SG11201604448SA - Method for slicing workpiece and workpiece holder - Google Patents
Method for slicing workpiece and workpiece holderInfo
- Publication number
- SG11201604448SA SG11201604448SA SG11201604448SA SG11201604448SA SG11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA SG 11201604448S A SG11201604448S A SG 11201604448SA
- Authority
- SG
- Singapore
- Prior art keywords
- workpiece
- slicing
- holder
- workpiece holder
- slicing workpiece
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013265726A JP6000235B2 (ja) | 2013-12-24 | 2013-12-24 | ワークの切断方法及びワーク保持治具 |
PCT/JP2014/005931 WO2015097985A1 (ja) | 2013-12-24 | 2014-11-27 | ワークの切断方法及びワーク保持治具 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201604448SA true SG11201604448SA (en) | 2016-07-28 |
Family
ID=53477897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201604448SA SG11201604448SA (en) | 2013-12-24 | 2014-11-27 | Method for slicing workpiece and workpiece holder |
Country Status (8)
Country | Link |
---|---|
US (1) | US10350788B2 (de) |
JP (1) | JP6000235B2 (de) |
KR (1) | KR102253809B1 (de) |
CN (1) | CN105814669B (de) |
DE (1) | DE112014005470T5 (de) |
SG (1) | SG11201604448SA (de) |
TW (1) | TWI580500B (de) |
WO (1) | WO2015097985A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6157421B2 (ja) * | 2014-07-03 | 2017-07-05 | 信越半導体株式会社 | ワークの切断方法及びワーク保持治具 |
CN106112092A (zh) * | 2016-08-16 | 2016-11-16 | 无锡尊宝电动车有限公司 | 一种用于抛光机外壳加工的切割机 |
JP6988358B2 (ja) * | 2017-10-16 | 2022-01-05 | Tdk株式会社 | ワーク保持治具、電子部品処理装置および電子部品の製造方法 |
JP6971780B2 (ja) * | 2017-10-27 | 2021-11-24 | 上村工業株式会社 | ワーク保持治具及びロードアンロード装置 |
KR102037745B1 (ko) | 2017-12-14 | 2019-10-29 | 에스케이실트론 주식회사 | 잉곳 클램프 및 그를 구비한 잉곳 절단용 와이어 쏘잉 장치 |
CN110385746B (zh) * | 2019-08-29 | 2021-02-02 | 常州金纬化工成套设备有限公司 | 一种高分子材料聚乙烯板生产用的分段式切割设备 |
CN110815612A (zh) * | 2019-11-29 | 2020-02-21 | 晶海洋半导体材料(东海)有限公司 | 一种上下料装置 |
CN115041995B (zh) * | 2022-06-27 | 2023-11-17 | 青岛高测科技股份有限公司 | 进给装置及切割设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0310760A (ja) * | 1989-06-09 | 1991-01-18 | Nippon Spindle Mfg Co Ltd | 結晶質脆性材料切断用ワイヤソー |
TW355151B (en) | 1995-07-07 | 1999-04-01 | Tokyo Seimitsu Co Ltd | A method for cutting single chip material by the steel saw |
JP3144269B2 (ja) * | 1995-07-07 | 2001-03-12 | 株式会社東京精密 | 単結晶材料の切断方法 |
JPH09325124A (ja) * | 1996-06-04 | 1997-12-16 | Tokyo Seimitsu Co Ltd | X線を利用したインゴットの結晶軸方位調整方法及び装置 |
CH692331A5 (de) * | 1996-06-04 | 2002-05-15 | Tokyo Seimitsu Co Ltd | Drahtsäge und Schneidverfahren unter Einsatz derselben. |
JP3173564B2 (ja) * | 1996-06-04 | 2001-06-04 | 株式会社東京精密 | ワイヤソー |
JP2000171417A (ja) * | 1998-12-04 | 2000-06-23 | Toshiba Ceramics Co Ltd | 方位測定補助装置及びそれを用いた方位測定加工方法 |
JP2001050912A (ja) * | 1999-08-11 | 2001-02-23 | Rigaku Corp | 単結晶インゴットの支持装置、単結晶インゴットの測定装置及び単結晶インゴットの測定方法 |
WO2001091981A1 (en) * | 2000-05-31 | 2001-12-06 | Memc Electronic Materials, S.P.A. | Wire saw and process for slicing multiple semiconductor ingots |
