SG11201705917PA - Low density polishing pad - Google Patents
Low density polishing padInfo
- Publication number
- SG11201705917PA SG11201705917PA SG11201705917PA SG11201705917PA SG11201705917PA SG 11201705917P A SG11201705917P A SG 11201705917PA SG 11201705917P A SG11201705917P A SG 11201705917PA SG 11201705917P A SG11201705917P A SG 11201705917PA SG 11201705917P A SG11201705917P A SG 11201705917PA
- Authority
- SG
- Singapore
- Prior art keywords
- low density
- polishing pad
- density polishing
- pad
- low
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/22—After-treatment of expandable particles; Forming foamed products
- C08J9/228—Forming foamed products
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2475/04—Polyurethanes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/611,064 US10946495B2 (en) | 2015-01-30 | 2015-01-30 | Low density polishing pad |
PCT/US2016/013302 WO2016122888A1 (fr) | 2015-01-30 | 2016-01-13 | Tampon de polissage à faible densité |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201705917PA true SG11201705917PA (en) | 2017-08-30 |
Family
ID=55349946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201705917PA SG11201705917PA (en) | 2015-01-30 | 2016-01-13 | Low density polishing pad |
Country Status (9)
Country | Link |
---|---|
US (1) | US10946495B2 (fr) |
EP (1) | EP3250343B1 (fr) |
JP (1) | JP6810047B2 (fr) |
KR (1) | KR102532961B1 (fr) |
CN (1) | CN107206571B (fr) |
MY (1) | MY187247A (fr) |
SG (1) | SG11201705917PA (fr) |
TW (1) | TWI588885B (fr) |
WO (1) | WO2016122888A1 (fr) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10946495B2 (en) * | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
WO2017074773A1 (fr) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | Appareil et procédé de formation d'article de polissage ayant un potentiel zêta souhaité |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
KR102629800B1 (ko) | 2016-01-19 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10864612B2 (en) * | 2016-12-14 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad and method of using |
KR102285674B1 (ko) * | 2017-03-31 | 2021-08-04 | 후루카와 덴끼고교 가부시키가이샤 | 연마 패드 |
US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (fr) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Tampons à polir à distribution abrasive et leurs procédés de fabrication |
KR101949905B1 (ko) * | 2017-08-23 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
US20200171619A1 (en) * | 2017-08-25 | 2020-06-04 | 3M Innovative Properties Company | Surface projection polishing pad |
KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
KR102497825B1 (ko) * | 2020-09-29 | 2023-02-08 | 에스케이엔펄스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
CN114589620B (zh) * | 2020-12-03 | 2023-05-23 | 中国科学院微电子研究所 | 半导体研磨垫及制备方法 |
KR102512675B1 (ko) * | 2020-12-30 | 2023-03-21 | 에스케이엔펄스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS63283857A (ja) * | 1987-05-15 | 1988-11-21 | Asahi Chem Ind Co Ltd | 研磨布 |
CN1258241A (zh) * | 1997-04-18 | 2000-06-28 | 卡伯特公司 | 用于半导体底物的抛光垫 |
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US6231942B1 (en) | 1998-01-21 | 2001-05-15 | Trexel, Inc. | Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby |
JPH11322877A (ja) | 1998-05-12 | 1999-11-26 | Dainippon Ink & Chem Inc | 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物 |
KR100637887B1 (ko) * | 1998-12-28 | 2006-10-23 | 도소 가부시키가이샤 | 연마용 성형체, 이것을 이용한 연마용 정반 및 연마방법 |
JP2000344902A (ja) | 1999-06-04 | 2000-12-12 | Fuji Spinning Co Ltd | 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物 |
CN1484566A (zh) * | 2000-11-29 | 2004-03-24 | 皮斯洛奎斯特公司 | 用于化学-机械打磨的交联聚乙烯打磨垫、打磨装置和打磨方法 |
