SG11201605280UA - Imprint apparatus and method of manufacturing article - Google Patents
Imprint apparatus and method of manufacturing articleInfo
- Publication number
- SG11201605280UA SG11201605280UA SG11201605280UA SG11201605280UA SG11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA SG 11201605280U A SG11201605280U A SG 11201605280UA
- Authority
- SG
- Singapore
- Prior art keywords
- imprint apparatus
- manufacturing article
- article
- manufacturing
- imprint
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1861—Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70158—Diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/70683—Mark designs
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5816—Measuring, controlling or regulating temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014011784A JP6294680B2 (ja) | 2014-01-24 | 2014-01-24 | インプリント装置、および物品の製造方法 |
PCT/JP2015/051950 WO2015111739A1 (en) | 2014-01-24 | 2015-01-20 | Imprint apparatus and method of manufacturing article |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201605280UA true SG11201605280UA (en) | 2016-08-30 |
Family
ID=53681535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201605280UA SG11201605280UA (en) | 2014-01-24 | 2015-01-20 | Imprint apparatus and method of manufacturing article |
Country Status (6)
Country | Link |
---|---|
US (2) | US10300640B2 (ko) |
JP (1) | JP6294680B2 (ko) |
KR (2) | KR101894167B1 (ko) |
CN (2) | CN109324476B (ko) |
SG (1) | SG11201605280UA (ko) |
WO (1) | WO2015111739A1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2005975A (en) * | 2010-03-03 | 2011-09-06 | Asml Netherlands Bv | Imprint lithography. |
JP6604793B2 (ja) * | 2015-09-17 | 2019-11-13 | キヤノン株式会社 | インプリント装置および物品製造方法 |
JP6797627B2 (ja) * | 2015-11-24 | 2020-12-09 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
JP6685821B2 (ja) * | 2016-04-25 | 2020-04-22 | キヤノン株式会社 | 計測装置、インプリント装置、物品の製造方法、光量決定方法、及び、光量調整方法 |
JP6758967B2 (ja) * | 2016-07-12 | 2020-09-23 | キヤノン株式会社 | インプリント装置、インプリント方法、及び物品の製造方法 |
JP6827785B2 (ja) * | 2016-11-30 | 2021-02-10 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
JP6971567B2 (ja) * | 2016-12-16 | 2021-11-24 | キヤノン株式会社 | 位置合わせ装置、位置合わせ方法、リソグラフィ装置、および物品製造方法 |
JP6606567B2 (ja) * | 2017-04-17 | 2019-11-13 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
US10998190B2 (en) * | 2017-04-17 | 2021-05-04 | Canon Kabushiki Kaisha | Imprint apparatus and method of manufacturing article |
JP6921600B2 (ja) * | 2017-04-20 | 2021-08-18 | キヤノン株式会社 | インプリント装置、制御データの生成方法、及び物品の製造方法 |
JP6894285B2 (ja) * | 2017-04-26 | 2021-06-30 | Towa株式会社 | 樹脂成形装置及び樹脂成形品の製造方法 |
JP6937203B2 (ja) | 2017-09-14 | 2021-09-22 | キオクシア株式会社 | インプリント装置、インプリント方法および半導体装置の製造方法 |
US10996561B2 (en) * | 2017-12-26 | 2021-05-04 | Canon Kabushiki Kaisha | Nanoimprint lithography with a six degrees-of-freedom imprint head module |
JP7030533B2 (ja) | 2018-01-15 | 2022-03-07 | キオクシア株式会社 | インプリント装置、インプリント方法、及び半導体装置の製造方法 |
JP7091151B2 (ja) | 2018-06-01 | 2022-06-27 | キオクシア株式会社 | アライメントマーク、インプリント方法、および半導体装置の製造方法 |
EP3614194A1 (en) * | 2018-08-24 | 2020-02-26 | ASML Netherlands B.V. | Matching pupil determination |
EP3650937B1 (en) * | 2018-11-08 | 2024-05-22 | Canon Kabushiki Kaisha | Imprint apparatus and product manufacturing method |
JP7267801B2 (ja) | 2019-03-26 | 2023-05-02 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1211868A (en) * | 1982-04-16 | 1986-09-23 | Yoshikazu Nishiwaki | Method of forming diffraction gratings and optical branching filter elements produced thereby |
US4734746A (en) * | 1985-06-24 | 1988-03-29 | Nippon Kogaku K. K. | Exposure method and system for photolithography |
