CN111085954A - Substrate adsorption device - Google Patents

Substrate adsorption device Download PDF

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Publication number
CN111085954A
CN111085954A CN201911351372.8A CN201911351372A CN111085954A CN 111085954 A CN111085954 A CN 111085954A CN 201911351372 A CN201911351372 A CN 201911351372A CN 111085954 A CN111085954 A CN 111085954A
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CN
China
Prior art keywords
suction
vacuum
adsorption
substrate
chucking
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Pending
Application number
CN201911351372.8A
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Chinese (zh)
Inventor
张伟基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201911351372.8A priority Critical patent/CN111085954A/en
Publication of CN111085954A publication Critical patent/CN111085954A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005Vacuum work holders

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a substrate adsorption device, comprising: the first adsorption part is arranged in the middle area of the adsorption surface of the substrate adsorption device; the second adsorption parts are arranged in the peripheral area of the adsorption surface, wherein the peripheral area is positioned on at least one side of the middle area; the second suction force of the second suction portion is larger than the first suction force of the first suction portion. The invention can prevent the failure of absorbing the substrate.

Description

Substrate adsorption device
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display panel manufacturing, in particular to a substrate adsorption device.
[ background of the invention ]
In the manufacturing process of the display panel, a layer of flexible film layer is generally arranged on the substrate, and the substrate is easy to deform due to the fact that the flexible film layer has large internal stress, and the specific expression is as follows: the periphery of the substrate is warped to some extent, wherein the warping degree of the four corners of the substrate is most obvious.
When adsorbing the base plate, adsorb again owing to need be in turn with the base plate, at this moment, the gravity of base plate and the internal stress stack effect of flexible rete have aggravated the degree of the warpage all around of base plate, under this condition, the circumstances of adsorbing the base plate failure can appear. In particular, the larger the size of the substrate, the greater the degree of warpage of the periphery of the substrate, at which the probability of adsorption failure is greater.
Therefore, a new technical solution is needed to solve the above technical problems.
[ summary of the invention ]
The invention aims to provide a substrate adsorption device which can prevent the situation of substrate adsorption failure.
In order to solve the problems, the technical scheme of the invention is as follows:
a substrate adsorption apparatus, comprising: the first adsorption part is arranged in the middle area of the adsorption surface of the substrate adsorption device; the second adsorption parts are arranged in the peripheral area of the adsorption surface, wherein the peripheral area is positioned on at least one side of the middle area; the second suction force of the second suction portion is larger than the first suction force of the first suction portion.
In the substrate suction device, a time when the first suction unit generates the first suction force is prior to a time when the second suction unit generates the second suction force.
In the substrate suction apparatus, the first suction part includes first vacuum suction members, and at least two of the first vacuum suction members are arranged in a one-dimensional array or a two-dimensional array; the second suction part includes second vacuum suction members, and at least two of the second vacuum suction members are arranged in a one-dimensional array or a two-dimensional array.
In the above substrate adsorption apparatus, the substrate adsorption apparatus further includes: a vacuum suction connected to the first vacuum suction member and the second vacuum suction member, the vacuum suction for sucking a vacuum to the first vacuum suction member to cause the first suction member to generate the first suction force and for sucking a vacuum to the second vacuum suction member to cause the second vacuum suction member to generate the second suction force.
In the above substrate suction device, the vacuum extractor may be configured to extract a vacuum to the first vacuum suction member for a first period of time to cause the first suction member to generate the first suction force for the first period of time, and to extract a vacuum to the second vacuum suction member for a second period of time to cause the second vacuum suction member to generate the second suction force for the second period of time.
In the above substrate suction apparatus, the first vacuum suction member includes a first suction cup and a first suction pipe, the first suction cup is connected to one end of the first suction pipe, and the other end of the first suction pipe is connected to the vacuum suction unit; the second vacuum adsorption member comprises a second suction cup and a second suction pipe, the second suction cup is connected with one end of the second suction pipe, and the other end of the second suction pipe is connected with the vacuum suction device.
