JP2691299B2 - Board holder - Google Patents
Board holderInfo
- Publication number
- JP2691299B2 JP2691299B2 JP1146770A JP14677089A JP2691299B2 JP 2691299 B2 JP2691299 B2 JP 2691299B2 JP 1146770 A JP1146770 A JP 1146770A JP 14677089 A JP14677089 A JP 14677089A JP 2691299 B2 JP2691299 B2 JP 2691299B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- suction
- mounting surface
- suction port
- port portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は、集積回路やプリント配線板製造用の露光
装置等において基板を保持するために用いられる基板ホ
ルダに関するものである。Description: TECHNICAL FIELD The present invention relates to a substrate holder used for holding a substrate in an exposure apparatus for manufacturing integrated circuits, printed wiring boards and the like.
［従来の技術］ 集積回路やプリント配線板を製造する際に用いられる
露光装置においては、基板のそりやねじれを矯正して基
板表面を焦平面に合致させた状態で保持するための基板
ホルダが必要である。また、露光装置以外にも例えば、
プリント配線板製造用のスクリーン印刷機等においても
版と基板表面の間隔を一定の距離に設定するために基板
表面を所定の平面に合致させた状態で基板を保持する必
要がある。[Prior Art] In an exposure apparatus used when manufacturing an integrated circuit or a printed wiring board, a substrate holder for holding a substrate surface in a state of being aligned with a focal plane by correcting warpage and twist of the substrate is provided. is necessary. In addition to the exposure apparatus, for example,
Even in a screen printing machine or the like for manufacturing a printed wiring board, it is necessary to hold the substrate in a state in which the substrate surface is aligned with a predetermined plane in order to set the distance between the plate and the substrate surface to a constant distance.
第４図A,Bは従来のこの種の基板ホルダを示す平面図
及び側面図である。図において、基板ホルダの基板載置
面201は平面度良く加工されており、真空吸着用の溝203
が設けられている。そして、この溝203は配管部材207を
介して吸引手段（図示せず）に連通されており、載置さ
れた基板202は吸引手段によって基板載置面201上に吸着
されることによりそり等が矯正された状態で保持され
る。4A and 4B are a plan view and a side view showing a conventional substrate holder of this type. In the figure, the substrate mounting surface 201 of the substrate holder is processed with good flatness, and a groove 203 for vacuum suction is provided.
Is provided. The groove 203 is communicated with a suction means (not shown) via a piping member 207, and the mounted substrate 202 is attracted onto the substrate mounting surface 201 by the suction means, so that a warp or the like is generated. It is held in a straightened condition.
［発明が解決しようとする課題］ しかし、上記のような従来の基板ホルダにおいては、
基板のそりやねじれが大きい場合、特に周辺部が載置面
から浮き上がるようにそっているような場合は、周辺部
から空気が漏れてしまうため基板を真空吸着することが
できないという問題があった。また、基板が載置面上に
固定されたとしても、周辺部のそりが矯正されずに基板
の周辺部が焦平面から外れた状態で露光がなされると、
基板上に適正な画像が形成されず不良品を製造すること
になってしまう。[Problems to be Solved by the Invention] However, in the conventional substrate holder as described above,
There was a problem that the substrate could not be vacuum-adsorbed because air leaks from the peripheral part when the warp or twist of the substrate is large, especially when the peripheral part is curved so as to float above the mounting surface. . Further, even if the substrate is fixed on the mounting surface, if the exposure is performed in a state where the peripheral portion of the substrate is out of the focal plane without correcting the warp of the peripheral portion,
An appropriate image is not formed on the substrate, and a defective product is manufactured.
この発明は、かかる点に鑑みてなされたものであり、
基板のそりが大きい場合でもそりを矯正した状態で基板
保持することのできる基板ホルダを提供することを目的
とするものである。The present invention has been made in view of such a point,
An object of the present invention is to provide a substrate holder capable of holding a substrate in a state where the warp is corrected even when the warp of the substrate is large.