DE60106972T2 (de) * | 2000-12-27 | 2005-11-03 | Lam Research Corp., Fremont | Verfahren zur herstellung von verstärkten waferpolierkissen und diese verfahren implementierende vorrichtungen |
US6679758B2 (en) * | 2002-04-11 | 2004-01-20 | Saint-Gobain Abrasives Technology Company | Porous abrasive articles with agglomerated abrasives |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
US7025668B2 (en) | 2002-06-18 | 2006-04-11 | Raytech Innovative Solutions, Llc | Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
JP4555559B2 (ja) | 2003-11-25 | 2010-10-06 | 富士紡ホールディングス株式会社 | 研磨布及び研磨布の製造方法 |
US7195544B2 (en) | 2004-03-23 | 2007-03-27 | Cabot Microelectronics Corporation | CMP porous pad with component-filled pores |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
US7435364B2 (en) | 2005-04-11 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for forming a porous polishing pad |
US8133938B2 (en) | 2005-11-01 | 2012-03-13 | Ppg Industries Ohio, Inc. | Radiation diffraction colorants |
JP4986129B2 (ja) | 2007-01-15 | 2012-07-25 | 東洋ゴム工業株式会社 | 研磨パッド |
SG177963A1 (en) | 2007-01-15 | 2012-02-28 | Toyo Tire & Rubber Co | Polishing pad and method for producing the same |
EP2271463A4 (fr) * | 2008-04-01 | 2013-11-27 | Innopad Inc | Tampon de polissage avec production de vides contrôlée |
US20100035529A1 (en) * | 2008-08-05 | 2010-02-11 | Mary Jo Kulp | Chemical mechanical polishing pad |
TWI465315B (zh) | 2008-11-12 | 2014-12-21 | Bestac Advanced Material Co Ltd | 可導電之拋光墊及其製造方法 |
KR20110009096U (ko) * | 2009-01-15 | 2011-09-23 | 그라프텍 인터내셔널 홀딩스 인코포레이티드 | 복합재 공구세공 |
KR101186531B1 (ko) | 2009-03-24 | 2012-10-08 | 차윤종 | 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드 |
US9017140B2 (en) * | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US8702479B2 (en) * | 2010-10-15 | 2014-04-22 | Nexplanar Corporation | Polishing pad with multi-modal distribution of pore diameters |
JP5687119B2 (ja) | 2011-04-15 | 2015-03-18 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
JP5687118B2 (ja) | 2011-04-15 | 2015-03-18 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
JP5768554B2 (ja) | 2011-07-21 | 2015-08-26 | 旭硝子株式会社 | 磁気記録媒体用ガラス基板の製造方法および磁気記録媒体用ガラス基板 |
JP5945874B2 (ja) * | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
US9238294B2 (en) * | 2014-06-18 | 2016-01-19 | Nexplanar Corporation | Polishing pad having porogens with liquid filler |
US10946495B2 (en) * | 2015-01-30 | 2021-03-16 | Cmc Materials, Inc. | Low density polishing pad |
-
2015
- 2015-01-30 US US14/611,064 patent/US10946495B2/en active Active
-
2016
- 2016-01-13 KR KR1020177023773A patent/KR102532961B1/ko active IP Right Grant
- 2016-01-13 WO PCT/US2016/013302 patent/WO2016122888A1/fr active Application Filing
- 2016-01-13 CN CN201680008029.1A patent/CN107206571B/zh active Active
- 2016-01-13 JP JP2017540179A patent/JP6810047B2/ja active Active
- 2016-01-13 EP EP16704084.9A patent/EP3250343B1/fr active Active
- 2016-01-13 MY MYPI2017702675A patent/MY187247A/en unknown
- 2016-01-13 SG SG11201705917PA patent/SG11201705917PA/en unknown
- 2016-01-29 TW TW105102956A patent/TWI588885B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20170108087A (ko) | 2017-09-26 |
US20160221145A1 (en) | 2016-08-04 |
TWI588885B (zh) | 2017-06-21 |
EP3250343B1 (fr) | 2024-05-29 |
CN107206571A (zh) | 2017-09-26 |
TW201635366A (zh) | 2016-10-01 |
US10946495B2 (en) | 2021-03-16 |
MY187247A (en) | 2021-09-15 |
JP6810047B2 (ja) | 2021-01-06 |
EP3250343A1 (fr) | 2017-12-06 |
CN107206571B (zh) | 2022-12-06 |
JP2018509303A (ja) | 2018-04-05 |
KR102532961B1 (ko) | 2023-05-22 |
WO2016122888A1 (fr) | 2016-08-04 |
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