SG11201507438YA - Polishing composition, method for producing polishing composition and polishing composition preparation kit - Google Patents

Polishing composition, method for producing polishing composition and polishing composition preparation kit

Info

Publication number
SG11201507438YA
SG11201507438YA SG11201507438YA SG11201507438YA SG11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA SG 11201507438Y A SG11201507438Y A SG 11201507438YA
Authority
SG
Singapore
Prior art keywords
polishing composition
producing
preparation kit
composition preparation
polishing
Prior art date
Application number
SG11201507438YA
Other languages
English (en)
Inventor
Kohsuke Tsuchiya
Hisanori Tansho
Taiki Ichitsubo
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51580082&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG11201507438Y(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG11201507438YA publication Critical patent/SG11201507438YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F216/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an alcohol radical
    • C08F216/04—Acyclic compounds
    • C08F216/06—Polyvinyl alcohol ; Vinyl alcohol
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201507438YA 2013-03-19 2014-03-14 Polishing composition, method for producing polishing composition and polishing composition preparation kit SG11201507438YA (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013057226 2013-03-19
JP2013057227 2013-03-19
JP2013057225 2013-03-19
JP2013057228 2013-03-19
PCT/JP2014/057008 WO2014148399A1 (ja) 2013-03-19 2014-03-14 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット

Publications (1)

Publication Number Publication Date
SG11201507438YA true SG11201507438YA (en) 2015-10-29

Family

ID=51580082

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201507438YA SG11201507438YA (en) 2013-03-19 2014-03-14 Polishing composition, method for producing polishing composition and polishing composition preparation kit

Country Status (8)

Country Link
US (1) US10351732B2 (ja)
EP (2) EP3967736B1 (ja)
JP (5) JP5900913B2 (ja)
KR (1) KR102330030B1 (ja)
CN (1) CN105051145B (ja)
SG (1) SG11201507438YA (ja)
TW (2) TWI665275B (ja)
WO (1) WO2014148399A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10717899B2 (en) 2013-03-19 2020-07-21 Fujimi Incorporated Polishing composition, method for producing polishing composition and polishing composition preparation kit
US10351732B2 (en) * 2013-03-19 2019-07-16 Fujimi Incorporated Polishing composition, method for producing polishing composition and polishing composition preparation kit
JP6367113B2 (ja) * 2014-12-25 2018-08-01 花王株式会社 シリコンウェーハ用研磨液組成物
JP6655354B2 (ja) * 2014-12-26 2020-02-26 花王株式会社 シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット
US10748778B2 (en) * 2015-02-12 2020-08-18 Fujimi Incorporated Method for polishing silicon wafer and surface treatment composition
SG11201803362VA (en) * 2015-10-23 2018-05-30 Nitta Haas Inc Polishing composition
US10435588B2 (en) * 2015-10-23 2019-10-08 Nitta Haas Incorporated Polishing composition
JP6801964B2 (ja) * 2016-01-19 2020-12-16 株式会社フジミインコーポレーテッド 研磨用組成物及びシリコン基板の研磨方法
JP6572830B2 (ja) * 2016-06-13 2019-09-11 信越半導体株式会社 シリコンウェーハの搬送・保管方法
JP7026043B2 (ja) * 2016-08-02 2022-02-25 株式会社フジミインコーポレーテッド シリコンウェーハ粗研磨用組成物の製造方法、シリコンウェーハ粗研磨用組成物セット、およびシリコンウェーハの研磨方法
WO2018025655A1 (ja) * 2016-08-02 2018-02-08 株式会社フジミインコーポレーテッド シリコンウェーハ粗研磨用組成物の濃縮液
WO2018043504A1 (ja) * 2016-08-31 2018-03-08 株式会社フジミインコーポレーテッド 研磨用組成物および研磨用組成物セット
US10955332B2 (en) * 2016-12-22 2021-03-23 Illumina, Inc. Flow cell package and method for making the same
KR102565682B1 (ko) * 2017-02-20 2023-08-11 가부시키가이샤 후지미인코퍼레이티드 실리콘 기판 중간 연마용 조성물 및 실리콘 기판 연마용 조성물 세트
JP7074525B2 (ja) * 2017-03-30 2022-05-24 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
CN108499963A (zh) * 2017-05-18 2018-09-07 苏州权素船舶电子有限公司 一种电子材料研磨清洗方法
JP7303111B2 (ja) 2017-11-06 2023-07-04 株式会社フジミインコーポレーテッド 研磨用組成物およびその製造方法
US11427730B2 (en) 2017-11-16 2022-08-30 Jgc Catalysts And Chemicals Ltd. Dispersion liquid of silica particles and production method therefor
JP6929239B2 (ja) * 2018-03-30 2021-09-01 株式会社フジミインコーポレーテッド 研磨用組成物および研磨方法
JP7221479B2 (ja) * 2018-08-31 2023-02-14 日化精工株式会社 ダイシング加工用製剤及び加工処理液
EP3950876A4 (en) * 2019-03-26 2022-11-02 Fujimi Incorporated POLISHING COMPOSITION
JP7384592B2 (ja) * 2019-08-22 2023-11-21 株式会社三共 遊技機
CN112552824B (zh) * 2019-09-26 2023-07-11 福吉米株式会社 研磨用组合物和研磨方法
JP6884898B1 (ja) * 2020-01-22 2021-06-09 日本酢ビ・ポバール株式会社 研磨用組成物
JPWO2021182278A1 (ja) * 2020-03-13 2021-09-16
WO2023189812A1 (ja) * 2022-03-31 2023-10-05 株式会社フジミインコーポレーテッド 研磨用組成物