［課題を解決するための手段］ 本発明の基板ホルダは、基板が載置される載置面であ
って溝又は孔の開口部を有する載置面と、この載置面に
設けられた溝又は孔の開口部と連通され、前記基板を前
記載置面上に吸着固定する吸引手段とを備えた基板ホル
ダであって、前記課題の達成のために、前記載置面の基
板が載置される領域に、前記吸引手段に連通された吸着
口を表面に有し載置面と直交する方向に変位可能な吸着
部材が、載置面から吸着口を突出させた状態で配置され
た基板ホルダである。[Means for Solving the Problems] A substrate holder according to the present invention is a mounting surface on which a substrate is mounted and having a groove or an opening of a hole, and a groove provided in this mounting surface. Alternatively, a substrate holder is provided, which is in communication with the opening of the hole and includes suction means for adsorbing and fixing the substrate on the mounting surface, wherein the substrate on the mounting surface is mounted in order to achieve the above object. In a region to be held, a suction member which has a suction port communicating with the suction means on its surface and is displaceable in a direction orthogonal to the mounting surface is arranged with the suction port protruding from the mounting surface. It is a holder.
［作用］ 本発明の基板ホルダにおいては、基板が載置される領
域に載置面と直交する方向に変位可能な吸着部材が、吸
着口を載置面から突出させた状態で配置されており、基
板のそりが大きい場合でも吸着部材の吸着口が基板裏面
に接触する。そして、基板を吸着した状態で、吸着部材
が基板載置面と吸着口表面とがほぼ一致する位置まで後
退（埋没）すると、基板裏面が載置面に接し吸着溝
（孔）の周囲が閉止された状態となる。しかる後、吸着
溝（孔）からホルダの基板載置面と基板との間にある空
気を吸引すれば、空気が漏れることなく載置面上に吸着
固定されることになる。これにより、基板表面は配置面
と同等の平面度（基板自体の厚さのばらつきや表面の凹
凸等による誤差はある）で保持されることになる。[Operation] In the substrate holder of the present invention, the suction member that is displaceable in the direction orthogonal to the mounting surface is arranged in the region where the substrate is mounted, with the suction port protruding from the mounting surface. Even when the warpage of the substrate is large, the suction port of the suction member contacts the back surface of the substrate. Then, when the suction member retracts (embeds) to a position where the substrate mounting surface and the suction port surface almost coincide with each other while sucking the substrate, the back surface of the substrate contacts the mounting surface and the periphery of the suction groove (hole) is closed. It will be in the state of being. After that, if the air between the substrate mounting surface of the holder and the substrate is sucked through the suction groove (hole), the air is sucked and fixed onto the mounting surface without leaking. As a result, the substrate surface is held with the same flatness as the arrangement surface (there are errors due to variations in the thickness of the substrate itself, surface irregularities, etc.).
［実施例］ 第１図Ａは本発明実施例による基板ホルダの模式的な
平面図及び側面図である。図において、基板ホルダの基
板配置面１には吸着溝３がほぼ均等に配置されており、
この吸着溝３は配管部材７を介して吸引手段９に連通さ
れている。また、載置面１の基板２周辺部が載置される
領域（本実施例では載置面の４隅）には、載置面１と直
交する方向に変位可能な吸着部材４（詳細後述）が吸着
口を載置面から突出させた状態で配置されており、この
吸着部材４の吸着口も配管部材７を介して吸引手段９に
連通されている。[Embodiment] FIG. 1A is a schematic plan view and side view of a substrate holder according to an embodiment of the present invention. In the figure, the suction grooves 3 are arranged substantially evenly on the substrate placement surface 1 of the substrate holder.
The suction groove 3 is communicated with the suction means 9 via the piping member 7. Further, in the regions (four corners of the mounting surface in this embodiment) where the peripheral portion of the substrate 2 of the mounting surface 1 is mounted, the suction member 4 which can be displaced in the direction orthogonal to the mounting surface 1 (details will be described later). ) Is arranged with the suction port protruding from the mounting surface, and the suction port of this suction member 4 is also communicated with the suction means 9 via the piping member 7.
このような構成の基板ホルダにおいては、まず載置面
１から突出している吸着部材４によって載置面１から浮
き上がっている基板２周辺部が吸着され、その状態で吸
着部材４が下方に後退することにより浮き上がっていた
基板２の周辺部が載置面１上まで引き下げられる。この
状態で、吸引溝３から基板２と載置面１の間にある空気
が吸引手段９によって引き込まれると基板２全体が載置
面１に密着固定される。In the substrate holder having such a configuration, first, the suction member 4 projecting from the mounting surface 1 sucks the peripheral portion of the substrate 2 floating from the mounting surface 1, and in this state, the suction member 4 retracts downward. As a result, the peripheral portion of the substrate 2 that has been lifted is pulled down to the mounting surface 1. In this state, when the air between the substrate 2 and the mounting surface 1 is drawn in from the suction groove 3 by the suction means 9, the entire substrate 2 is tightly fixed to the mounting surface 1.
