SG11201505095RA - Warped silicon-chip adsorption device and adsorption method thereof - Google Patents

Warped silicon-chip adsorption device and adsorption method thereof

Info

Publication number
SG11201505095RA
SG11201505095RA SG11201505095RA SG11201505095RA SG11201505095RA SG 11201505095R A SG11201505095R A SG 11201505095RA SG 11201505095R A SG11201505095R A SG 11201505095RA SG 11201505095R A SG11201505095R A SG 11201505095RA SG 11201505095R A SG11201505095R A SG 11201505095RA
Authority
SG
Singapore
Prior art keywords
adsorption
chip
warped silicon
adsorption device
warped
Prior art date
Application number
SG11201505095RA
Inventor
Xinxin Wang
Xuchu Jiang
Tao Xu
Wenjing Zhu
Fangxiong Sun
Jun Sun
Original Assignee
Shanghai Microelectronics Equi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Microelectronics Equi filed Critical Shanghai Microelectronics Equi
Publication of SG11201505095RA publication Critical patent/SG11201505095RA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
SG11201505095RA 2012-12-28 2013-12-26 Warped silicon-chip adsorption device and adsorption method thereof SG11201505095RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210586817.2A CN103904011B (en) 2012-12-28 2012-12-28 Warpage silicon-chip absorption device and absorption method thereof
PCT/CN2013/090565 WO2014101795A1 (en) 2012-12-28 2013-12-26 Warped silicon-chip adsorption device and adsorption method thereof

Publications (1)

Publication Number Publication Date
SG11201505095RA true SG11201505095RA (en) 2015-08-28

Family

ID=50995275

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201608644YA SG10201608644YA (en) 2012-12-28 2013-12-26 Warped silicon-chip adsorption device and adsorption method thereof
SG11201505095RA SG11201505095RA (en) 2012-12-28 2013-12-26 Warped silicon-chip adsorption device and adsorption method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201608644YA SG10201608644YA (en) 2012-12-28 2013-12-26 Warped silicon-chip adsorption device and adsorption method thereof

Country Status (6)

Country Link
US (1) US20150357217A1 (en)
KR (1) KR20150103153A (en)
CN (1) CN103904011B (en)
SG (2) SG10201608644YA (en)
TW (1) TW201427796A (en)
WO (1) WO2014101795A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316181B2 (en) * 2014-12-18 2018-04-25 東京エレクトロン株式会社 Substrate holding stage
US10381256B2 (en) * 2015-03-12 2019-08-13 Kla-Tencor Corporation Apparatus and method for chucking warped wafers
CN106252791B (en) * 2015-06-12 2019-02-19 睿励科学仪器（上海）有限公司 Silicon wafer sucking disc
CN104992921B (en) * 2015-07-16 2017-09-01 北京工业大学 A kind of clamping device of large-size ultra-thin wafer
CN106887401A (en) * 2015-12-15 2017-06-23 浙江鸿禧能源股份有限公司 A kind of new classification and Detection board rectifier sucker
TWI630059B (en) * 2015-12-25 2018-07-21 日商三星鑽石工業股份有限公司 Substrate adsorption device and workbench
CN105842996B (en) * 2016-05-30 2017-12-08 上海华力微电子有限公司 A kind of wafer carrying adsorptive pressure optimization method of litho machine
CN107452643B (en) * 2016-05-31 2020-11-13 弘塑科技股份有限公司 Substrate flattening apparatus and semiconductor manufacturing method using the same
TWI584408B (en) * 2016-09-06 2017-05-21 Long turn nozzle device
CN108242418A (en) * 2016-12-23 2018-07-03 上海微电子装备（集团）股份有限公司 A kind of substrate adsorbing mechanism, substrate connection device and method
CN109427640B (en) * 2017-08-22 2020-08-04 京东方科技集团股份有限公司 Adsorption device and adsorption method
CN108305849B (en) * 2018-01-31 2020-08-04 徐州诚凯知识产权服务有限公司 Chip and mounting substrate alignment device and alignment mounting method
CN108435714B (en) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 Novel dry ice cleaning base and cleaning method thereof
CN109244028B (en) * 2018-09-28 2022-11-18 上海微松工业自动化有限公司 Wafer flattening and fixing method
CN109484069B (en) * 2018-10-30 2020-12-08 周菊青 Novel inkstone ink grinding device capable of achieving intermittent water inlet synchronous grinding
TWI701090B (en) * 2019-01-17 2020-08-11 日月光半導體製造股份有限公司 Panel handling apparatus and method thereof and multistage suction device
CN110620067B (en) * 2019-09-24 2022-03-25 中国科学院微电子研究所 Method for improving warping of silicon wafer by adjusting suction force distribution of sucking disc
CN111085954A (en) * 2019-12-24 2020-05-01 深圳市华星光电半导体显示技术有限公司 Substrate adsorption device
TWI810445B (en) * 2020-03-27 2023-08-01 由田新技股份有限公司 A semiconductor wafer leveling device and leveling method thereof
CN114454023B (en) * 2021-03-01 2022-12-16 华中科技大学 Wafer grinding adsorption platform based on standard cylinder
CN113066751A (en) * 2021-03-25 2021-07-02 深圳中科飞测科技股份有限公司 Bearing device and bearing system
CN113078094A (en) * 2021-03-25 2021-07-06 深圳中科飞测科技股份有限公司 Warpage correction method, bearing device and bearing system
CN113650045B (en) * 2021-09-17 2022-12-20 长江存储科技有限责任公司 Manipulator for picking up wafer
CN113983286A (en) * 2021-09-25 2022-01-28 安徽和邦纺织科技有限公司 Gauze embroidery feeding monitoring device
CN113859968B (en) * 2021-09-26 2022-12-30 博众精工科技股份有限公司 Material taking module
CN114211520B (en) * 2022-02-21 2022-05-17 鹰星精密工业（深圳）有限公司 High-precision linear manipulator and application method
CN115352877A (en) * 2022-08-31 2022-11-18 京东方科技集团股份有限公司 Screen fixing device and control method and equipment thereof
CN115338802B (en) * 2022-09-06 2023-10-10 无锡福田包装制品有限公司 Electric motor car shell surface applique positioning fixture
CN116331845B (en) * 2023-05-30 2023-08-15 泰州恒润玻璃有限公司 Toughened glass handling device
CN116588683B (en) * 2023-07-19 2023-09-12 常州协创智联电子有限公司 Suction nozzle assembly for carrying battery cell, carrying mechanism using suction nozzle assembly and carrying method

