SG11201609816WA - Integrated vapor chamber for thermal management of computing devices - Google Patents

Integrated vapor chamber for thermal management of computing devices

Info

Publication number
SG11201609816WA
SG11201609816WA SG11201609816WA SG11201609816WA SG11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA
Authority
SG
Singapore
Prior art keywords
computing devices
thermal management
vapor chamber
integrated vapor
integrated
Prior art date
Application number
SG11201609816WA
Other languages
English (en)
Inventor
Andrew Delano
Taylor Stellman
Original Assignee
Microsoft Technology Licensing Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsoft Technology Licensing Llc filed Critical Microsoft Technology Licensing Llc
Publication of SG11201609816WA publication Critical patent/SG11201609816WA/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/203Cooling means for portable computers, e.g. for laptops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1626Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Control Of Temperature (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
SG11201609816WA 2014-06-02 2015-05-29 Integrated vapor chamber for thermal management of computing devices SG11201609816WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/294,040 US10698458B2 (en) 2014-06-02 2014-06-02 Integrated vapor chamber for thermal management of computing devices
PCT/US2015/033101 WO2015187475A1 (en) 2014-06-02 2015-05-29 Integrated vapor chamber for thermal management of computing devices

Publications (1)

Publication Number Publication Date
SG11201609816WA true SG11201609816WA (en) 2016-12-29

Family

ID=53404895

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201609816WA SG11201609816WA (en) 2014-06-02 2015-05-29 Integrated vapor chamber for thermal management of computing devices

Country Status (15)

Country Link
US (1) US10698458B2 (es)
EP (1) EP3149425B1 (es)
JP (1) JP2017518476A (es)
KR (1) KR20170016391A (es)
CN (1) CN106462205A (es)
AU (1) AU2015271054B2 (es)
CA (1) CA2948383A1 (es)
CL (1) CL2016002995A1 (es)
HK (1) HK1232318A1 (es)
IL (1) IL248815A0 (es)
MX (1) MX2016015726A (es)
PH (1) PH12016502202A1 (es)
RU (1) RU2691215C2 (es)
SG (1) SG11201609816WA (es)
WO (1) WO2015187475A1 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10037202B2 (en) 2014-06-03 2018-07-31 Microsoft Technology Licensing, Llc Techniques to isolating a portion of an online computing service
US9432498B2 (en) * 2014-07-02 2016-08-30 Sony Corporation Gesture detection to pair two wearable devices and perform an action between them and a wearable device, a method and a system using heat as a means for communication
US9836100B2 (en) * 2014-10-15 2017-12-05 Futurewei Technologies, Inc. Support frame with integrated phase change material for thermal management
US9880595B2 (en) 2016-06-08 2018-01-30 International Business Machines Corporation Cooling device with nested chambers for computer hardware
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
US10451356B2 (en) * 2016-12-08 2019-10-22 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device
US10527355B2 (en) 2017-06-13 2020-01-07 Microsoft Technology Licensing, Llc Devices, methods, and systems for thermal management
US10802555B2 (en) 2018-04-13 2020-10-13 Dell Products L.P. Information handling system thermally conductive hinge
US10936031B2 (en) 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
US10969841B2 (en) 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
US10401926B1 (en) 2018-04-13 2019-09-03 Dell Products L.P. Information handling system housing thermal conduit interfacing rotationally coupled housing portions
US10579112B2 (en) 2018-04-13 2020-03-03 Dell Products L.P. Graphite thermal conduit spring
US10802556B2 (en) 2018-04-13 2020-10-13 Dell Products L.P. Information handling system thermal fluid hinge
US10579113B2 (en) 2018-04-13 2020-03-03 Dell Products L.P. Graphite thermal conduit spring
US10551888B1 (en) 2018-08-13 2020-02-04 Dell Products L.P. Skin transition thermal control for convertible information handling systems
US11263967B2 (en) 2018-09-14 2022-03-01 Microsoft Technology Licensing, Llc Dynamic voltage display driver
US11687133B2 (en) * 2019-12-06 2023-06-27 Nvidia Corporation Laptop computer with display-side cooling system
US11419247B2 (en) 2020-03-25 2022-08-16 Kyndryl, Inc. Controlling a working condition of electronic devices
DE102022205049A1 (de) * 2022-05-20 2023-11-23 Continental Automotive Technologies GmbH Elektronische Vorrichtung und Fortbewegungsmittel