DE10052154A1 (de) | 2000-10-20 | 2002-05-08 | Freiberger Compound Mat Gmbh | Verfahren und Vorrichtung zum Trennen von Einkristallen, Justiervorrichtung und Testverfahren zum Ermitteln einer Orientierung eines Einkristalls für ein derartiges Verfahren |
JP4951914B2 (ja) | 2005-09-28 | 2012-06-13 | 信越半導体株式会社 | (110)シリコンウエーハの製造方法 |
-
2013
- 2013-12-24 JP JP2013265726A patent/JP6000235B2/ja active Active
-
2014
- 2014-11-27 DE DE112014005470.4T patent/DE112014005470T5/de active Pending
- 2014-11-27 US US15/100,378 patent/US10350788B2/en active Active
- 2014-11-27 CN CN201480067818.3A patent/CN105814669B/zh active Active
- 2014-11-27 KR KR1020167016554A patent/KR102253809B1/ko active IP Right Grant
- 2014-11-27 SG SG11201604448SA patent/SG11201604448SA/en unknown
- 2014-11-27 WO PCT/JP2014/005931 patent/WO2015097985A1/ja active Application Filing
- 2014-12-10 TW TW103143056A patent/TWI580500B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20160303765A1 (en) | 2016-10-20 |
CN105814669B (zh) | 2019-03-22 |
TWI580500B (zh) | 2017-05-01 |
WO2015097985A1 (ja) | 2015-07-02 |
TW201540400A (zh) | 2015-11-01 |
KR20160102192A (ko) | 2016-08-29 |
JP2015122424A (ja) | 2015-07-02 |
US10350788B2 (en) | 2019-07-16 |
JP6000235B2 (ja) | 2016-09-28 |
CN105814669A (zh) | 2016-07-27 |
DE112014005470T5 (de) | 2016-08-11 |
KR102253809B1 (ko) | 2021-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1215476A1 (zh) | 用於通過載體給料的三維製造的方法和設備 | |
EP2923791A4 (de) | Bearbeitungsvorrichtung und bearbeitungsverfahren | |
PL2976184T3 (pl) | Sposób gładzenia i gładzak | |
EP3059034A4 (de) | Werkzeughalter und schneidwerkzeug | |
EP2987588A4 (de) | Bearbeitungsvorrichtung, werkstückbearbeitungsverfahren | |
IL243740A0 (en) | A facility for holding an object in the manufacturing process | |
EP2962801A4 (de) | Bearbeitungsvorrichtung und bearbeitungsverfahren | |
EP3075473A4 (de) | Werkzeugmaschine und schneidverfahren | |
SG10201408674PA (en) | Cutting apparatus | |
SG11201604448SA (en) | Method for slicing workpiece and workpiece holder | |
EP3059035A4 (de) | Schneidwerkzeughalter und schneidwerkzeug | |
GB201313279D0 (en) | Cutting tool | |
EP2953765A4 (de) | Maschine zum entgraten und verfahren zum entgraten | |
EP2883648A4 (de) | Laserschneidvorrichtung und verfahren | |
EP2962793A4 (de) | Schneidewerkzeug | |
SG11201800299PA (en) | Workpiece holder and method for slicing workpiece | |
HRP20182185T1 (hr) | Metoda za preradu povrća | |
GB2516296B (en) | Cutting apparatus | |
ZA201509259B (en) | Tool support for cutting heads | |
PL3215326T3 (pl) | Urządzenie obróbcze do przedmiotów obrabianych oraz odpowiedni sposób | |
EP2957368A4 (de) | Schneidewerkzeug | |
EP2810726A4 (de) | Halter und schneidwerkzeug | |
SG11201604061VA (en) | Method for slicing workpiece | |
EP2959993A4 (de) | Schneidewerkzeug | |
EP2995435A4 (de) | Schneidwerkzeug und schneidvorrichtung damit |