SG10201906105RA - Stress relief mems structure and package - Google Patents

Stress relief mems structure and package

Info

Publication number
SG10201906105RA
SG10201906105RA SG10201906105RA SG10201906105RA SG10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA
Authority
SG
Singapore
Prior art keywords
package
stress relief
mems structure
support
support members
Prior art date
Application number
SG10201906105RA
Inventor
Lei Gu
Stephen F Bart
Original Assignee
Mks Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mks Instr Inc filed Critical Mks Instr Inc
Publication of SG10201906105RA publication Critical patent/SG10201906105RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

STRESS RELIEF MEMS STRUCTURE AND PACKAGE Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor 5 having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support 10 member are configured to reduce stress produced by package-sensor interaction. FIG. 1 FIG.2
SG10201906105RA 2015-02-06 2016-01-15 Stress relief mems structure and package SG10201906105RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/616,017 US9499393B2 (en) 2015-02-06 2015-02-06 Stress relief MEMS structure and package

Publications (1)

Publication Number Publication Date
SG10201906105RA true SG10201906105RA (en) 2019-08-27

Family

ID=56564504

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201704442UA SG11201704442UA (en) 2015-02-06 2016-01-15 Stress relief mems structure and package
SG10201906105RA SG10201906105RA (en) 2015-02-06 2016-01-15 Stress relief mems structure and package

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201704442UA SG11201704442UA (en) 2015-02-06 2016-01-15 Stress relief mems structure and package

Country Status (8)

Country Link
US (2) US9499393B2 (en)
EP (1) EP3253708A4 (en)
JP (1) JP6426848B2 (en)
KR (1) KR102003945B1 (en)
CN (1) CN107207244B (en)
SG (2) SG11201704442UA (en)
TW (1) TWI664137B (en)
WO (1) WO2016126405A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
US10167189B2 (en) 2014-09-30 2019-01-01 Analog Devices, Inc. Stress isolation platform for MEMS devices
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
US10278281B1 (en) * 2015-10-30 2019-04-30 Garmin International, Inc. MEMS stress isolation and stabilization system
GB2555412A (en) * 2016-10-25 2018-05-02 Atlantic Inertial Systems Ltd Inertial sensor
CN109399557B (en) * 2018-11-07 2020-05-05 中国电子科技集团公司第二十六研究所 Manufacturing method of high-stability MEMS (micro-electromechanical systems) resonance device
US11417611B2 (en) 2020-02-25 2022-08-16 Analog Devices International Unlimited Company Devices and methods for reducing stress on circuit components
US11981560B2 (en) 2020-06-09 2024-05-14 Analog Devices, Inc. Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
US11795052B2 (en) * 2020-09-29 2023-10-24 Te Connectivity Solutions Gmbh Constraint for a sensor assembly
AU2021364598A1 (en) 2020-10-19 2023-06-08 Bio-Rad Laboratories, Inc. System and method for rapid multiplexed sample processing with applications for nucleic acid amplification assays
US11879800B2 (en) * 2021-03-29 2024-01-23 Rosemount Aerospace Inc. MEMS strain gauge pressure sensor with mechanical symmetries
EP4431449A1 (en) * 2023-03-17 2024-09-18 TE Connectivity Solutions GmbH Semiconductor die and method for attaching a semiconductor die to a solid structure with controlled fillet height

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US6306684B1 (en) * 2000-03-16 2001-10-23 Microchip Technology Incorporated Stress reducing lead-frame for plastic encapsulation
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Also Published As

Publication number Publication date
US20160229688A1 (en) 2016-08-11
US9499393B2 (en) 2016-11-22
TW201636297A (en) 2016-10-16
KR20170109669A (en) 2017-09-29
KR102003945B1 (en) 2019-07-25
JP6426848B2 (en) 2018-11-21
EP3253708A4 (en) 2018-08-01
EP3253708A1 (en) 2017-12-13
CN107207244B (en) 2020-01-03
JP2018505064A (en) 2018-02-22
WO2016126405A1 (en) 2016-08-11
SG11201704442UA (en) 2017-06-29
CN107207244A (en) 2017-09-26
TWI664137B (en) 2019-07-01
US20170036906A1 (en) 2017-02-09
US9850123B2 (en) 2017-12-26

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