SG10201708010QA - System and method for mounting a flip chip - Google Patents

System and method for mounting a flip chip

Info

Publication number
SG10201708010QA
SG10201708010QA SG10201708010QA SG10201708010QA SG10201708010QA SG 10201708010Q A SG10201708010Q A SG 10201708010QA SG 10201708010Q A SG10201708010Q A SG 10201708010QA SG 10201708010Q A SG10201708010Q A SG 10201708010QA SG 10201708010Q A SG10201708010Q A SG 10201708010QA
Authority
SG
Singapore
Prior art keywords
mounting
flip chip
rotate
chip
engagement
Prior art date
Application number
SG10201708010QA
Inventor
Jong Jae Jung
Yun Suk Shin
Deok Chun Jang
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Priority to SG10201708010QA priority Critical patent/SG10201708010QA/en
Priority to PCT/SG2018/050465 priority patent/WO2019066722A1/en
Priority to TW107134213A priority patent/TW201921559A/en
Publication of SG10201708010QA publication Critical patent/SG10201708010QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
    • H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
    • H01L2224/75802—Rotational mechanism

Abstract

SYSTEM AND METHOD FOR MOUNTING A FLIP CHIP A system for mounting a flip chip, comprising: at least one flipper arm, having an engagement end; said flipper arm arranged to rotate in a vertical plane; said engagement end arranged to engage a chip and, on engagement, rotate 180°. Figure 1
SG10201708010QA 2017-09-28 2017-09-28 System and method for mounting a flip chip SG10201708010QA (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG10201708010QA SG10201708010QA (en) 2017-09-28 2017-09-28 System and method for mounting a flip chip
PCT/SG2018/050465 WO2019066722A1 (en) 2017-09-28 2018-09-12 System and method for mounting a flip chip
TW107134213A TW201921559A (en) 2017-09-28 2018-09-28 System and method for mounting a flip chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201708010QA SG10201708010QA (en) 2017-09-28 2017-09-28 System and method for mounting a flip chip

Publications (1)

Publication Number Publication Date
SG10201708010QA true SG10201708010QA (en) 2019-04-29

Family

ID=65900735

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201708010QA SG10201708010QA (en) 2017-09-28 2017-09-28 System and method for mounting a flip chip

Country Status (3)

Country Link
SG (1) SG10201708010QA (en)
TW (1) TW201921559A (en)
WO (1) WO2019066722A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111584398B (en) * 2020-05-12 2023-06-27 武汉国创科光电装备有限公司 Efficient chip mounting equipment for flexible electronic manufacturing
CN112967949B (en) * 2020-08-11 2022-05-20 重庆康佳光电技术研究院有限公司 Transfer member, transfer device and transfer method
CN114131169B (en) * 2021-11-26 2022-08-23 深圳市鸿光盛业电子有限公司 Automatic hot pressing bonding professional equipment of encapsulation chip

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966903A (en) * 1998-05-27 1999-10-19 Lucent Technologies Inc. High speed flip-chip dispensing
SG147353A1 (en) * 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
KR20120013732A (en) * 2010-08-06 2012-02-15 삼성전자주식회사 Apparatuses for Bump Reflow and Method of Forming Bump Using the Same

Also Published As

Publication number Publication date
WO2019066722A1 (en) 2019-04-04
TW201921559A (en) 2019-06-01

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