SG10201906105RA - Stress relief mems structure and package - Google Patents
Stress relief mems structure and packageInfo
- Publication number
- SG10201906105RA SG10201906105RA SG10201906105RA SG10201906105RA SG10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA SG 10201906105R A SG10201906105R A SG 10201906105RA
- Authority
- SG
- Singapore
- Prior art keywords
- package
- stress relief
- mems structure
- support
- support members
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
STRESS RELIEF MEMS STRUCTURE AND PACKAGE Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor 5 having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support 10 member are configured to reduce stress produced by package-sensor interaction. FIG. 1 FIG.2
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/616,017 US9499393B2 (en) | 2015-02-06 | 2015-02-06 | Stress relief MEMS structure and package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201906105RA true SG10201906105RA (en) | 2019-08-27 |
Family
ID=56564504
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201704442UA SG11201704442UA (en) | 2015-02-06 | 2016-01-15 | Stress relief mems structure and package |
SG10201906105RA SG10201906105RA (en) | 2015-02-06 | 2016-01-15 | Stress relief mems structure and package |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201704442UA SG11201704442UA (en) | 2015-02-06 | 2016-01-15 | Stress relief mems structure and package |
Country Status (8)
Country | Link |
---|---|
US (2) | US9499393B2 (en) |
EP (1) | EP3253708A4 (en) |
JP (1) | JP6426848B2 (en) |
KR (1) | KR102003945B1 (en) |
CN (1) | CN107207244B (en) |
SG (2) | SG11201704442UA (en) |
TW (1) | TWI664137B (en) |
WO (1) | WO2016126405A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
US10131538B2 (en) | 2015-09-14 | 2018-11-20 | Analog Devices, Inc. | Mechanically isolated MEMS device |
US10278281B1 (en) * | 2015-10-30 | 2019-04-30 | Garmin International, Inc. | MEMS stress isolation and stabilization system |
GB2555412A (en) * | 2016-10-25 | 2018-05-02 | Atlantic Inertial Systems Ltd | Inertial sensor |
CN109399557B (en) * | 2018-11-07 | 2020-05-05 | 中国电子科技集团公司第二十六研究所 | Manufacturing method of high-stability MEMS (micro-electromechanical systems) resonance device |
US11417611B2 (en) | 2020-02-25 | 2022-08-16 | Analog Devices International Unlimited Company | Devices and methods for reducing stress on circuit components |
US11981560B2 (en) | 2020-06-09 | 2024-05-14 | Analog Devices, Inc. | Stress-isolated MEMS device comprising substrate having cavity and method of manufacture |
US11795052B2 (en) * | 2020-09-29 | 2023-10-24 | Te Connectivity Solutions Gmbh | Constraint for a sensor assembly |
AU2021364598A1 (en) | 2020-10-19 | 2023-06-08 | Bio-Rad Laboratories, Inc. | System and method for rapid multiplexed sample processing with applications for nucleic acid amplification assays |
US11879800B2 (en) * | 2021-03-29 | 2024-01-23 | Rosemount Aerospace Inc. | MEMS strain gauge pressure sensor with mechanical symmetries |
EP4431449A1 (en) * | 2023-03-17 | 2024-09-18 | TE Connectivity Solutions GmbH | Semiconductor die and method for attaching a semiconductor die to a solid structure with controlled fillet height |
Family Cites Families (30)
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JPS6073325A (en) | 1983-09-30 | 1985-04-25 | Toshiba Corp | Semiconductor pressure sensor |
WO1992006495A1 (en) | 1990-09-27 | 1992-04-16 | E.I. Du Pont De Nemours And Company | Thermal stress-relieved composite microelectronic device |
DE4107658A1 (en) * | 1991-03-09 | 1992-09-17 | Bosch Gmbh Robert | ASSEMBLY METHOD FOR MICROMECHANICAL SENSORS |
JPH0510838A (en) * | 1991-07-08 | 1993-01-19 | Mitsubishi Electric Corp | Pressure detecting device |
JP3114403B2 (en) * | 1992-12-22 | 2000-12-04 | 富士電機株式会社 | Semiconductor pressure sensor |
JPH10123166A (en) * | 1996-08-09 | 1998-05-15 | Denso Corp | Semiconductor acceleration sensor |
US20040099061A1 (en) | 1997-12-22 | 2004-05-27 | Mks Instruments | Pressure sensor for detecting small pressure differences and low pressures |
US6306684B1 (en) * | 2000-03-16 | 2001-10-23 | Microchip Technology Incorporated | Stress reducing lead-frame for plastic encapsulation |
