SG11201708175TA - Method of preparing crosslinked pressure-sensitive adhesives using a light-emitting diode for crosslinking - Google Patents

Method of preparing crosslinked pressure-sensitive adhesives using a light-emitting diode for crosslinking

Info

Publication number
SG11201708175TA
SG11201708175TA SG11201708175TA SG11201708175TA SG11201708175TA SG 11201708175T A SG11201708175T A SG 11201708175TA SG 11201708175T A SG11201708175T A SG 11201708175TA SG 11201708175T A SG11201708175T A SG 11201708175TA SG 11201708175T A SG11201708175T A SG 11201708175TA
Authority
SG
Singapore
Prior art keywords
crosslinking
light
emitting diode
sensitive adhesives
crosslinked pressure
Prior art date
Application number
SG11201708175TA
Other languages
English (en)
Inventor
Robin E Wright
Petra Stegmaier
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201708175TA publication Critical patent/SG11201708175TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
SG11201708175TA 2015-04-13 2016-03-22 Method of preparing crosslinked pressure-sensitive adhesives using a light-emitting diode for crosslinking SG11201708175TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562146519P 2015-04-13 2015-04-13
PCT/US2016/023566 WO2016167924A1 (en) 2015-04-13 2016-03-22 Method of preparing crosslinked pressure-sensitive adhesives using a light-emitting diode for crosslinking

Publications (1)

Publication Number Publication Date
SG11201708175TA true SG11201708175TA (en) 2017-11-29

Family

ID=55650748

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708175TA SG11201708175TA (en) 2015-04-13 2016-03-22 Method of preparing crosslinked pressure-sensitive adhesives using a light-emitting diode for crosslinking

Country Status (7)

Country Link
US (1) US10920116B2 (enExample)
EP (1) EP3283591A1 (enExample)
JP (1) JP2018515642A (enExample)
KR (1) KR20170136572A (enExample)
CN (1) CN108633282A (enExample)
SG (1) SG11201708175TA (enExample)
WO (1) WO2016167924A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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US11660371B2 (en) * 2015-08-31 2023-05-30 3M Innovative Properties Company Negative pressure wound therapy dressings comprising (meth)acrylate pressure-sensitive adhesive with enhanced adhesion to wet surfaces
WO2018102179A1 (en) * 2016-12-02 2018-06-07 3M Innovative Properties Company Low dielectric optically clear adhesives for flexible electronic display
JP6347341B1 (ja) * 2017-08-09 2018-06-27 積水フーラー株式会社 紫外線硬化型アクリル系ポリマー及びその製造方法並びに紫外線硬化型ホットメルト接着剤
EP3724292B1 (en) 2017-12-14 2024-07-17 Avery Dennison Corporation Pressure sensitive adhesive with broad damping temperature and frequency range
EP3814442A1 (en) * 2018-06-29 2021-05-05 3M Innovative Properties Company Tapes and methods of use for masking aluminum surfaces in acid anodization
CN113508166A (zh) * 2018-12-27 2021-10-15 3M创新有限公司 可热熔加工的(甲基)丙烯酸酯基医用粘合剂
CN115315449B (zh) * 2020-03-25 2024-06-14 舒万诺知识产权公司 不含极性基团的医用压敏粘合剂
WO2021225778A1 (en) * 2020-05-05 2021-11-11 Henkel IP & Holding GmbH Radiation cross linkable acrylic hot melt pressure sensitive adhesive resins exhibiting improved uva photo cure

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US4619979A (en) 1984-03-28 1986-10-28 Minnesota Mining And Manufacturing Company Continuous free radial polymerization in a wiped-surface reactor
US4843134A (en) 1984-03-28 1989-06-27 Minnesota Mining And Manufacturing Company Acrylate pressure-sensitive adhesives containing insolubles
GB2170427B (en) 1985-02-01 1989-06-07 Sanyo Kokusaku Pulp Co Pressure-sensitive adhesive tapes or sheets
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Also Published As

Publication number Publication date
CN108633282A (zh) 2018-10-09
KR20170136572A (ko) 2017-12-11
US20180037775A1 (en) 2018-02-08
WO2016167924A1 (en) 2016-10-20
JP2018515642A (ja) 2018-06-14
US10920116B2 (en) 2021-02-16
EP3283591A1 (en) 2018-02-21

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