CN110534459A - Integral type thinning device - Google Patents
Integral type thinning device Download PDFInfo
- Publication number
- CN110534459A CN110534459A CN201910735089.9A CN201910735089A CN110534459A CN 110534459 A CN110534459 A CN 110534459A CN 201910735089 A CN201910735089 A CN 201910735089A CN 110534459 A CN110534459 A CN 110534459A
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- Prior art keywords
- wafer
- vacuum chuck
- supporting platform
- telescoping mechanism
- platform system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of integral type thinning devices, including body, rotary-tray, storage barrel, with wafer transfer assembly, body is equipped with grinding mechanism, rotary-tray is rotatably arranged on body, rotary-tray is equipped at least two wafer-supporting platform systems, storage barrel is set on body, wafer transfer assembly includes electric sliding rail, telescoping mechanism and the first vacuum chuck, electric sliding rail is set on body, the fixing end of telescoping mechanism is set on the sliding block of electric sliding rail, first vacuum chuck is fixedly arranged on the telescopic end of telescoping mechanism, electric sliding rail is for driving telescoping mechanism to be displaced between storage barrel and pad pasting station, and storage barrel and pad pasting station are respectively positioned on the lower section of electric sliding rail, wafer to be processed can be drawn for the first vacuum chuck to being located at pad pasting station and be previously covered by the wafer-supporting platform system of protective film.The integral type thinning device set overlay film and thinned function improve and efficiency are thinned, reduce cost.
Description
Technical field
The present invention relates to thinning device technical field more particularly to a kind of integral type thinning devices.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC products for having specific electrical functionality.In
In semiconductor industry processing procedure, usually before integrated antenna package, the basis material extra to backside of wafer is needed to remove centainly
Thickness, can make more complicated, smallerization integrated circuit, this technical process is referred to as technique for thinning back side of silicon wafer.
Wafer reduction process is one of required technique, by taking LED processing procedure as an example, is needed to the thinning back side of wafer to certain thickness
Scribing cutting is carried out after degree.Wafer frontside is damaged in order to prevent when thinned, generally requires first to cover one layer of guarantor in wafer frontside
Cuticula, then the wafer that carry protective film is placed in thinned machine its back side is carried out it is thinned.
Thinned machine in the prior art, for example, application No. is disclosed in CN201711430682.X a kind of thinned machine and
Application No. is disclosed in CN201510988775.9 a kind of rotating table device and wafer machine is thinned, be overlay film and be thinned
Two procedures are separated from each other, and most cases coating process is taken time and effort, serious reduction thinning process efficiency by being accomplished manually.
Summary of the invention
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of integral type thinning device, set is covered
Film and thinned function improve and efficiency are thinned, reduce cost.
The purpose of the present invention adopts the following technical scheme that realization:
Integral type thinning device, comprising:
Body, body are equipped with grinding mechanism and the storage barrel for storing wafer to be processed；
Rotary-tray, rotary-tray are rotatably arranged in the bottom of body；
At least two for placing the wafer-supporting platform system of wafer, and the wafer-supporting platform system is set on rotary-tray, described to hold
Piece platform system is driven by rotary-tray to switch the station of each wafer-supporting platform system, when the rotary-tray is in operating position,
At least one wafer-supporting platform system is located at grinding station, at least one wafer-supporting platform system is located at pad pasting station；
Wafer transfer assembly, including electric sliding rail, telescoping mechanism and the first vacuum chuck, the electric sliding rail are fixedly arranged on
On the body, the telescoping mechanism is parallel with the grinding mechanism, and the fixing end of the telescoping mechanism is set to the electric sliding
On the sliding block of rail, first vacuum chuck is fixedly arranged on the telescopic end of the telescoping mechanism；
The storage barrel and pad pasting station are respectively positioned on the lower section of electric sliding rail, and the grinding station is located under grinding mechanism
Side；
The electric sliding rail is for driving the telescoping mechanism to move between storage barrel and pad pasting station, so that first is true
Wafer to be processed is drawn to from storage barrel positioned at pad pasting station and is previously covered by the wafer-supporting platform system of protective film by suction disk；
When the wafer to be processed is located at pad pasting station, the telescoping mechanism can be extended downwardly, thus driving first
Wafer to be processed is adjacent to by vacuum chuck with protective film.