次に、本実施例における吸着部材４の構造及び動作に
ついて第２図A,Bを用いてより具体的に説明する。吸着
部材４は載置面１に開口部を有する取付け孔内に配設さ
れており、表面に吸着口５を備えている。この吸着口５
は、シリコンゴム等からなる中空の弾性部材６及び配管
部材７を介して吸引手段（第２図では図示せず）と連通
されている。弾性部材６は側壁断面形状がベローズ状に
なっており軸方向に圧縮可能な形状（図に示された形状
に限らず、載置面と平行な方向に剛性が高く、載置面と
直交する方向に剛性が低い形状であれば良い）をなして
いる。Next, the structure and operation of the suction member 4 in this embodiment will be described more specifically with reference to FIGS. 2A and 2B. The suction member 4 is arranged in a mounting hole having an opening on the mounting surface 1, and has a suction port 5 on the surface. This suction port 5
Is connected to a suction means (not shown in FIG. 2) through a hollow elastic member 6 made of silicon rubber or the like and a piping member 7. The elastic member 6 has a bellows-shaped side wall cross section and is axially compressible (not limited to the shape shown in the figure, but has a high rigidity in a direction parallel to the mounting surface and is orthogonal to the mounting surface. The shape has low rigidity in the direction).
このような構造の吸着部材４は、吸着前の状態（第２
図Ａ）では吸着口５は基板載置面1aから突出しており載
置面1aから浮き上っている基板２周辺部の裏面に接して
いる。そして、吸引手段により弾性部材６内部の空気が
引き込まれると、基板２が吸着口５に吸着されるととも
に弾性部材６は大気圧によって軸方向（載置面と直交す
る方向）に押しつぶされる。これにより吸着口５が下方
に後退し、吸着された基板２が載置面と接する位置まで
引き下げられることになる。The suction member 4 having such a structure is in a state before the suction (second
In FIG. A), the suction port 5 projects from the substrate mounting surface 1a and is in contact with the back surface of the peripheral portion of the substrate 2 which is floating above the mounting surface 1a. Then, when the air inside the elastic member 6 is drawn in by the suction means, the substrate 2 is adsorbed to the adsorption port 5 and the elastic member 6 is crushed by the atmospheric pressure in the axial direction (direction orthogonal to the mounting surface). As a result, the suction port 5 retreats downward, and the sucked substrate 2 is pulled down to a position in contact with the mounting surface.
第３図A,Bは、本発明における更に別の吸着部材の例
を示した断面図である。第３図の例では、吸着部材104
は載置面101に設けられた凹部に配設されており、吸着
口105は直接配管部材107に接続されている。そして、吸
着口105の鍔部と凹部底面の間にはバネ部材108が介装さ
れており、吸着口105と接続された配管部材107には吸着
口105を下方へ引き下げるための位置変動手段（図示せ
ず）が取付けられている。3A and 3B are cross-sectional views showing examples of still another adsorption member according to the present invention. In the example of FIG. 3, the suction member 104
Is disposed in a recess provided on the mounting surface 101, and the suction port 105 is directly connected to the piping member 107. A spring member 108 is interposed between the flange portion of the suction port 105 and the bottom surface of the recess, and the pipe member 107 connected to the suction port 105 has a position changing means for pulling the suction port 105 downward ( (Not shown) is attached.
このような構造の吸着部材では、吸着前（第３図Ａ）
においては吸着口105が載置面から突出した状態（バネ
部材108が伸びた状態）となっており、吸引手段によっ
て基板２が吸着されると、位置変動手段によって吸着口
105が下方に引き下げられ（ばね部材108が圧縮され
る）、吸着口105表面と基板載置面101が一致したところ
で位置変動手段が固定され、基板が載置面101に接した
状態で保持される。そして露光等の動作が終了した後に
は、位置変動手段が開放さればね部材108が復元して再
び吸着口105は載置面101から突出した状態となる。With the suction member having such a structure, before suction (FIG. 3A)
, The suction port 105 is projected from the mounting surface (the spring member 108 is extended), and when the substrate 2 is sucked by the suction unit, the position changing unit sucks the substrate 2.
