SG11201704442UA - Stress relief mems structure and package - Google Patents

Stress relief mems structure and package

Info

Publication number
SG11201704442UA
SG11201704442UA SG11201704442UA SG11201704442UA SG11201704442UA SG 11201704442U A SG11201704442U A SG 11201704442UA SG 11201704442U A SG11201704442U A SG 11201704442UA SG 11201704442U A SG11201704442U A SG 11201704442UA SG 11201704442U A SG11201704442U A SG 11201704442UA
Authority
SG
Singapore
Prior art keywords
package
stress relief
mems structure
mems
relief
Prior art date
Application number
SG11201704442UA
Other languages
English (en)
Inventor
Gu Lei
Stephen F Bart
Original Assignee
Mks Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mks Instr Inc filed Critical Mks Instr Inc
Publication of SG11201704442UA publication Critical patent/SG11201704442UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
SG11201704442UA 2015-02-06 2016-01-15 Stress relief mems structure and package SG11201704442UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/616,017 US9499393B2 (en) 2015-02-06 2015-02-06 Stress relief MEMS structure and package
PCT/US2016/013613 WO2016126405A1 (fr) 2015-02-06 2016-01-15 Structure mems d'élimination de contraintes et boîtier

Publications (1)

Publication Number Publication Date
SG11201704442UA true SG11201704442UA (en) 2017-06-29

Family

ID=56564504

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201704442UA SG11201704442UA (en) 2015-02-06 2016-01-15 Stress relief mems structure and package
SG10201906105RA SG10201906105RA (en) 2015-02-06 2016-01-15 Stress relief mems structure and package

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201906105RA SG10201906105RA (en) 2015-02-06 2016-01-15 Stress relief mems structure and package

Country Status (8)

Country Link
US (2) US9499393B2 (fr)
EP (1) EP3253708A4 (fr)
JP (1) JP6426848B2 (fr)
KR (1) KR102003945B1 (fr)
CN (1) CN107207244B (fr)
SG (2) SG11201704442UA (fr)
TW (1) TWI664137B (fr)
WO (1) WO2016126405A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
US10278281B1 (en) * 2015-10-30 2019-04-30 Garmin International, Inc. MEMS stress isolation and stabilization system
GB2555412A (en) * 2016-10-25 2018-05-02 Atlantic Inertial Systems Ltd Inertial sensor
CN109399557B (zh) * 2018-11-07 2020-05-05 中国电子科技集团公司第二十六研究所 一种高稳定性mems谐振器件的制造方法
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
US11795052B2 (en) * 2020-09-29 2023-10-24 Te Connectivity Solutions Gmbh Constraint for a sensor assembly
US11547995B2 (en) 2020-10-19 2023-01-10 Bio-Rad Laboratories, Inc. System and method for rapid multiplexed sample processing with applications for nucleic acid amplification assays
US11879800B2 (en) * 2021-03-29 2024-01-23 Rosemount Aerospace Inc. MEMS strain gauge pressure sensor with mechanical symmetries

