SG11201610032VA - Marking method for wafer dice - Google Patents
Marking method for wafer diceInfo
- Publication number
- SG11201610032VA SG11201610032VA SG11201610032VA SG11201610032VA SG11201610032VA SG 11201610032V A SG11201610032V A SG 11201610032VA SG 11201610032V A SG11201610032V A SG 11201610032VA SG 11201610032V A SG11201610032V A SG 11201610032VA SG 11201610032V A SG11201610032V A SG 11201610032VA
- Authority
- SG
- Singapore
- Prior art keywords
- marking method
- wafer dice
- dice
- wafer
- marking
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
- H01L2223/5446—Located in scribe lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140079116A KR101563165B1 (ko) | 2014-06-26 | 2014-06-26 | 웨이퍼 다이들의 마킹방법 |
PCT/KR2014/005871 WO2015199269A1 (fr) | 2014-06-26 | 2014-07-01 | Procédé de marquage pour dés de plaquette |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201610032VA true SG11201610032VA (en) | 2016-12-29 |
Family
ID=54428251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201610032VA SG11201610032VA (en) | 2014-06-26 | 2014-07-01 | Marking method for wafer dice |
Country Status (6)
Country | Link |
---|---|
US (1) | US10290525B2 (fr) |
KR (1) | KR101563165B1 (fr) |
CN (1) | CN106463498B (fr) |
SG (1) | SG11201610032VA (fr) |
TW (1) | TWI569352B (fr) |
WO (1) | WO2015199269A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6903270B2 (ja) * | 2017-06-29 | 2021-07-14 | 株式会社Nsテクノロジーズ | 電子部品搬送装置および電子部品検査装置 |
KR102236272B1 (ko) * | 2019-03-15 | 2021-04-05 | 주식회사 이오테크닉스 | 웨이퍼 다이의 마킹 장치 및 마킹 방법 |
CN114682920A (zh) * | 2020-12-31 | 2022-07-01 | 大族激光科技产业集团股份有限公司 | 一种晶圆的激光打标方法及激光打标系统 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5910846A (en) * | 1996-05-16 | 1999-06-08 | Micron Technology, Inc. | Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
KR100265723B1 (ko) | 1997-04-10 | 2000-09-15 | 윤종용 | 비젼인식을 이용한 반도체 웨이퍼 정렬방법 |
US6309943B1 (en) * | 2000-04-25 | 2001-10-30 | Amkor Technology, Inc. | Precision marking and singulation method |
US6950196B2 (en) * | 2000-09-20 | 2005-09-27 | Kla-Tencor Technologies Corp. | Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen |
JP2004111955A (ja) | 2002-08-30 | 2004-04-08 | Nsk Ltd | アライメント調整装置 |
JP2004193171A (ja) | 2002-12-06 | 2004-07-08 | Nikon Corp | 基準ウエハ、較正方法、位置検出方法、露光方法及びプログラム |
US7315361B2 (en) | 2005-04-29 | 2008-01-01 | Gsi Group Corporation | System and method for inspecting wafers in a laser marking system |
CN101311705A (zh) * | 2007-05-22 | 2008-11-26 | 力晶半导体股份有限公司 | 检视晶片缺陷的方法 |
JP4946668B2 (ja) | 2007-07-02 | 2012-06-06 | 日本電気株式会社 | 基板位置検出装置及び基板位置検出方法 |
TWI351070B (en) | 2007-07-31 | 2011-10-21 | King Yuan Electronics Co Ltd | Method for marking wafer, method for marking failed die, method for aligning wafer and wafer test equipment |
CN101419177B (zh) | 2007-10-25 | 2011-06-15 | 宝山钢铁股份有限公司 | 一种用于多台线扫描摄像机标定的方法 |
TW201006598A (en) * | 2008-04-11 | 2010-02-16 | Applied Materials Inc | Laser scribe inspection methods and systems |
US8017942B2 (en) * | 2008-11-25 | 2011-09-13 | Infineon Technologies Ag | Semiconductor device and method |
JP5885230B2 (ja) | 2011-04-05 | 2016-03-15 | 富士機械製造株式会社 | ダイ位置判定システム。 |
KR101350214B1 (ko) * | 2012-07-06 | 2014-01-16 | 주식회사 미르기술 | 비접촉식 발광다이오드 검사장치와 이를 이용한 검사방법 |
-
2014
- 2014-06-26 KR KR1020140079116A patent/KR101563165B1/ko active IP Right Grant
- 2014-07-01 SG SG11201610032VA patent/SG11201610032VA/en unknown
- 2014-07-01 WO PCT/KR2014/005871 patent/WO2015199269A1/fr active Application Filing
- 2014-07-01 US US15/321,938 patent/US10290525B2/en active Active
- 2014-07-01 CN CN201480079462.5A patent/CN106463498B/zh active Active
-
2015
- 2015-06-05 TW TW104118220A patent/TWI569352B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN106463498B (zh) | 2019-03-29 |
US10290525B2 (en) | 2019-05-14 |
US20170162410A1 (en) | 2017-06-08 |
WO2015199269A1 (fr) | 2015-12-30 |
TWI569352B (zh) | 2017-02-01 |
CN106463498A (zh) | 2017-02-22 |
TW201603169A (zh) | 2016-01-16 |
KR101563165B1 (ko) | 2015-10-26 |
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