US5772905A (en) * | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
TW581746B (en) * | 1999-11-12 | 2004-04-01 | Nippon Sheet Glass Co Ltd | Photosensitive composition, optical waveguide element and production process therefor |
US7322287B2 (en) * | 2000-07-18 | 2008-01-29 | Nanonex Corporation | Apparatus for fluid pressure imprint lithography |
JP2004022797A (ja) * | 2002-06-17 | 2004-01-22 | Nikon Corp | マーク位置検出装置およびマーク位置検出方法 |
US7027156B2 (en) * | 2002-08-01 | 2006-04-11 | Molecular Imprints, Inc. | Scatterometry alignment for imprint lithography |
US7070405B2 (en) * | 2002-08-01 | 2006-07-04 | Molecular Imprints, Inc. | Alignment systems for imprint lithography |
JP2004259985A (ja) | 2003-02-26 | 2004-09-16 | Sony Corp | レジストパターン形成装置およびその形成方法、および、当該方法を用いた半導体装置の製造方法 |
TW571087B (en) * | 2003-06-02 | 2004-01-11 | Chen-Hung He | Method and system for monitoring the mold strain in nanoimprint lithography technique |
US20050270516A1 (en) * | 2004-06-03 | 2005-12-08 | Molecular Imprints, Inc. | System for magnification and distortion correction during nano-scale manufacturing |
JP4795300B2 (ja) * | 2006-04-18 | 2011-10-19 | キヤノン株式会社 | 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法 |
US8221963B2 (en) * | 2007-12-27 | 2012-07-17 | Seiko Epson Corporation | Method for producing fine structure |
EP2131243B1 (en) * | 2008-06-02 | 2015-07-01 | ASML Netherlands B.V. | Lithographic apparatus and method for calibrating a stage position |
JPWO2009153925A1 (ja) * | 2008-06-17 | 2011-11-24 | 株式会社ニコン | ナノインプリント方法及び装置 |
JP5451450B2 (ja) * | 2010-02-24 | 2014-03-26 | キヤノン株式会社 | インプリント装置及びそのテンプレート並びに物品の製造方法 |
JP5539011B2 (ja) * | 2010-05-14 | 2014-07-02 | キヤノン株式会社 | インプリント装置、検出装置、位置合わせ装置、及び物品の製造方法 |
JP6140966B2 (ja) * | 2011-10-14 | 2017-06-07 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
JP5686779B2 (ja) * | 2011-10-14 | 2015-03-18 | キヤノン株式会社 | インプリント装置、それを用いた物品の製造方法 |
JP2013098291A (ja) * | 2011-10-31 | 2013-05-20 | Canon Inc | インプリント装置およびインプリント方法、それを用いた物品の製造方法 |
JP5817442B2 (ja) * | 2011-11-04 | 2015-11-18 | ヤマハ株式会社 | 静電型の電気音響変換器、静電型スピーカ及び静電型マイクロフォン |
JP6066565B2 (ja) * | 2012-01-31 | 2017-01-25 | キヤノン株式会社 | インプリント装置、および、物品の製造方法 |
JP6029495B2 (ja) * | 2012-03-12 | 2016-11-24 | キヤノン株式会社 | インプリント方法およびインプリント装置、それを用いた物品の製造方法 |
JP6039917B2 (ja) * | 2012-05-22 | 2016-12-07 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
-
2014
- 2014-01-24 JP JP2014011784A patent/JP6294680B2/ja active Active
-
2015
- 2015-01-20 KR KR1020167022260A patent/KR101894167B1/ko active IP Right Grant
- 2015-01-20 CN CN201811402119.6A patent/CN109324476B/zh active Active
- 2015-01-20 US US15/100,666 patent/US10300640B2/en active Active
- 2015-01-20 SG SG11201605280UA patent/SG11201605280UA/en unknown
- 2015-01-20 WO PCT/JP2015/051950 patent/WO2015111739A1/en active Application Filing
- 2015-01-20 CN CN201580005034.2A patent/CN105917442B/zh active Active
- 2015-01-20 KR KR1020187014370A patent/KR101996771B1/ko active IP Right Grant
-
2019
- 2019-04-11 US US16/381,353 patent/US10919195B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20160107324A (ko) | 2016-09-13 |
CN105917442A (zh) | 2016-08-31 |
JP6294680B2 (ja) | 2018-03-14 |
WO2015111739A1 (en) | 2015-07-30 |
KR101996771B1 (ko) | 2019-07-04 |
KR20180059565A (ko) | 2018-06-04 |
US10300640B2 (en) | 2019-05-28 |
KR101894167B1 (ko) | 2018-08-31 |
CN109324476A (zh) | 2019-02-12 |
CN109324476B (zh) | 2022-06-03 |
CN105917442B (zh) | 2018-12-11 |
JP2015138963A (ja) | 2015-07-30 |
US10919195B2 (en) | 2021-02-16 |
US20160297117A1 (en) | 2016-10-13 |
US20190240880A1 (en) | 2019-08-08 |
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