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6073325A (ja) 1983-09-30 1985-04-25 Toshiba Corp 半導体圧力センサ
EP0551395A4 (en) 1990-09-27 1993-08-25 E.I. Du Pont De Nemours And Company Thermal stress-relieved composite microelectronic device
DE4107658A1 (de) * 1991-03-09 1992-09-17 Bosch Gmbh Robert Montageverfahren fuer mikromechanische sensoren
JPH0510838A (ja) * 1991-07-08 1993-01-19 Mitsubishi Electric Corp 圧力検出装置
JP3114403B2 (ja) * 1992-12-22 2000-12-04 富士電機株式会社 半導体圧力センサ
JPH10123166A (ja) * 1996-08-09 1998-05-15 Denso Corp 半導体加速度センサ
US20040099061A1 (en) 1997-12-22 2004-05-27 Mks Instruments Pressure sensor for detecting small pressure differences and low pressures
US6306684B1 (en) * 2000-03-16 2001-10-23 Microchip Technology Incorporated Stress reducing lead-frame for plastic encapsulation
JP2002134439A (ja) 2000-10-26 2002-05-10 Matsushita Electric Ind Co Ltd 半導体チップの製造方法と樹脂封止型半導体装置およびその製造方法
US6574033B1 (en) * 2002-02-27 2003-06-03 Iridigm Display Corporation Microelectromechanical systems device and method for fabricating same
TW540123B (en) 2002-06-14 2003-07-01 Siliconware Precision Industries Co Ltd Flip-chip semiconductor package with lead frame as chip carrier
US6989586B2 (en) 2003-03-31 2006-01-24 Intel Corporation Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems
JP4014006B2 (ja) 2004-06-17 2007-11-28 株式会社山武 圧力センサ
SG157362A1 (en) * 2004-11-04 2009-12-29 Microchips Inc Compression and cold weld sealing methods and devices
US7798010B2 (en) 2007-10-11 2010-09-21 Honeywell International Inc. Sensor geometry for improved package stress isolation
FR2933968B1 (fr) * 2008-07-18 2010-09-10 Thales Sa Dispositif electronique comportant des composants electroniques et au moins une interface a base de nanotubes et procede de fabrication
US8212346B2 (en) 2008-10-28 2012-07-03 Global Foundries, Inc. Method and apparatus for reducing semiconductor package tensile stress
JP5331504B2 (ja) * 2009-02-09 2013-10-30 株式会社フジクラ 圧力センサパッケージ、圧力センサモジュール並びに電子部品
DE102010012042A1 (de) 2010-03-19 2011-09-22 Epcos Ag Bauelement mit einem Chip in einem Hohlraum und einer spannungsreduzierten Befestigung
JP2012006092A (ja) * 2010-06-22 2012-01-12 Panasonic Corp Ｍｅｍｓデバイス及びその製造方法並びにｍｅｍｓデバイスを有するパッケージ
JP2012073233A (ja) * 2010-08-31 2012-04-12 Mitsumi Electric Co Ltd センサ装置及び半導体センサ素子の実装方法
US9632105B2 (en) * 2011-09-30 2017-04-25 Panasonic Intellectual Property Management Co., Ltd. Angular velocity sensor for suppressing fluctuation of detection sensitivity
US8925384B2 (en) 2012-05-29 2015-01-06 Freescale Semiconductor, Inc. MEMS sensor with stress isolation and method of fabrication
JP6002016B2 (ja) 2012-11-30 2016-10-05 アズビル株式会社 静電容量型圧力センサ
US9824924B2 (en) * 2013-03-29 2017-11-21 Stmicroelectronics Pte Ltd. Semiconductor packages having an electric device with a recess
JP6231812B2 (ja) 2013-08-09 2017-11-15 アズビル株式会社 静電容量型圧力センサ
JP2015068800A (ja) * 2013-09-30 2015-04-13 セイコーエプソン株式会社 圧力センサー、電子機器および移動体
DE102014200126A1 (de) * 2014-01-08 2014-12-04 Robert Bosch Gmbh Bauteil mit einem Halbleiterbauelement auf einem Träger
JP6126545B2 (ja) 2014-03-20 2017-05-10 アズビル株式会社 静電容量型圧力センサ
US9334153B1 (en) * 2014-11-03 2016-05-10 Hrl Laboratories, Llc MEMS device connected to a substrate by flexible support structures

Also Published As

Publication number Publication date
WO2016126405A1 (fr) 2016-08-11
KR102003945B1 (ko) 2019-07-25
CN107207244B (zh) 2020-01-03
TWI664137B (zh) 2019-07-01
SG10201906105RA (en) 2019-08-27
JP2018505064A (ja) 2018-02-22
EP3253708A4 (fr) 2018-08-01
JP6426848B2 (ja) 2018-11-21
US9499393B2 (en) 2016-11-22
EP3253708A1 (fr) 2017-12-13
KR20170109669A (ko) 2017-09-29
TW201636297A (zh) 2016-10-16
CN107207244A (zh) 2017-09-26
US20170036906A1 (en) 2017-02-09
US9850123B2 (en) 2017-12-26
US20160229688A1 (en) 2016-08-11

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