SG11201608947SA - Embedded memory in interconnect stack on silicon die - Google Patents

Embedded memory in interconnect stack on silicon die

Info

Publication number
SG11201608947SA
SG11201608947SA SG11201608947SA SG11201608947SA SG11201608947SA SG 11201608947S A SG11201608947S A SG 11201608947SA SG 11201608947S A SG11201608947S A SG 11201608947SA SG 11201608947S A SG11201608947S A SG 11201608947SA SG 11201608947S A SG11201608947S A SG 11201608947SA
Authority
SG
Singapore
Prior art keywords
embedded memory
silicon die
interconnect stack
interconnect
stack
Prior art date
Application number
SG11201608947SA
Other languages
English (en)
Inventor
Donald W Nelson
Clair M Webb
Patrick Morrow
Kimin Jun
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG11201608947SA publication Critical patent/SG11201608947SA/en

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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EP3155653A4 (en) 2018-02-21
EP3155653A1 (en) 2017-04-19
KR20170018815A (ko) 2017-02-20
JP2017525128A (ja) 2017-08-31
TWI576921B (zh) 2017-04-01

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