105 is pulled down (the spring member 108 is compressed), and when the surface of the suction port 105 and the substrate mounting surface 101 coincide, the position changing means is fixed, and the substrate is held in contact with the mounting surface 101. It Then, after the operations such as exposure are completed, the position changing means is opened, the spring member 108 is restored, and the suction port 105 again projects from the mounting surface 101.
以上説明したようにして、本実施例では載置面から浮
き上がっている基板周辺部が吸着部材によって吸着され
て載置面まで引き下げられ、そりの大きい基板であって
もそりを矯正した状態で載置面に真空吸着することがで
きる。As described above, in the present embodiment, the peripheral portion of the substrate floating from the mounting surface is sucked by the suction member and pulled down to the mounting surface, and even if the substrate has a large warp, it is mounted in a state where the warp is corrected. It can be vacuum-adsorbed on the placement surface.
なお、上記の実施例では吸着部材が下方にのみ変位す
るようになっているが、基板のそりの程度のばらつきが
大きい場合には吸着部材を上方にも変位させるようにし
ても良い。また、吸着部材のみを変位させるだけでな
く、吸着部材の高さ位置は固定したまま載置面の吸着溝
形成領域を配置面と直交する方向に変位可能に構成して
も良い。また、本発明にかかる吸着部材は周辺部だけで
なく中央部にも配置しても良いことは言うまでもなく、
基板の形状，大きさ、そりの傾向等に応じて適宜配置
数，設置箇所を選択すれば良い。Although the suction member is displaced only downward in the above embodiment, the suction member may be displaced upward when the degree of warpage of the substrate varies widely. Further, not only the suction member may be displaced, but the suction groove forming region of the mounting surface may be displaceable in a direction orthogonal to the arrangement surface while the height position of the suction member is fixed. Needless to say, the suction member according to the present invention may be arranged not only in the peripheral portion but also in the central portion.
The number of arrangements and installation locations may be appropriately selected according to the shape and size of the substrate, the tendency of warpage, and the like.
更に、上記に説明した基板ホルダにおいては基板の吸
着を真空吸着によって行なっているが、例えば電子線荷
電粒子等を用いた静電描画装置のように真空吸着が適応
できない場合は、例えば静電吸着によって基板を吸着す
ることができる。Further, in the substrate holder described above, the suction of the substrate is performed by vacuum suction. However, when vacuum suction cannot be applied as in the electrostatic drawing apparatus using electron beam charged particles, for example, electrostatic suction is performed. The substrate can be adsorbed by.
また、吸着溝３及び吸着部材４は共に配管部材７を介
して吸引手段９に連通されているが、吸着溝３及び吸着
部材４をそれぞれ異なる吸引手段に連通させるように構
成しても良いことは明かである。Further, both the suction groove 3 and the suction member 4 are communicated with the suction means 9 through the piping member 7, but the suction groove 3 and the suction member 4 may be respectively communicated with different suction means. Is clear.
［発明の効果］ 以上のように、本発明の基板ホルダにおいては、基板
が載置される領域に、載置面と直交する方向に変位可能
な吸着部材が載置面から吸着口を突出させた状態で配置
されているので、基板が載置面から浮き上がっているよ
うな場合でも何等支障なく基板を載置面に密着固定する
ことができる。[Advantages of the Invention] As described above, in the substrate holder of the present invention, the suction member, which is displaceable in the direction orthogonal to the mounting surface, projects the suction port from the mounting surface in the region where the substrate is mounted. Since the substrates are arranged in a closed state, the substrate can be closely fixed to the mounting surface even if the substrate is lifted from the mounting surface.
かかる基板ホルダを集積回路やプリント配線板製造用
の露光装置や印刷装置に用いれば、大型の基板や前工程
で熱履歴を経ている基板を扱う場合のように基板のそり
が大きい場合でも、そりを矯正した状態で基板を保持す
ることができるので、基板のそりによって製造工程が乱
れたり不良品が発生したりすることを回避することがで
き、微細パターンを効率良く形成する上で非常に有益で
ある。When such a substrate holder is used in an exposure device or a printing device for manufacturing an integrated circuit or a printed wiring board, even if the warp of the substrate is large as in the case of handling a large substrate or a substrate that has undergone thermal history in the previous process, the warp Since it is possible to hold the substrate in a state in which it has been corrected, it is possible to avoid disturbing the manufacturing process or causing defective products due to the warpage of the substrate, which is very useful for efficiently forming a fine pattern. Is.
