SG11201609816WA - Integrated vapor chamber for thermal management of computing devices - Google Patents

Integrated vapor chamber for thermal management of computing devices

Info

Publication number
SG11201609816WA
SG11201609816WA SG11201609816WA SG11201609816WA SG11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA SG 11201609816W A SG11201609816W A SG 11201609816WA
Authority
SG
Singapore
Prior art keywords
computing devices
thermal management
vapor chamber
integrated vapor
integrated
Prior art date
Application number
SG11201609816WA
Other languages
English (en)
Inventor
Andrew Delano
Taylor Stellman
Original Assignee
Microsoft Technology Licensing Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsoft Technology Licensing Llc filed Critical Microsoft Technology Licensing Llc
Publication of SG11201609816WA publication Critical patent/SG11201609816WA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Control Of Temperature (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
SG11201609816WA 2014-06-02 2015-05-29 Integrated vapor chamber for thermal management of computing devices SG11201609816WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/294,040 US10698458B2 (en) 2014-06-02 2014-06-02 Integrated vapor chamber for thermal management of computing devices
PCT/US2015/033101 WO2015187475A1 (en) 2014-06-02 2015-05-29 Integrated vapor chamber for thermal management of computing devices

Publications (1)

Publication Number Publication Date
SG11201609816WA true SG11201609816WA (en) 2016-12-29

Family

ID=53404895

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201609816WA SG11201609816WA (en) 2014-06-02 2015-05-29 Integrated vapor chamber for thermal management of computing devices

Country Status (15)

Country Link
US (1) US10698458B2 (es)
EP (1) EP3149425B1 (es)
JP (1) JP2017518476A (es)
KR (1) KR20170016391A (es)
CN (1) CN106462205A (es)
AU (1) AU2015271054B2 (es)
CA (1) CA2948383A1 (es)
CL (1) CL2016002995A1 (es)
HK (1) HK1232318A1 (es)
IL (1) IL248815A0 (es)
MX (1) MX2016015726A (es)
PH (1) PH12016502202A1 (es)
RU (1) RU2691215C2 (es)
SG (1) SG11201609816WA (es)
WO (1) WO2015187475A1 (es)

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Also Published As

Publication number Publication date
RU2016147187A (ru) 2018-06-01
RU2016147187A3 (es) 2018-12-14
WO2015187475A1 (en) 2015-12-10
CA2948383A1 (en) 2015-12-10
IL248815A0 (en) 2017-01-31
HK1232318A1 (zh) 2018-01-05
RU2691215C2 (ru) 2019-06-11
US20150346784A1 (en) 2015-12-03
EP3149425A1 (en) 2017-04-05
EP3149425B1 (en) 2019-12-04
AU2015271054A1 (en) 2016-11-17
JP2017518476A (ja) 2017-07-06
CN106462205A (zh) 2017-02-22
KR20170016391A (ko) 2017-02-13
MX2016015726A (es) 2017-03-16
CL2016002995A1 (es) 2017-06-16
PH12016502202A1 (en) 2017-01-09
US10698458B2 (en) 2020-06-30
AU2015271054B2 (en) 2019-07-04

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