SG11201802958QA - Cooling device and refrigerant relay device - Google Patents
Cooling device and refrigerant relay deviceInfo
- Publication number
- SG11201802958QA SG11201802958QA SG11201802958QA SG11201802958QA SG11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA SG 11201802958Q A SG11201802958Q A SG 11201802958QA
- Authority
- SG
- Singapore
- Prior art keywords
- refrigerant relay
- cooling device
- cooling
- relay device
- refrigerant
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B43/00—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/01—Heaters
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015203538A JP6170110B2 (ja) | 2015-10-15 | 2015-10-15 | 冷却装置および冷媒中継装置 |
PCT/JP2016/004592 WO2017064871A1 (fr) | 2015-10-15 | 2016-10-14 | Dispositif de refroidissement et dispositif de relais de fluide frigorigène |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201802958QA true SG11201802958QA (en) | 2018-05-30 |
Family
ID=58517976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201802958QA SG11201802958QA (en) | 2015-10-15 | 2016-10-14 | Cooling device and refrigerant relay device |
Country Status (5)
Country | Link |
---|---|
US (1) | US10788270B2 (fr) |
EP (1) | EP3364139B1 (fr) |
JP (1) | JP6170110B2 (fr) |
SG (1) | SG11201802958QA (fr) |
WO (1) | WO2017064871A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6424936B1 (ja) | 2017-10-04 | 2018-11-21 | 日本電気株式会社 | 気液分離装置、リアドア、冷却装置、及び気液分離方法 |
JP6579633B2 (ja) * | 2017-10-20 | 2019-09-25 | Necプラットフォームズ株式会社 | 装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5477583A (en) | 1977-12-02 | 1979-06-21 | Mitsubishi Electric Corp | Semiconductor device and production of the same |
US4314601A (en) * | 1978-10-04 | 1982-02-09 | Giuffre Anthony A | Heat exchange system for recycling waste heat |
JPS5911456Y2 (ja) * | 1979-06-05 | 1984-04-09 | 三菱電機株式会社 | 沸騰冷却装置 |
DE3328990C2 (de) | 1983-08-11 | 1985-12-12 | Pelikan Ag, 3000 Hannover | Thermofarbband sowie Verfahren zu dessen Herstellung |
JPH0328283Y2 (fr) * | 1985-04-15 | 1991-06-18 | ||
JP2827931B2 (ja) | 1994-11-21 | 1998-11-25 | 松下電器産業株式会社 | 熱搬送装置 |
US5857347A (en) | 1997-03-04 | 1999-01-12 | Frigoscandia Equipment Ab | Refrigeration system and a separator therefor |
JP2003240385A (ja) * | 2002-02-19 | 2003-08-27 | Daikin Ind Ltd | 空気調和機 |
JP2004349551A (ja) | 2003-05-23 | 2004-12-09 | Denso Corp | 沸騰冷却システム |
JP2006039916A (ja) * | 2004-07-27 | 2006-02-09 | Internatl Business Mach Corp <Ibm> | 冷却構造を備えた電子機器、冷却構造物、および電子機器の冷却方法 |
JP2009008349A (ja) | 2007-06-29 | 2009-01-15 | Daikin Ind Ltd | 気液分離器 |
AU2010266750B2 (en) | 2009-06-29 | 2013-04-18 | John Bean Technologies Ab | Device and method for providing additional head to support a refrigeration liquid feed system |
JP5780166B2 (ja) | 2011-02-11 | 2015-09-16 | 株式会社デンソー | ヒートポンプサイクル |
JP2013139908A (ja) * | 2011-12-28 | 2013-07-18 | Daikin Industries Ltd | 気液分離器及び冷凍装置 |
EP2816881B1 (fr) | 2012-02-14 | 2018-10-03 | Nec Corporation | Dispositif de refroidissement et système de refroidissement |
US9612046B2 (en) | 2012-12-14 | 2017-04-04 | Mahle International Gmbh | Sub-cooled condenser having a receiver tank with a refrigerant diverter for improved filling efficiency |
JP6079212B2 (ja) * | 2012-12-20 | 2017-02-15 | 富士通株式会社 | 冷却装置、電子装置および冷却方法 |
EP3081883A4 (fr) | 2013-11-14 | 2017-09-13 | Nec Corporation | Structure de tuyauterie, dispositif de refroidissement l'utilisant et procédé de transport de vapeur de réfrigérant |
DE102014205086B3 (de) | 2014-03-19 | 2015-07-23 | Areva Gmbh | Passiver Zweiphasen-Kühlkreislauf |
JP6919612B2 (ja) | 2018-03-27 | 2021-08-18 | オムロン株式会社 | 非接触給電装置 |
-
2015
- 2015-10-15 JP JP2015203538A patent/JP6170110B2/ja active Active
-
2016
- 2016-10-14 WO PCT/JP2016/004592 patent/WO2017064871A1/fr active Application Filing
- 2016-10-14 EP EP16855125.7A patent/EP3364139B1/fr active Active
- 2016-10-14 US US15/768,306 patent/US10788270B2/en active Active
- 2016-10-14 SG SG11201802958QA patent/SG11201802958QA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US10788270B2 (en) | 2020-09-29 |
EP3364139A1 (fr) | 2018-08-22 |
EP3364139A4 (fr) | 2019-06-19 |
WO2017064871A1 (fr) | 2017-04-20 |
EP3364139B1 (fr) | 2021-01-27 |
US20180313612A1 (en) | 2018-11-01 |
JP2017075736A (ja) | 2017-04-20 |
JP6170110B2 (ja) | 2017-07-26 |
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