Further, the edge of the protective film is equipped with the magnetic conductive metal ring of protrusion, and the magnetic conductive metal ring is used to support
The protective film, the wafer-supporting platform system include support column, the second vacuum chuck for adsorbing protective film and lead for adsorbing
The electromagnetic suction head of magnetic becket, the bottom surface of the support column are connect with the rotary-tray, and second vacuum chuck is installed on
The medium position of the top surface of the support column, the electromagnetic suction head are arranged around second vacuum chuck and are installed on the branch
The marginal position of the top surface of dagger, and the electromagnetic suction head is lower than second vacuum chuck, so that the top surface of the support column
The low step surface in edge for middle part height.
Further, the edge of second vacuum chuck has chamfering.
Further, first vacuum chuck and the second vacuum chuck include sucker and are used to provide adsorption capacity to sucker
Vacuum plant, the material of the sucker is rubber.
Further, the one side coating toughness glue of the protective film being bonded with wafer to be processed.
Further, first vacuum chuck or the second vacuum chuck are equipped with controlled pressure sensor.
Further, the telescoping mechanism is hydraulic cylinder, hydraulic column or cylinder.
Compared with prior art, the beneficial effects of the present invention are:
When using thinning device of the invention carrying out that work is thinned, telescoping mechanism is driven to deposit by starting electric sliding rail
It is moved back and forth between storage cylinder and pad pasting station, when telescoping mechanism is located at the top of storage barrel, the absorption of the first vacuum chuck is located at
Wafer to be processed in storage barrel draws have wafer to be processed first very when telescoping mechanism drives under the driving of electric sliding rail
When suction disk is moved to the top of pad pasting station, driving telescoping mechanism extends and the first vacuum chuck is driven to be located at pad pasting along close
Station and be previously covered by protective film wafer-supporting platform system direction it is mobile and wafer to be processed is adjacent to protective film, will be to
Processing wafer is while be placed in the wafer-supporting platform system of pad pasting station, realize to wafer to be processed be covered in advance
The protective film in wafer-supporting platform system on pad pasting station is adjacent to, and then rotary-tray is driven to switch station so that carry to
The wafer-supporting platform system of processing wafer switches to grinding station, and then grinding mechanism carries out grinding action to the wafer to be processed.It should
Thinning device set overlay film and thinned function, reduce the processing step of artificial pad pasting, improve thinned efficiency, reduce at
This.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of integral type thinning device of the invention；
Fig. 2 is the partial enlarged view in integral type thinning device shown in FIG. 1.
In figure: 1, body；2, rotary-tray；3, wafer-supporting platform system；31, support column；32, the second vacuum chuck；33, electromagnetism
Suction nozzle；4, grinding mechanism；5, wafer transfer assembly；51, electric sliding rail；52, telescoping mechanism；53, the first vacuum chuck；6, it stores
Cylinder；7, protective film；8, magnetic conductive metal ring.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention, it should be noted that not
Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
Referring to Fig. 1, a kind of integral type thinning device of a preferred embodiment of the present invention, including body 1, rotation support are shown
Disk 2, wafer transfer assembly 5 and storage barrel 6, wherein body 1 is equipped with the mill for carrying out grinding processing to wafer to be processed
Mechanism 4 is cut, wafer to be processed is thinned with realizing, specifically, which may include the top for being fixed on body 1
Be ground driving motor and with grinding driving motor output shaft transmission connection grinding machine head, the grinding machine head to wafer to be processed into
Row grinding action.
Rotary-tray 2 is rotatably arranged in the bottom of body 1, and specifically, rotary-tray 2 can be driven by rotating electric machine to be revolved
Turn, rotating electric machine is fixed on body 1, and the output shaft of rotating electric machine and rotary-tray 2 are sequentially connected.
Wafer-supporting platform system 3 is equipped at least two, and wafer-supporting platform system 3 is fixedly arranged on rotary-tray 2, wafer-supporting platform system 3 by
Rotary-tray 2 drives to switch the station of each wafer-supporting platform system 3, so that wafer-supporting platform system 3 is in pad pasting station and grinding station
Between switch, when rotary-tray 2 is in operating position, at least one wafer-supporting platform system 3 be located at grinding station, at least one holds piece
Platform system 3 is located at pad pasting station, with can simultaneously pad pasting and grinding, improve working efficiency.
Storage barrel 6 is detachably arranged on the support bracket of body 1, which has for storing wafer to be processed
Blind hole is stored, and the side wall of storage barrel 6 is also provided with the opening being connected to storage blind hole, to be convenient to depositing for wafer to be processed
Put operation.