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2198765A (en) * 1938-08-05 1940-04-30 Merritt Engineering & Sales Co Vacuum cup and vacuum cup system
US3460822A (en) * 1965-10-23 1969-08-12 E & E Eng Co Vacuum workholder
US3448510A (en) * 1966-05-20 1969-06-10 Western Electric Co Methods and apparatus for separating articles initially in a compact array,and composite assemblies so formed
US3484093A (en) * 1967-07-03 1969-12-16 Sylvania Electric Prod Article holding apparatus
US3804397A (en) * 1971-08-19 1974-04-16 Gco Automatic positioning vacuum cup
CH546691A (en) * 1972-03-29 1974-03-15 Bobst Fils Sa J TELESCOPIC SUCTION CUP FOR HANDLING SHEET MATERIALS.
US3800741A (en) * 1973-02-12 1974-04-02 Grace W R & Co Chuck for crown closure lining apparatus
US3910620A (en) * 1974-04-15 1975-10-07 American Chain & Cable Co High temperature vacuum pad lift
US4470585A (en) * 1981-04-14 1984-09-11 Z. Bavelloni S.P.A. Holding device for glass panes, marble slabs, and like bodies
US4530635A (en) * 1983-06-15 1985-07-23 The Perkin-Elmer Corporation Wafer transferring chuck assembly
JPS61214937A (en) * 1985-03-15 1986-09-24 Canon Inc Attractive holder
US4723766A (en) * 1986-10-01 1988-02-09 Ekstrom, Carlson & Co. Programmable vacuum pod system for chucking workpieces
JPS63131535A (en) * 1986-11-21 1988-06-03 Canon Inc Substrate supporting device
JPS63144925A (en) * 1986-12-05 1988-06-17 Nippei Toyama Corp Clamp lifter device for cut surface working
IT1210376B (en) * 1987-06-04 1989-09-14 Jobs Spa APPARATUS AND METHOD FOR FIXING CURVED SLABS TO BE PROCESSED
JP2691299B2 (en) * 1989-06-12 1997-12-17 株式会社ニコン Board holder
JP2501366B2 (en) * 1990-05-17 1996-05-29 株式会社 エフエスケー Object holding device
US5177857A (en) * 1990-05-17 1993-01-12 Fsk Inc. Method for holding an object to a surface using valve controlled vacuum force
US5457868A (en) * 1991-03-26 1995-10-17 Gfm Gesellschaft Fur Fertigungstechnik Und Maschinenbau Aktiengesellschaft Work supporting method using a deck for use in machine tools, particularly in cutting machines
JPH0758191A (en) * 1993-08-13 1995-03-03 Toshiba Corp Wafer stage device
US5572785A (en) * 1994-07-27 1996-11-12 Eastman Kodak Company Apparatus and method for automated assembly of precision components
US5937993A (en) * 1997-01-14 1999-08-17 Tamarac Scientific Co., Inc. Apparatus and method for automatically handling and holding panels near and at the exact plane of exposure
US6182955B1 (en) * 1998-07-03 2001-02-06 Alvin Jay Kimble Grid-lock vacuum clamping system
JP4513145B2 (en) * 1999-09-07 2010-07-28 ソニー株式会社 Semiconductor device manufacturing method and polishing method
CH695405A5 (en) * 1999-12-14 2006-04-28 Esec Trading Sa Semiconductor die and wire bonder holding curved substrate flat and level at processing station, includes plate with resting surface and suction units
CN101474771B (en) * 2003-02-10 2012-07-11 株式会社荏原制作所 Substrate holding flexible assembly, substrate polishing apparatus and method
JP4470199B2 (en) * 2003-09-25 2010-06-02 Ｓｍｃ株式会社 Semiconductor substrate temperature control device
CN2840620Y (en) * 2005-10-20 2006-11-22 天津科技大学 Transfer the balance device of electronic device
WO2008153086A1 (en) * 2007-06-12 2008-12-18 Nikon Corporation Substrate detecting apparatus, substrate aligning apparatus, substrate bonding apparatus having substrate detecting apparatus and substrate aligning apparatus, wafer outer shape detecting apparatus, wafer aligning apparatus, and wafer bonding apparatus having wafer outer shape detecting apparatus and wafer outer shape detec
CN201350632Y (en) * 2008-12-23 2009-11-25 晶彩科技股份有限公司 Base plate adsorption device
CN102569147B (en) * 2010-12-28 2015-11-25 上海微电子装备有限公司 Silicon wafer adsorption mechanism and using method thereof
CN202417858U (en) * 2011-12-01 2012-09-05 刘永祯 Pneumatically propelled plunger pump
TWM432639U (en) * 2012-02-24 2012-07-01 Highlight Tech Corp Shock absorbing unit improvement of thin-body carrying device