JP2002134439A (en) | 2000-10-26 | 2002-05-10 | Matsushita Electric Ind Co Ltd | Method of manufacturing semiconductor chip, resin- sealed semiconductor device and its manufacturing method |
US6574033B1 (en) * | 2002-02-27 | 2003-06-03 | Iridigm Display Corporation | Microelectromechanical systems device and method for fabricating same |
TW540123B (en) | 2002-06-14 | 2003-07-01 | Siliconware Precision Industries Co Ltd | Flip-chip semiconductor package with lead frame as chip carrier |
US6989586B2 (en) | 2003-03-31 | 2006-01-24 | Intel Corporation | Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems |
JP4014006B2 (en) | 2004-06-17 | 2007-11-28 | 株式会社山武 | Pressure sensor |
CA2584851C (en) * | 2004-11-04 | 2015-04-07 | Microchips, Inc. | Compression and cold weld sealing methods and devices |
US7798010B2 (en) | 2007-10-11 | 2010-09-21 | Honeywell International Inc. | Sensor geometry for improved package stress isolation |
FR2933968B1 (en) * | 2008-07-18 | 2010-09-10 | Thales Sa | ELECTRONIC DEVICE COMPRISING ELECTRONIC COMPONENTS AND AT LEAST ONE NANOTUBE INTERFACE AND METHOD OF MANUFACTURE |
US8212346B2 (en) | 2008-10-28 | 2012-07-03 | Global Foundries, Inc. | Method and apparatus for reducing semiconductor package tensile stress |
JP5331504B2 (en) * | 2009-02-09 | 2013-10-30 | 株式会社フジクラ | Pressure sensor package, pressure sensor module and electronic components |
DE102010012042A1 (en) | 2010-03-19 | 2011-09-22 | Epcos Ag | Component with a chip in a cavity and a voltage-reduced attachment |
JP2012006092A (en) * | 2010-06-22 | 2012-01-12 | Panasonic Corp | Mems device and method for manufacturing the same, and package with the same |
JP2012073233A (en) * | 2010-08-31 | 2012-04-12 | Mitsumi Electric Co Ltd | Sensor device and mounting method of semiconductor sensor element |
WO2013046705A1 (en) * | 2011-09-30 | 2013-04-04 | パナソニック株式会社 | Inertial force sensor |
US8925384B2 (en) | 2012-05-29 | 2015-01-06 | Freescale Semiconductor, Inc. | MEMS sensor with stress isolation and method of fabrication |
JP6002016B2 (en) | 2012-11-30 | 2016-10-05 | アズビル株式会社 | Capacitive pressure sensor |
US9824924B2 (en) * | 2013-03-29 | 2017-11-21 | Stmicroelectronics Pte Ltd. | Semiconductor packages having an electric device with a recess |
JP6231812B2 (en) | 2013-08-09 | 2017-11-15 | アズビル株式会社 | Capacitive pressure sensor |
JP2015068800A (en) * | 2013-09-30 | 2015-04-13 | セイコーエプソン株式会社 | Pressure sensor, electronic device, and mobile body |
DE102014200126A1 (en) * | 2014-01-08 | 2014-12-04 | Robert Bosch Gmbh | Component with a semiconductor device on a support |
JP6126545B2 (en) | 2014-03-20 | 2017-05-10 | アズビル株式会社 | Capacitive pressure sensor |
US9334153B1 (en) * | 2014-11-03 | 2016-05-10 | Hrl Laboratories, Llc | MEMS device connected to a substrate by flexible support structures |
-
2015
- 2015-02-06 US US14/616,017 patent/US9499393B2/en active Active
-
2016
- 2016-01-15 CN CN201680009186.4A patent/CN107207244B/en active Active
- 2016-01-15 WO PCT/US2016/013613 patent/WO2016126405A1/en active Application Filing
- 2016-01-15 EP EP16746948.5A patent/EP3253708A4/en not_active Withdrawn
- 2016-01-15 SG SG11201704442UA patent/SG11201704442UA/en unknown
- 2016-01-15 SG SG10201906105RA patent/SG10201906105RA/en unknown
- 2016-01-15 KR KR1020177024738A patent/KR102003945B1/en active IP Right Grant
- 2016-01-15 JP JP2017536959A patent/JP6426848B2/en not_active Expired - Fee Related
- 2016-01-29 TW TW105102939A patent/TWI664137B/en not_active IP Right Cessation
- 2016-10-19 US US15/297,661 patent/US9850123B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160229688A1 (en) | 2016-08-11 |
US9499393B2 (en) | 2016-11-22 |
TW201636297A (en) | 2016-10-16 |
KR20170109669A (en) | 2017-09-29 |
KR102003945B1 (en) | 2019-07-25 |
JP6426848B2 (en) | 2018-11-21 |
EP3253708A4 (en) | 2018-08-01 |
EP3253708A1 (en) | 2017-12-13 |
CN107207244B (en) | 2020-01-03 |
JP2018505064A (en) | 2018-02-22 |
WO2016126405A1 (en) | 2016-08-11 |
SG11201704442UA (en) | 2017-06-29 |
CN107207244A (en) | 2017-09-26 |
TWI664137B (en) | 2019-07-01 |
US20170036906A1 (en) | 2017-02-09 |
US9850123B2 (en) | 2017-12-26 |
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