Wafer transfer assembly 5 includes electric sliding rail 51, telescoping mechanism 52 and the first vacuum chuck 53, and electric sliding rail 51 is solid
On the top of body 1, specifically, telescoping mechanism 52 can be any one in hydraulic cylinder, hydraulic column or cylinder, stretch
Mechanism 52 is parallel with grinding mechanism 4, and the fixing end of telescoping mechanism 52 is fixedly arranged on the sliding block of electric sliding rail 51, the first vacuum chuck
53 are fixedly arranged on the telescopic end of telescoping mechanism 52, and storage barrel 6 and pad pasting station are respectively positioned on the lower section of electric sliding rail 51, are ground station position
In the lower section of grinding mechanism 4, electric sliding rail 51 is used to that telescoping mechanism 52 to be driven to move between storage barrel 6 and pad pasting station, with
The wafer to be processed being located in storage barrel 6 can be drawn to positioned at pad pasting station for the first vacuum chuck 53 and be previously covered by guarantor
In the wafer-supporting platform system 3 of cuticula 7, when wafer to be processed is located at pad pasting station, telescoping mechanism 52 can be extended downwardly, to drive
Wafer to be processed and protective film 7 are adjacent to by dynamic first vacuum chuck 53.
When using thinning device of the invention carrying out that work is thinned, telescoping mechanism 52 is driven by starting electric sliding rail 51
It is moved back and forth between storage barrel 6 and pad pasting station, when telescoping mechanism 52 is located at the top of storage barrel 6, the first vacuum chuck
53 draw the wafer to be processed being located in storage barrel 6, need when driving to draw under driving of the telescoping mechanism 52 in electric sliding rail 51
When first vacuum chuck 53 of processing wafer is moved to the top of pad pasting station, driving telescoping mechanism 52 extends and drive first is true
Suction disk 53 along close to positioned at pad pasting station and be previously covered by protective film 7 wafer-supporting platform system 3 direction move and make to
Processing wafer is adjacent to protective film 7, real while wafer to be processed is placed in the wafer-supporting platform system 3 of pad pasting station
Being adjacent to wafer to be processed and the protective film 7 in the wafer-supporting platform system 3 that is covered on pad pasting station in advance is showed, has then driven
Rotary-tray 2 switches station, so that the wafer-supporting platform system 3 for carrying wafer to be processed switches to grinding station, then milling drum
Structure 4 carries out grinding action to the wafer to be processed.Thinning device set overlay film and thinned function, reduce artificial pad pasting
Processing step improves thinned efficiency, reduces cost.
As shown in Fig. 2, the edge of protective film 7 is installed with magnetic conductive metal ring 8, which can be iron hoop, low-carbon
Steel loop or silicon steel ring etc. can be realized the structure of magnetic cooperation, which is arranged around the edge of protective film 7, magnetic conduction
Becket 8 is used to support protective film 7, so that protective film 7 keeps tensioning state, one be bonded with wafer to be processed of protective film 7
Face coats toughness glue, so that wafer to be processed is reliably bonded with protective film 7.Wafer-supporting platform system 3 includes support column 31, for inhaling
Second vacuum chuck 32 of attached protective film 7 and electromagnetic suction head 33 for adsorbing magnetic conductive metal ring 8, the bottom surface of support column 31 and rotation
The disk 2 that asks is fixedly connected, and the second vacuum chuck 32 is installed on the medium position of the top surface of support column 31, and electromagnetic suction head 33 is around the
The marginal position of the top surface of support column 31 is arranged and be installed on to two vacuum chucks 32, and electromagnetic suction head 33 is lower than the second vacuum chuck
32, so that the top surface of support column 31 is the step surface that middle part is high and edge is low, in this way, to be adsorbed by the second vacuum chuck 32
Protective film 7 is sufficiently strained without generation fold by magnetic conductive metal ring 8, so that guaranteeing can between wafer and protective film 7 to be processed
By pasting, avoids wafer to be processed from being worn when thinned, can preferably protect wafer to be processed.As shown in Fig. 2, second is true
The edge of suction disk 32 has chamfering, prevents protective film 7 from rupturing.
Specifically, the first vacuum chuck 53 and the second vacuum chuck 32 are including sucker and for giving sucker to provide adsorption capacity
Vacuum plant, the material of sucker are rubber, to guarantee that wafer to be processed is bonded protective film 7 completely and is not crushed.
Further, the first vacuum chuck 53 or the second vacuum chuck 32 are equipped with controlled pressure sensor, Ke Yili
Solution, which connect with the control device being built in the thinning device, with can be controlled, by the way that the pressure is arranged
Force snesor detects the pressure of wafer to be processed, guarantees that wafer pressure to be processed is constant, so as to prevent in pad pasting
Crushing wafer to be processed.