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000002493A (ja) 1998-06-17 2000-01-07 Furukawa Electric Co Ltd:The 冷却ユニットとそれを用いた冷却構造
EP1055872A1 (en) 1999-05-28 2000-11-29 University of Liege Illumination device
JP2001230578A (ja) 2000-02-17 2001-08-24 Nec Corp 携帯型通信端末の放熱構造
JP2002076224A (ja) 2000-06-14 2002-03-15 Ts Heatronics Co Ltd 放熱装置
US6504721B1 (en) 2000-09-29 2003-01-07 Intel Corporation Thermal cooling apparatus
ATE491966T1 (de) 2000-12-21 2011-01-15 Light Prescriptions Innovators Lichtleitung mit radialer lichtauswurfsstruktur
JP2002286380A (ja) 2001-03-28 2002-10-03 Showa Denko Kk ヒートパイプ式冷却装置
US6982874B2 (en) * 2003-11-25 2006-01-03 Advanced Energy Technology Inc. Thermal solution for electronic devices
JP4443337B2 (ja) 2004-07-22 2010-03-31 株式会社バンダイナムコゲームス 表示装置及びゲーム装置
CN2726115Y (zh) 2004-07-30 2005-09-14 英业达股份有限公司 流体介质散热器
CN2727829Y (zh) 2004-09-09 2005-09-21 祥莹有限公司 重力型高效率两相流蒸发器
KR100631050B1 (ko) * 2005-04-19 2006-10-04 한국전자통신연구원 평판형 히트 파이프
CN100490618C (zh) 2005-06-10 2009-05-20 鸿富锦精密工业(深圳)有限公司 散热装置
RU2297661C2 (ru) 2005-07-29 2007-04-20 Институт теплофизики Уро РАН Пассивная система охлаждения настольного компьютера
US7518861B2 (en) 2007-04-20 2009-04-14 Hewlett-Packard Development Company, L.P. Device cooling system
US20090151905A1 (en) * 2007-12-14 2009-06-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with vapor chamber
US20100101763A1 (en) * 2008-10-27 2010-04-29 Meng-Cheng Huang Thin heat dissipating apparatus
JP4473925B1 (ja) * 2008-12-16 2010-06-02 株式会社東芝 ループヒートパイプおよび電子機器
CN105423788B (zh) * 2009-07-21 2019-01-01 古河电气工业株式会社 扁平型热管及其制造方法
US9341887B2 (en) 2009-09-11 2016-05-17 Dolby Laboratories Licensing Corporation Displays with a backlight incorporating reflecting layer
TW201116794A (en) 2009-11-10 2011-05-16 Pegatron Corp Vapor chamber and manufacturing method thereof
RU100587U1 (ru) 2010-07-12 2010-12-20 Государственное образовательное учреждение профессионального образования "Уральский государственный университет им. А.М. Горького" Светодиодное осветительное устройство
TW201209366A (en) * 2010-08-24 2012-03-01 Foxconn Tech Co Ltd Loop heat pipe
TWI428673B (zh) 2010-11-15 2014-03-01 Young Lighting Technology Corp 背光模組
TWI465808B (zh) 2010-11-25 2014-12-21 Lg伊諾特股份有限公司 背光單元及其顯示設備
TW201237509A (en) 2011-03-01 2012-09-16 Era Optoelectronics Inc Backlight source structure with sensing function and board thereof
CN102811589A (zh) 2011-05-31 2012-12-05 富准精密工业(深圳)有限公司 电子装置
US8941560B2 (en) * 2011-09-21 2015-01-27 Google Inc. Wearable computer with superimposed controls and instructions for external device
US20130098582A1 (en) * 2011-10-25 2013-04-25 Walter Stark Method using heat pipes with multiple evaporator/condenser zones and heat exchangers using same
JP6191137B2 (ja) 2012-05-14 2017-09-06 富士通株式会社 冷却装置
JP2014041553A (ja) 2012-08-23 2014-03-06 Toshiba Corp 電子機器
JP5991125B2 (ja) * 2012-09-28 2016-09-14 富士通株式会社 電子機器