第１図A,Bは本発明の実施例を示す模式的な平面図及び
側面図、第２図A,Bは本発明実施例における吸着部材の
構造及び動作を説明する断面図、第３図A,Bは吸着部材
の更に別の例の構造及び動作を説明する断面図、第４図
A,Bは従来例を説明する平面図及び側面図てある。 ［主要部分の符号の説明］ 1,101…載置面 2,102…基板 ３…吸着溝 ４…吸着部材 5,105…吸着口 ６…弾性部材 7,107…配管部材 108…ばね部材 ９…吸引手段1A and 1B are schematic plan views and side views showing an embodiment of the present invention, and FIGS. 2A and 2B are sectional views for explaining the structure and operation of the suction member in the embodiment of the present invention, and FIG. 4A and 4B are cross-sectional views for explaining the structure and operation of still another example of the suction member.
A and B are a plan view and a side view illustrating a conventional example. [Description of Symbols of Main Parts] 1,101 ... Placement surface 2,102 ... Substrate 3 ... Adsorption groove 4 ... Adsorption member 5,105 ... Adsorption port 6 ... Elastic member 7,107 ... Piping member 108 ... Spring member 9 ... Suction means
Claims (3)
に連通した配管部材を真空吸引することにより、前記基
板を前記載置面上に吸着固定する基板ホルダにおいて、 前記基板を吸着可能な吸着口部と、 前記吸着口部の下方に設けられ、前記載置面と直交する
方向に前記吸着口部を付勢して前記吸着口部の少なくと
も一部を前記載置面より突出させる吸着部材と、 前記載置面より突出した前記吸着口部を介して前記基板
を真空吸引した際に、前記吸着部材に抗して前記吸着口
部を前記載置面より突出した位置から後退させて前記基
板を真空吸引する吸引手段とを備えたことを特徴とする
基板ホルダ。1. A substrate holder for sucking and fixing the substrate on the mounting surface by vacuum suctioning a piping member communicating with a groove or hole provided on the mounting surface on which the substrate is mounted. A suction port portion capable of sucking the suction port portion, and the suction port portion is provided below the suction port portion and urges the suction port portion in a direction orthogonal to the mounting surface so that at least a part of the suction port portion is mounted on the mounting surface. When the substrate is vacuum-sucked through the suction member which is further projected and the suction port portion which is projected from the mounting surface, the position where the suction port portion is projected from the mounting surface against the suction member. And a suction means for vacuum suctioning the substrate by retracting the substrate from the substrate holder.
基板を真空吸引した後に、前記載置面に設けた前記溝又
は穴に連通した前記配管部材により前記基板を真空吸引
することを特徴とする請求項１記載の基板ホルダ。2. The suction means vacuum-sucks the substrate by the suction port portion, and then vacuum-sucks the substrate by the piping member communicating with the groove or hole provided on the mounting surface. The substrate holder according to claim 1.
板の形状と前記基板の大きさとの少なくとも一方に応じ
て配設されていることを特徴とする請求項１記載の基板
ホルダ。3. The substrate holder according to claim 1, wherein the suction port portion and the suction member are arranged according to at least one of the shape of the substrate and the size of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1146770A JP2691299B2 (en) | 1989-06-12 | 1989-06-12 | Board holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1146770A JP2691299B2 (en) | 1989-06-12 | 1989-06-12 | Board holder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0312948A JPH0312948A (en) | 1991-01-21 |
| JP2691299B2 true JP2691299B2 (en) | 1997-12-17 |
Family
ID=15415157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1146770A Expired - Fee Related JP2691299B2 (en) | 1989-06-12 | 1989-06-12 | Board holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2691299B2 (en) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2584997Y2 (en) * | 1992-02-04 | 1998-11-11 | 株式会社東京精密 | Semiconductor wafer stage for probing equipment |
| JPH05251544A (en) * | 1992-03-05 | 1993-09-28 | Fujitsu Ltd | Conveyor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62100753A (en) * | 1985-10-29 | 1987-05-11 | Canon Inc | Multi-point supporting reticle chuck |
| JPH0243638Y2 (en) * | 1985-12-16 | 1990-11-20 |
-
1989
- 1989-06-12 JP JP1146770A patent/JP2691299B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312948A (en) | 1991-01-21 |
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