SG11201710110TA - Substrate inspection method, computer storage medium and substrate inspection apparatus - Google Patents

Substrate inspection method, computer storage medium and substrate inspection apparatus

Info

Publication number
SG11201710110TA
SG11201710110TA SG11201710110TA SG11201710110TA SG11201710110TA SG 11201710110T A SG11201710110T A SG 11201710110TA SG 11201710110T A SG11201710110T A SG 11201710110TA SG 11201710110T A SG11201710110T A SG 11201710110TA SG 11201710110T A SG11201710110T A SG 11201710110TA
Authority
SG
Singapore
Prior art keywords
substrate inspection
storage medium
computer storage
inspection apparatus
inspection method
Prior art date
Application number
SG11201710110TA
Other languages
English (en)
Inventor
Takuya Mori
Makoto Hayakawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG11201710110TA publication Critical patent/SG11201710110TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Robotics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG11201710110TA 2015-06-08 2016-05-13 Substrate inspection method, computer storage medium and substrate inspection apparatus SG11201710110TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015115941A JP6329923B2 (ja) 2015-06-08 2015-06-08 基板の検査方法、コンピュータ記憶媒体及び基板検査装置
PCT/JP2016/064250 WO2016199539A1 (ja) 2015-06-08 2016-05-13 基板の検査方法、コンピュータ記憶媒体及び基板検査装置

Publications (1)

Publication Number Publication Date
SG11201710110TA true SG11201710110TA (en) 2018-01-30

Family

ID=57504829

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201710110TA SG11201710110TA (en) 2015-06-08 2016-05-13 Substrate inspection method, computer storage medium and substrate inspection apparatus

Country Status (7)

Country Link
US (1) US10539514B2 (zh)
JP (1) JP6329923B2 (zh)
KR (1) KR102631174B1 (zh)
CN (1) CN107636450B (zh)
SG (1) SG11201710110TA (zh)
TW (1) TWI647772B (zh)
WO (1) WO2016199539A1 (zh)

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* Cited by examiner, † Cited by third party
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JP6986916B2 (ja) * 2017-10-04 2021-12-22 新東エスプレシジョン株式会社 検査装置及び検査方法
JP7012156B2 (ja) * 2018-06-21 2022-01-27 東京エレクトロン株式会社 基板の欠陥検査方法、記憶媒体及び基板の欠陥検査装置
JP7153987B2 (ja) * 2018-06-29 2022-10-17 ダイハツ工業株式会社 塗装欠陥の評価方法
JP7308337B2 (ja) * 2018-08-17 2023-07-13 東京エレクトロン株式会社 異常判定方法及び基板処理システム
CN109273385A (zh) * 2018-09-13 2019-01-25 德淮半导体有限公司 基于机械臂的晶圆缺陷检测方法、机械臂、半导体设备
JP7090005B2 (ja) * 2018-10-05 2022-06-23 東京エレクトロン株式会社 基板処理装置及び検査方法
JP7153521B2 (ja) * 2018-10-05 2022-10-14 東京エレクトロン株式会社 基板処理装置及び検査方法
JP7181068B2 (ja) 2018-11-30 2022-11-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN111650813B (zh) * 2019-03-04 2024-04-16 东京毅力科创株式会社 基板处理装置、基板检查装置及方法、以及记录介质
JP2020150155A (ja) * 2019-03-14 2020-09-17 株式会社荏原製作所 基板を研磨するための研磨装置を制御するための制御システム、および研磨方法
KR20220020346A (ko) * 2019-06-10 2022-02-18 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 검사 방법 및 기억 매체
JP7172919B2 (ja) * 2019-09-04 2022-11-16 トヨタ自動車株式会社 工程管理システム及び工程管理方法
WO2021088027A1 (en) * 2019-11-08 2021-05-14 Yangtze Memory Technologies Co., Ltd. Automatic assessment method and assessment system thereof for yield improvement
KR102342827B1 (ko) * 2019-11-18 2021-12-24 그린정보통신(주) 반도체 포토리소그래피 공정의 웨이퍼 결함 검출 시스템
TWI770785B (zh) * 2021-01-22 2022-07-11 南亞科技股份有限公司 半導體製造系統、測量裝置及半導體製造方法

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JP3524819B2 (ja) * 1999-07-07 2004-05-10 株式会社日立製作所 画像比較によるパターン検査方法およびその装置
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Also Published As

Publication number Publication date
JP6329923B2 (ja) 2018-05-23
KR20180015652A (ko) 2018-02-13
KR102631174B1 (ko) 2024-01-31
CN107636450A (zh) 2018-01-26
JP2017003358A (ja) 2017-01-05
WO2016199539A1 (ja) 2016-12-15
TWI647772B (zh) 2019-01-11
TW201724305A (zh) 2017-07-01
US20180156739A1 (en) 2018-06-07
CN107636450B (zh) 2020-09-08
US10539514B2 (en) 2020-01-21

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