WO2014077081A1 (ja) 2012-11-15 2014-05-22 東芝ホームテクノ株式会社 ヒートパイプ、スマートフォン、タブレット端末または携帯情報端末
JP2014098530A (ja) 2012-11-15 2014-05-29 Toshiba Home Technology Corp ヒートパイプ
US8994827B2 (en) * 2012-11-20 2015-03-31 Samsung Electronics Co., Ltd Wearable electronic device
US10185416B2 (en) * 2012-11-20 2019-01-22 Samsung Electronics Co., Ltd. User gesture input to wearable electronic device involving movement of device
US9310139B2 (en) * 2013-03-15 2016-04-12 Qualcomm Incorporated Vapor chambers based skin material for smartphones and mobile devices
US9307682B2 (en) * 2013-04-30 2016-04-05 Sony Corporation Apparatus and method for dissipating heat
KR102120763B1 (ko) * 2013-05-09 2020-06-09 엘지전자 주식회사 디지털 사이니지
US20140352926A1 (en) 2013-05-31 2014-12-04 Cooler Master Co., Ltd. Shell structure for handheld device
DE202013007703U1 (de) 2013-08-27 2013-09-26 Asia Vital Components Co., Ltd. Kühlstruktur für tragbares Mobilgerät
US20150075186A1 (en) * 2013-09-18 2015-03-19 Qualcomm Incorporated Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment
JP6121854B2 (ja) * 2013-09-18 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプまたは携帯情報端末
JP6125972B2 (ja) * 2013-10-30 2017-05-10 東芝ホームテクノ株式会社 携帯情報端末
KR20150091905A (ko) 2014-02-04 2015-08-12 엘지전자 주식회사 증기 챔버
US9547344B2 (en) * 2014-03-05 2017-01-17 Futurewei Technologies, Inc. Support frame with integrated thermal management features
US9720548B2 (en) 2014-06-27 2017-08-01 Microsoft Technology Licensing, Llc See-through IR frontlight with embedded partially reflective facets
US9836100B2 (en) * 2014-10-15 2017-12-05 Futurewei Technologies, Inc. Support frame with integrated phase change material for thermal management
US9569024B2 (en) * 2014-11-12 2017-02-14 Asia Vital Components Co., Ltd. Display module with heat dissipation structure and handheld device thereof
US10019046B2 (en) * 2015-08-17 2018-07-10 Asia Vital Components Co., Ltd. Internal frame structure with heat insulation effect and electronic apparatus with the internal frame structure
US10321615B2 (en) * 2016-06-16 2019-06-11 Microsoft Technology Licensing, Llc Display module with integrated thermal management structure
US10451356B2 (en) * 2016-12-08 2019-10-22 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device

Also Published As

Publication number Publication date
RU2016147187A (ru) 2018-06-01
RU2016147187A3 (es) 2018-12-14
WO2015187475A1 (en) 2015-12-10
CA2948383A1 (en) 2015-12-10
IL248815A0 (en) 2017-01-31
HK1232318A1 (zh) 2018-01-05
RU2691215C2 (ru) 2019-06-11
US20150346784A1 (en) 2015-12-03
EP3149425A1 (en) 2017-04-05
EP3149425B1 (en) 2019-12-04
AU2015271054A1 (en) 2016-11-17
JP2017518476A (ja) 2017-07-06
CN106462205A (zh) 2017-02-22
KR20170016391A (ko) 2017-02-13
MX2016015726A (es) 2017-03-16
CL2016002995A1 (es) 2017-06-16
PH12016502202A1 (en) 2017-01-09
US10698458B2 (en) 2020-06-30
AU2015271054B2 (en) 2019-07-04

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