JPH08335545A (ja) * | 1995-06-07 | 1996-12-17 | Hitachi Ltd | 露光方法および装置 |
JPH0950951A (ja) * | 1995-08-04 | 1997-02-18 | Nikon Corp | リソグラフィ方法およびリソグラフィ装置 |
TW316322B (zh) * | 1995-10-02 | 1997-09-21 | Ushio Electric Inc | |
WO2001082001A1 (en) * | 2000-04-26 | 2001-11-01 | Advanced Micro Devices, Inc. | Lithography system with device for exposing the periphery of a wafer |
KR20030006828A (ko) * | 2001-07-16 | 2003-01-23 | 삼성전자 주식회사 | 에지 노광장치를 갖는 프리얼라인먼트 시스템 |
KR20040079493A (ko) * | 2003-03-07 | 2004-09-16 | 주식회사 하이닉스반도체 | 노광장치 및 노광처리 방법 |
US20050248754A1 (en) * | 2004-05-05 | 2005-11-10 | Chun-Sheng Wang | Wafer aligner with WEE (water edge exposure) function |
JP5132108B2 (ja) * | 2006-02-02 | 2013-01-30 | 株式会社Sokudo | 基板処理装置 |
JP2007294817A (ja) | 2006-04-27 | 2007-11-08 | Sokudo:Kk | 基板処理方法、基板処理システムおよび基板処理装置 |
CN101201555A (zh) * | 2007-12-21 | 2008-06-18 | 清华大学 | 一种采用传送带结构的光刻机硅片台双台交换系统 |
CN101498897B (zh) * | 2008-12-17 | 2011-11-30 | 上海微电子装备有限公司 | 边缘曝光装置及其控制方法 |
CN102157421B (zh) * | 2010-02-11 | 2013-01-16 | 上海微电子装备有限公司 | 一种硅片预对准装置及预对准方法 |
CN102842485B (zh) * | 2011-06-23 | 2016-01-20 | 上海微电子装备有限公司 | 硅片处理装置及其处理方法 |
JP5954125B2 (ja) | 2012-02-07 | 2016-07-20 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
CN202534640U (zh) * | 2012-03-30 | 2012-11-14 | 上海微电子装备有限公司 | 硅片传输系统 |
CN105372941A (zh) * | 2014-08-28 | 2016-03-02 | 上海微电子装备有限公司 | 一种提供玻璃基板边缘曝光的多功能曝光机 |
CN105632971B (zh) * | 2014-11-26 | 2019-06-25 | 上海微电子装备(集团)股份有限公司 | 一种硅片处理装置及方法 |
-
2016
- 2016-06-30 CN CN201610506802.9A patent/CN107561864B/zh active Active
-
2017
- 2017-06-30 SG SG11201811752WA patent/SG11201811752WA/en unknown
- 2017-06-30 JP JP2018568682A patent/JP6810170B2/ja active Active
- 2017-06-30 TW TW106122015A patent/TWI639061B/zh active
- 2017-06-30 KR KR1020197002150A patent/KR102177237B1/ko active IP Right Grant
- 2017-06-30 US US16/314,199 patent/US10782614B2/en active Active
- 2017-06-30 WO PCT/CN2017/091008 patent/WO2018001347A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW201812462A (zh) | 2018-04-01 |
US10782614B2 (en) | 2020-09-22 |
US20200089119A1 (en) | 2020-03-19 |
KR20190021391A (ko) | 2019-03-05 |
JP6810170B2 (ja) | 2021-01-06 |
CN107561864B (zh) | 2019-10-25 |
CN107561864A (zh) | 2018-01-09 |
JP2019519818A (ja) | 2019-07-11 |
TWI639061B (zh) | 2018-10-21 |
WO2018001347A1 (zh) | 2018-01-04 |
KR102177237B1 (ko) | 2020-11-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201811752WA (en) | Edge exposure device and method | |
SG10201807897WA (en) | Semi-automatic prober | |
MX2019001806A (es) | Seguidor solar con acoplamiento cinematico. | |
MX2015009955A (es) | Arreglo de paneles solares con varios sistemas de soporte de seguimiento alineados. | |
SG11201906123VA (en) | Method for random access and terminal device | |
MX2018013089A (es) | Sistemas y metodos para dispositivos fotovoltaicos organicos transparentes. | |
ES2658750T3 (es) | Aparato láser modular | |
SG11201900881YA (en) | Laser irradiation device, laser irradiation method, and semiconductor device manufacturing method | |
MY176189A (en) | Method and device for cutting wafers | |
ES2587179T3 (es) | Dispositivo para enrollar y desenrollar un cable y método para enrollar un cable | |
MX2019002759A (es) | Modulo flotante para plataformas de paneles solares modulares. | |
SG10201709216VA (en) | Methods, apparatus, computer programs and non-transitory computer readable storage mediums for controlling a hyper redundant manipulator | |
MY188301A (en) | Multi-chip self adjusting cooling solution | |
ES2576327T3 (es) | Disyuntor | |
MX2021000424A (es) | Sistemas y metodos para centrar un objeto circular. | |
CN104062752A (zh) | 一种使用较为舒适方便的显微镜 | |
SG10201708010QA (en) | System and method for mounting a flip chip | |
MX2020010331A (es) | Dispositivo de pantalla y sustrato de matriz. | |
PE20181227A1 (es) | Metodo para determinar perdidas electricas de una linea de potencia, debido a un mal funcionamiento o alteracion de un contador de electricidad y/o a una conexion ilegal a dicha linea de potencia | |
EA201992405A1 (ru) | Система управления | |
KR20180084453A (ko) | 태빙 장치 용 와이어 고정 장치 | |
JP1704216S (ja) | バッテリー充電器 | |
JP1704215S (ja) | バッテリー充電器 | |
DE502006000431D1 (de) | Wafertisch zum bereitstellen von elektrischen bauelementen und vorrichtung zum bestücken von substraten mit den bauelementen | |
MY186082A (en) | Semiconductor die sorting and test handler system and method therefor |