JPWO2021182278A1 - - Google Patents
Info
- Publication number
- JPWO2021182278A1 JPWO2021182278A1 JP2022505994A JP2022505994A JPWO2021182278A1 JP WO2021182278 A1 JPWO2021182278 A1 JP WO2021182278A1 JP 2022505994 A JP2022505994 A JP 2022505994A JP 2022505994 A JP2022505994 A JP 2022505994A JP WO2021182278 A1 JPWO2021182278 A1 JP WO2021182278A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020044715 | 2020-03-13 | ||
PCT/JP2021/008369 WO2021182278A1 (ja) | 2020-03-13 | 2021-03-04 | 研磨用組成物および研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021182278A1 true JPWO2021182278A1 (ja) | 2021-09-16 |
Family
ID=77672327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022505994A Pending JPWO2021182278A1 (ja) | 2020-03-13 | 2021-03-04 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20230106868A1 (ja) |
EP (1) | EP4120322A4 (ja) |
JP (1) | JPWO2021182278A1 (ja) |
KR (1) | KR20220150963A (ja) |
CN (1) | CN115244658A (ja) |
TW (1) | TW202140740A (ja) |
WO (1) | WO2021182278A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4593064B2 (ja) * | 2002-09-30 | 2010-12-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
JP5196819B2 (ja) | 2007-03-19 | 2013-05-15 | ニッタ・ハース株式会社 | 研磨用組成物 |
SG11201507438YA (en) * | 2013-03-19 | 2015-10-29 | Fujimi Inc | Polishing composition, method for producing polishing composition and polishing composition preparation kit |
JP6279593B2 (ja) * | 2013-09-26 | 2018-02-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物の製造方法およびシリコンウェーハ製造方法 |
WO2017169154A1 (ja) * | 2016-03-30 | 2017-10-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法 |
JP7109320B2 (ja) | 2018-09-19 | 2022-07-29 | 株式会社Screenホールディングス | 印刷装置及びそのズレ量算出方法 |
WO2021182155A1 (ja) * | 2020-03-13 | 2021-09-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
-
2021
- 2021-03-04 KR KR1020227035054A patent/KR20220150963A/ko unknown
- 2021-03-04 CN CN202180019887.7A patent/CN115244658A/zh active Pending
- 2021-03-04 JP JP2022505994A patent/JPWO2021182278A1/ja active Pending
- 2021-03-04 EP EP21767897.8A patent/EP4120322A4/en active Pending
- 2021-03-04 US US17/911,064 patent/US20230106868A1/en active Pending
- 2021-03-04 WO PCT/JP2021/008369 patent/WO2021182278A1/ja active Application Filing
- 2021-03-12 TW TW110108831A patent/TW202140740A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20230106868A1 (en) | 2023-04-06 |
CN115244658A (zh) | 2022-10-25 |
TW202140740A (zh) | 2021-11-01 |
EP4120322A1 (en) | 2023-01-18 |
KR20220150963A (ko) | 2022-11-11 |
EP4120322A4 (en) | 2024-03-27 |
WO2021182278A1 (ja) | 2021-09-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240119 |