Also Published As

Publication number Publication date
US20150357217A1 (en) 2015-12-10
CN103904011A (en) 2014-07-02
WO2014101795A1 (en) 2014-07-03
TWI495541B (en) 2015-08-11
KR20150103153A (en) 2015-09-09
TW201427796A (en) 2014-07-16
CN103904011B (en) 2016-12-28
SG10201608644YA (en) 2016-12-29

Similar Documents

Publication Publication Date Title
SG10201608644YA (en) Warped silicon-chip adsorption device and adsorption method thereof
HK1205921A1 (en) Excreta-handling device and method therefor
EP2866247A4 (en) Ion guiding device and ion guiding method
EP2821748A4 (en) Range finding device and range finding method
EP2802373A4 (en) Catheterization apparatus and methods thereof
HK1201695A1 (en) Noodle-steaming method and noodle-steaming device
EP2864804A4 (en) Methods and devices for improved position determination
PL2885200T3 (en) Mechanical positioning device and method
EP2871464A4 (en) Analysis device and analysis method
EP2916559A4 (en) Method and device for playing content
EP2863652A4 (en) Audio interface self-adaptation device
EP2887994A4 (en) Device and method for improving brachytherapy
EP2849109A4 (en) Media playing method and device
HK1207461A1 (en) Graph-drawing device and graph-drawing method
EP2830232A4 (en) Double-stream beamforming method and device
EP2933998A4 (en) Pick-up device and pick-up method
EP2786238A4 (en) Method and device for processing tabbed-page
EP2804539A4 (en) Tissue-acquisition device and method
EP2850678A4 (en) An apparatus and associated methods
GB201521243D0 (en) Adsorbent and analysis method using same
EP2816492A4 (en) Locating method and locating device
GB201222362D0 (en) Device and method
SG2012075792A (en) An improved device and method
EP2914011A4 (en) Media playing method and device
EP2810750A4 (en) Rod-shaped member chucking device and rod-shaped member chucking method