CN104992921B - A kind of clamping device of large-size ultra-thin wafer - Google Patents
A kind of clamping device of large-size ultra-thin wafer Download PDFInfo
- Publication number
- CN104992921B CN104992921B CN201510420092.3A CN201510420092A CN104992921B CN 104992921 B CN104992921 B CN 104992921B CN 201510420092 A CN201510420092 A CN 201510420092A CN 104992921 B CN104992921 B CN 104992921B
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- China
- Prior art keywords
- handle
- sucker
- chamber
- suction cup
- vacuum generator
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of clamping device of large-size ultra-thin wafer is related to semiconductor manufacturing facility technical field.Its is simple in construction, easy to operate.Including equipment support base, suction cup portion, handle section and motor driving part point.It is characterized in that：The support base is located at sucker edge and can rotated；The sucker is made up of two chambers, is separated between chamber by rotatable lightweight valve, and both sides chamber sidewall respectively sets adsorption structure on air intake valve, sucker and is made up of sucker, groove and filler, sucker bottom placement vacuum generator；The handle section is made up of handle arm and handle, and handle arm is welded to connect with sucker bottom by confining mode connects for screw, handle with handle arm；The motor is located at the cavity inside of handle formation and supported by support arm.The pickup and transmission to ultra-thin wafers can be achieved, wafer fragment rate is reduced.
Description
Technical field
The present invention relates to large scale wafer processing technical field, the clamping of specially a kind of large-size ultra-thin wafer is filled
Put.
Background technology
For obtain small size, lightweight, high-performance, low-power consumption and wide bandwidth 3D IC are integrated and 3D Si integrated technologies
Product, the thickness of chip/pinboard wafer must be very thin.Stacked for storage chip, wherein each chip thickness is no more than
50 microns, and to be finally thinned to 20 microns.Either active or passive transition plate, it is micro- that its thickness is typically not greater than 200
Rice.
It is not too difficult that wafer, which is thinned, and most wafer rear milling drums can be competent at this work, it is possible to will
Wafer is ground to 5 microns of thickness.However, in whole semiconductor machining and assembling process, holding for thin wafer is a problem.Generally
Before TSV-Cu is exposed to chip/pinboard wafer progress back side grinding, it need to be temporarily bonded on another carrier wafer,
Then follow-up manufacture of semiconductor is completed, such as metallization, passivation, ubm layer make and packaging technology.Above procedure
After end, thin wafer need to be removed from carrier wafer, subsequent detection then is carried out to device wafers.For ultra-thin wafers, by
During grinding damage makes the larger flexural deformation of wafer generation, subsequent detection, artificial progress by hand can not possibly be passed through brilliant
Circle transmission, otherwise can crush wafer, greatly increase cost.
To solve the above problems, a kind of clamping device of wafer need to be designed to realize the not damaged to large-size ultra-thin wafer
Transmission.
The content of the invention
To solve problem above, the present invention proposes a kind of clamping device of large-size ultra-thin wafer, can be achieved to big chi
The not damaged transmission of very little ultra-thin wafers.Its is simple in construction, and the cost of equipment is low.
The present invention is adopted the following technical scheme that：
A kind of clamping device of large-size ultra-thin wafer, it is characterised in that including support base 1, suction cup portion, handle portion
Divide and motor driving part point；Wherein support base 1 can rotate around the rotary shaft 18 being fixed on suction cup lateral wall；Suction cup portion includes
Chuck surface groove 2, filler 3, sucker 4, first chamber 7, lightweight valve 6, air intake valve 8, switch 9, pipeline 19 and vacuum
Generator 20；Groove top is higher than chuck surface, and the heart in the grooves of sucker 4, sucker 4 is filled by filler 3；Sucker is provided with the
One chamber 7 and second chamber 23, first chamber 7 are in annular in cylinder, second chamber 23, and two chambers are by lightweight valve 6
Separate；Sucker bottom disposes vacuum generator 20, the external compressed air of vacuum generator air inlet 15, vacuum generator exhaust outlet
16 connection air, vacuum generator vacuum port 17 is located in first chamber 7；Suction cup lateral wall is provided with air intake valve 8, air intake valve 8
It is made up of pipeline 19 and switch 9；Sucker bottom is connected with handle 11 by screw 10, and handle 11 is fixed with handle side arm 24 to be connected
Connect, handle side arm 24 is fixedly connected with handle 12；Motor 13 is located in the cavity of handle side arm formation, by motor support arm
14 supports.