It is understood that for details, reference can be made to application No. is disclosed in CN108000267A for the unmentioned structure of the present invention
The machine of being thinned.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (7)
1. integral type thinning device characterized by comprising
Body, body are equipped with grinding mechanism and the storage barrel for storing wafer to be processed；
Rotary-tray, rotary-tray are rotatably arranged in the bottom of body；
At least two for placing the wafer-supporting platform system of wafer, and the wafer-supporting platform system is set on rotary-tray, the wafer-supporting platform
System is driven to switch the station of each wafer-supporting platform system, when the rotary-tray is in operating position, at least by rotary-tray
One wafer-supporting platform system is located at grinding station, at least one wafer-supporting platform system is located at pad pasting station；
Wafer transfer assembly, including electric sliding rail, telescoping mechanism and the first vacuum chuck, the electric sliding rail are fixedly arranged on described
On body, the telescoping mechanism is parallel with the grinding mechanism, and the fixing end of the telescoping mechanism is set to the electric sliding rail
On sliding block, first vacuum chuck is fixedly arranged on the telescopic end of the telescoping mechanism；
The storage barrel and pad pasting station are respectively positioned on the lower section of electric sliding rail, and the grinding station is located at the lower section of grinding mechanism；
The electric sliding rail is for driving the telescoping mechanism to move between storage barrel and pad pasting station, so that the first vacuum is inhaled
Wafer to be processed is drawn to from storage barrel positioned at pad pasting station and is previously covered by the wafer-supporting platform system of protective film by disk；
When the wafer to be processed is located at pad pasting station, the telescoping mechanism can be extended downwardly, thus the first vacuum of driving
Wafer to be processed is adjacent to by sucker with protective film.
2. integral type thinning device as described in claim 1, which is characterized in that the edge of the protective film is equipped with magnetic conductive metal
Ring, the magnetic conductive metal ring are used to support the protective film, and the wafer-supporting platform system includes support column, for adsorbing protective film
Second vacuum chuck and electromagnetic suction head for adsorbing magnetic conductive metal ring, the bottom surface of the support column and the rotary-tray connect
It connects, second vacuum chuck is installed on the medium position of the top surface of the support column, and the electromagnetic suction head is around described second
The marginal position of the top surface of the support column is arranged and be installed on to vacuum chuck, and the electromagnetic suction head is lower than second vacuum
Sucker, so that the top surface of the support column is the step surface that middle part is high and edge is low.
3. integral type thinning device as claimed in claim 2, which is characterized in that the edge of second vacuum chuck has
Angle.
4. integral type thinning device as claimed in claim 2, which is characterized in that first vacuum chuck and the second vacuum are inhaled
Disk include sucker and for sucker provide adsorption capacity vacuum plant, the material of the sucker is rubber.
5. integral type thinning device as claimed in claim 2, which is characterized in that the protective film is bonded with wafer to be processed
One side coat toughness glue.
6. integral type thinning device as claimed in claim 2, which is characterized in that first vacuum chuck or the second vacuum are inhaled
Disk is equipped with controlled pressure sensor.
7. integral type thinning device as described in claim 1, which is characterized in that the telescoping mechanism is hydraulic cylinder, hydraulic column
Or cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910735089.9A CN110534459A (en) | 2019-08-09 | 2019-08-09 | Integral type thinning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910735089.9A CN110534459A (en) | 2019-08-09 | 2019-08-09 | Integral type thinning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110534459A true CN110534459A (en) | 2019-12-03 |
Family
ID=68662388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910735089.9A Pending CN110534459A (en) | 2019-08-09 | 2019-08-09 | Integral type thinning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110534459A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111640695A (en) * | 2020-06-05 | 2020-09-08 | 深圳市长方集团股份有限公司 | Device and process for packaging UVC LED chip on wafer |
-
2019
- 2019-08-09 CN CN201910735089.9A patent/CN110534459A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111640695A (en) * | 2020-06-05 | 2020-09-08 | 深圳市长方集团股份有限公司 | Device and process for packaging UVC LED chip on wafer |
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Effective date of registration: 20220218 Address after: 510700 room 1103, building B2, No. 136, Kaiyuan Avenue, Huangpu District, Guangzhou, Guangdong Applicant after: Guangzhou Everbright Technology Co.,Ltd. Address before: 517000 Zhongtuo optoelectronics Co., Ltd., Gaoxin 5th Road, Heyuan hi tech Development Zone, Guangdong Province Applicant before: HEYUAN CHOICORE PHOTOELECTRIC TECHNOLOGY Co.,Ltd. |
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