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2247067C3 (de) 1972-09-26 1979-08-09 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen
JPS539910A (en) 1976-07-14 1978-01-28 Hitachi Ltd Function generating circuit for gas turbine engine control
JP4115562B2 (ja) * 1997-10-14 2008-07-09 株式会社フジミインコーポレーテッド 研磨用組成物
JPH11140427A (ja) 1997-11-13 1999-05-25 Kobe Steel Ltd 研磨液および研磨方法
JP2003321671A (ja) 2002-04-30 2003-11-14 Sumitomo Bakelite Co Ltd 研磨用組成物
JP2004067869A (ja) * 2002-08-06 2004-03-04 Sumitomo Bakelite Co Ltd 研磨用組成物
CN100377310C (zh) 2003-01-31 2008-03-26 日立化成工业株式会社 Cmp研磨剂以及研磨方法
JP2004311967A (ja) * 2003-03-27 2004-11-04 Nippon Shokubai Co Ltd Ｃｍｐ研磨剤用ポリマー及び組成物
US20060135045A1 (en) * 2004-12-17 2006-06-22 Jinru Bian Polishing compositions for reducing erosion in semiconductor wafers
US20090093118A1 (en) * 2005-04-14 2009-04-09 Showa Denko K.K. Polishing composition
US20070175104A1 (en) * 2005-11-11 2007-08-02 Hitachi Chemical Co., Ltd. Polishing slurry for silicon oxide, additive liquid and polishing method
JP5335183B2 (ja) 2006-08-24 2013-11-06 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
JP2009147267A (ja) * 2007-12-18 2009-07-02 Dai Ichi Kogyo Seiyaku Co Ltd 化学機械研磨用研磨剤
KR101563023B1 (ko) 2008-02-18 2015-10-23 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법
JP2010274348A (ja) 2009-05-27 2010-12-09 Nihon Micro Coating Co Ltd 研磨フィルム及びこれを用いた研磨方法
KR20140027561A (ko) 2009-06-09 2014-03-06 히타치가세이가부시끼가이샤 연마제, 연마제 세트 및 기판의 연마 방법
JP2011171689A (ja) 2009-07-07 2011-09-01 Kao Corp シリコンウエハ用研磨液組成物
WO2011093223A1 (ja) * 2010-01-29 2011-08-04 株式会社 フジミインコーポレーテッド 半導体ウェーハの再生方法及び研磨用組成物
WO2011111421A1 (ja) * 2010-03-12 2011-09-15 日立化成工業株式会社 スラリ、研磨液セット、研磨液及びこれらを用いた基板の研磨方法
JP4772156B1 (ja) 2010-07-05 2011-09-14 花王株式会社 シリコンウエハ用研磨液組成物
CN103222036B (zh) * 2010-11-22 2016-11-09 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基板的研磨方法及基板
JP2013057226A (ja) 2011-09-06 2013-03-28 Masaru Hiyamizu 外壁材、屋根材の省エネルギ−材
JP2013057227A (ja) 2011-09-06 2013-03-28 Takao Suzuki 管渠等沈下測定小型マンホール設置工
JP2013057225A (ja) 2011-09-07 2013-03-28 Yanagisawa Concrete Kogyo Kk アーチ甲蓋
JP2013057228A (ja) 2011-09-09 2013-03-28 Hiroaki Matsuda 排水口用ゴミ取り器
JP6077209B2 (ja) * 2011-11-25 2017-02-08 株式会社フジミインコーポレーテッド 研磨用組成物
US10557058B2 (en) 2012-02-21 2020-02-11 Hitachi Chemical Company, Ltd. Polishing agent, polishing agent set, and substrate polishing method
JP5822356B2 (ja) 2012-04-17 2015-11-24 花王株式会社 シリコンウェーハ用研磨液組成物
US9133366B2 (en) 2012-05-25 2015-09-15 Nissan Chemical Industries, Ltd. Polishing liquid composition for wafers
JP5927059B2 (ja) * 2012-06-19 2016-05-25 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた基板の製造方法
KR102226441B1 (ko) 2013-02-13 2021-03-12 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마용 조성물 제조 방법 및 연마물 제조 방법
US10351732B2 (en) 2013-03-19 2019-07-16 Fujimi Incorporated Polishing composition, method for producing polishing composition and polishing composition preparation kit

Also Published As

Publication number Publication date
TWI665275B (zh) 2019-07-11
EP3967736B1 (en) 2023-10-11
KR102330030B1 (ko) 2021-11-24
WO2014148399A1 (ja) 2014-09-25
EP2977423A4 (en) 2017-03-22
JP2019151849A (ja) 2019-09-12
EP2977423A1 (en) 2016-01-27
JP5900913B2 (ja) 2016-04-06
TWI640586B (zh) 2018-11-11
JP6514653B2 (ja) 2019-05-15
EP2977423B1 (en) 2022-09-28
EP3967736A1 (en) 2022-03-16
KR20150133694A (ko) 2015-11-30
US20160272846A1 (en) 2016-09-22
TW201900795A (zh) 2019-01-01
JP2016166343A (ja) 2016-09-15
JP6513591B2 (ja) 2019-05-15
JP2022118024A (ja) 2022-08-12
US10351732B2 (en) 2019-07-16
JP2016135882A (ja) 2016-07-28
TW201500492A (zh) 2015-01-01
JP7246235B2 (ja) 2023-03-27
JPWO2014148399A1 (ja) 2017-02-16
CN105051145B (zh) 2018-06-26
CN105051145A (zh) 2015-11-11

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