Further, filler 3 is breathable material with holes.Lightweight valve 6 be exactly material density more light be easily open and
.
The present invention can obtain following beneficial effect：
1st, suction cup portion of the present invention can carry out subregion absorption to warpage wafer, and releasable wafer is inflated by air intake valve,
So as to realize the clamping and transmission to wafer.
2nd, support base of the present invention can realize the support to device, and the groove on sucker can be avoided to directly contact extraneous branch
Support object, it is to avoid groove is damaged and blocked.
3rd, the handle section of clamping device of the present invention is easy to holding and movement for device.
4th, clamping device of the present invention it is simple in construction, using reliable.
Brief description of the drawings
Fig. 1 is device structure schematic diagram；
Fig. 2 is that equipment adsorbs wafer schematic diagram；
Fig. 3 is that equipment places schematic diagram.
In figure：
1-support base, 2-groove, 3-filler, 4-sucker, 5-sucker, 6-lightweight valve, the 7-the first chamber
Room, 8-air intake valve, 9-switch, 10-screw, 11-handle, 12-handle, 13-motor, 14-motor support arm,
15-vacuum generator air admission hole, 16-vacuum generator steam vent, 17-vacuum generator vacuum port, the rotation of 18-bearing
Axle, 19-pipeline, 20-vacuum generator, 21-supporter, 22-wafer, 23-second chamber.
Embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
Fig. 1 is the structural representation of the present apparatus, including support base 1, suction cup portion, handle section and motor driving part
Point.Wherein support base 1 can be rotated around rotary shaft 18, use the side wall position that support base is rotated to sucker during equipment
Put, without using support base rotated into chuck surface during equipment, sustainable equipment when equipment is placed is in order to avoid supporter is touched
Suction cup portion.Suction cup portion by chuck surface groove 2, filler 3, sucker 4, first chamber 7, lightweight valve 6, air intake valve 8,
Switch 9, pipeline 19, vacuum generator 20 are constituted；Groove top is higher than chuck surface, and groove can be prevented by porous mass filling
Grain blocks sucker；The chamber of sucker is separated by lightweight valve can be achieved to adsorb the subregion of large scale warpage wafer；Sucker bottom
Vacuum generator 20 is disposed, the external compressed air of vacuum generator air inlet 15, vacuum generator exhaust outlet 16 connects air, very
Empty generator vacuum port 17 is located in first chamber 7；Suction cup lateral wall is provided with air intake valve 8, and air intake valve 8 is by pipeline 19 and switch
9 compositions, open switch 9；Sucker bottom is connected with handle 11 by screw 10, and handle 11 is fixedly connected with handle side arm 15,
Hand side arm 15 is fixedly connected with handle 12；Motor 13 is located in the cavity of handle side arm formation, by 14, motor support arm
Support.
Fig. 2 is that equipment adsorbs wafer schematic diagram, during using equipment, opens motor, the vacuum port 17 of vacuum generator 20 exists
Sucker chamber 7 produces vacuum, the central area of wafer 22 is adsorbed first, with the increase of the vacuum of first chamber 7, in gas
The lower lightweight valve 6 of pressure effect is opened, and now second chamber 23 produces vacuum and the fringe region of wafer 22 can be adsorbed；Need to release
When putting wafer 22, motor 13 is closed, the switch 9 of air intake valve 8 is opened, air enters second chamber 23 by pipeline 19 first, from
And crystal round fringes region is discharged, then air enters the vacuum expendable pattern of first chamber 7, and crystal circle center region is released.
Fig. 3 is that equipment places schematic diagram, and during without using equipment, support base 1 rotated into chuck surface, support equipment,
In case supporter 21 touches sucker.
Description to embodiments of the invention is in order at effectively explanation and the description purpose of the present invention, is not limited to this
Invention, any affiliated those skilled in the art should be understood：Under conditions of the inventive concept of the present invention and scope is not departed from,
Above-described embodiment can be changed.Therefore the present invention is not limited to disclosed specific embodiment, but cover claim
Modification in defined the spirit and scope of the invention.
Claims (2)
1. a kind of clamping device of large-size ultra-thin wafer, it is characterised in that including support base (1), suction cup portion, handle portion
Divide and motor driving part point；Wherein support base (1) can be around rotary shaft (18) rotation being fixed on suction cup lateral wall；Suction cup portion
Including chuck surface groove (2), filler (3), sucker (4), first chamber (7), lightweight valve (6), air intake valve (8), open
Close (9), pipeline (19) and vacuum generator (20)；Groove top is higher than chuck surface, sucker (4) heart, sucker in the grooves
(4) filled by filler (3)；Sucker is provided with first chamber (7) and second chamber (23), and first chamber (7) is in cylinder, second
Chamber (23) is in annular, and two chambers are separated by lightweight valve (6)；Sucker bottom placement vacuum generator (20), vacuum hair
Raw device air inlet (15) external compressed air, vacuum generator exhaust outlet (16) connection air, vacuum generator vacuum port (17)
In first chamber (7)；Suction cup lateral wall is provided with air intake valve (8), and air intake valve (8) is made up of pipeline (19) and switch (9)；
Sucker bottom is connected with handle (11) by screw (10), and handle (11) is fixedly connected with handle side arm (24), handle side arm
(24) it is fixedly connected with handle (12)；Motor (13) is located in the cavity of handle side arm formation, by motor support arm (14)
Support.
2. a kind of clamping device of large-size ultra-thin wafer according to claim 1, it is characterised in that filler (3) is
Breathable material with holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420092.3A CN104992921B (en) | 2015-07-16 | 2015-07-16 | A kind of clamping device of large-size ultra-thin wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420092.3A CN104992921B (en) | 2015-07-16 | 2015-07-16 | A kind of clamping device of large-size ultra-thin wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104992921A CN104992921A (en) | 2015-10-21 |
| CN104992921B true CN104992921B (en) | 2017-09-01 |
Family
ID=54304710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510420092.3A Expired - Fee Related CN104992921B (en) | 2015-07-16 | 2015-07-16 | A kind of clamping device of large-size ultra-thin wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104992921B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374730B (en) * | 2015-10-23 | 2018-03-27 | 河北晶龙阳光设备有限公司 | A kind of manipulator and its Double-head transporter for turning basket for solar battery sheet |
| CN111613566B (en) * | 2020-05-29 | 2023-07-28 | 北京工业大学 | Ultrathin wafer transfer device |
| CN111571627A (en) * | 2020-06-29 | 2020-08-25 | 昀智科技（北京）有限责任公司 | Vacuum adsorption type fork-shaped tail end clamp holder |
| CN113808991A (en) * | 2021-08-23 | 2021-12-17 | 深圳米飞泰克科技有限公司 | Wafer adsorption system and method, electronic equipment and readable storage medium |
| CN116387224A (en) * | 2021-12-22 | 2023-07-04 | 拓荆科技股份有限公司 | Vacuum adsorption system and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5169196A (en) * | 1991-06-17 | 1992-12-08 | Safabakhsh Ali R | Non-contact pick-up head |
| CN102164719A (en) * | 2008-09-29 | 2011-08-24 | 日东电工株式会社 | Suction sheet |
| CN203456430U (en) * | 2013-09-13 | 2014-02-26 | 上海集成电路研发中心有限公司 | Wafer bearing device |
| CN103904011A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Sucking device for warped silicon wafer and sucking method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63114870A (en) * | 1987-10-22 | 1988-05-19 | Nippon Telegr & Teleph Corp <Ntt> | Vacuum-absorbing method for wafer |
-
2015
- 2015-07-16 CN CN201510420092.3A patent/CN104992921B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5169196A (en) * | 1991-06-17 | 1992-12-08 | Safabakhsh Ali R | Non-contact pick-up head |
| CN102164719A (en) * | 2008-09-29 | 2011-08-24 | 日东电工株式会社 | Suction sheet |
| CN103904011A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Sucking device for warped silicon wafer and sucking method thereof |
| CN203456430U (en) * | 2013-09-13 | 2014-02-26 | 上海集成电路研发中心有限公司 | Wafer bearing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104992921A (en) | 2015-10-21 |
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Granted publication date: 20170901 Termination date: 20210716 |