In the substrate suction device, the projection of the first suction part and the second suction part on the suction surface has one or more of a right triangle, a rectangle, a trapezoid, a fan, and a ring shape.
In the substrate suction device described above, in the first suction portion, the first suction forces of at least two of the first vacuum suction members are uniformly distributed or gradually increased from the central region toward the peripheral region.
In the substrate suction device, in the second suction portion, the second suction force of at least two of the second vacuum suction members increases or decreases in a direction from the central region toward the peripheral region.
In the above substrate adsorption apparatus, the substrate adsorption apparatus further includes: and the first adsorption part and the second adsorption part are fixed on the supporting table.
Compared with the prior art, the first adsorption part is arranged in the middle area of the adsorption surface of the substrate adsorption device, the second adsorption part is arranged in the peripheral area of the adsorption surface, and the second adsorption force of the second adsorption part is greater than the first adsorption force of the first adsorption part. Therefore, in the case where the peripheral edge of the substrate warps to a large extent when being sucked, a larger suction force can be applied to the peripheral edge of the substrate, thereby preventing the occurrence of failure in sucking the substrate.
In order to make the aforementioned and other objects of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
FIG. 1 is a schematic view of a substrate adsorption apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a substrate adsorption apparatus according to a second embodiment of the present invention;
FIG. 3 is a schematic view showing a distribution of a first suction force of a first suction part and a second suction force of a second suction part in the substrate suction device of the present invention;
fig. 4 is a schematic view showing another distribution of the first suction force of the first suction part and the second suction force of the second suction part in the substrate suction device of the present invention.
[ detailed description ] embodiments
The word "embodiment" as used herein means an example, instance, or illustration. In addition, the articles "a" and "an" as used in this specification and the appended claims may generally be construed to mean "one or more" unless specified otherwise or clear from context to be directed to a singular form.
The substrate adsorption device provided by the embodiment of the invention is used for adsorbing a substrate, for example, the substrate is adsorbed in the manufacturing process of a display panel, and the substrate can be a glass substrate, a flexible substrate, a thin film transistor array substrate provided with a thin film transistor array, a color film substrate provided with a color film layer and the like.
Referring to fig. 1, 2, 3 and 4, fig. 1 is a schematic view of a first embodiment of a substrate adsorption device of the present invention, fig. 2 is a schematic view of a second embodiment of the substrate adsorption device of the present invention, fig. 3 is a schematic view of one distribution of a first adsorption force of a first adsorption part and a second adsorption force of a second adsorption part in the substrate adsorption device of the present invention, and fig. 4 is a schematic view of another distribution of the first adsorption force of the first adsorption part and the second adsorption force of the second adsorption part in the substrate adsorption device of the present invention.
A second embodiment of the substrate suction device of the present invention is similar to or similar to the first embodiment, except that the first suction portion and the second suction portion in the two embodiments have a projection shape on the suction surface.
The substrate adsorption device provided by the embodiment of the invention comprises a supporting table, at least one first adsorption part 101 and at least two second adsorption parts 102, wherein the first adsorption part 101 and the second adsorption parts 102 are fixed on the supporting table.
The first suction unit 101 is provided in a central region of a suction surface of the substrate suction device (suction surface of the support table), and the second suction unit 102 is provided in a peripheral region of the suction surface, the peripheral region being located on at least one side of the central region.
The projection of the first suction part 101 on the suction surface has a shape of one of a combination of a right triangle and a rectangle (as shown in fig. 1) and a rectangle (as shown in fig. 2).
The projection of the second suction portion 102 on the suction surface is in the shape of one or a combination of more than one of a right triangle (as shown in fig. 1), a rectangle (as shown in fig. 1), a trapezoid, a fan, and a ring (as shown in fig. 2).
The second suction portions 102 are disposed around the first suction portion 101 with a midpoint of the suction surface as a center, and particularly, at least two second suction portions 102 are disposed symmetrically with respect to the midpoint of the suction surface.
The second suction force of the second suction part 102 is larger than the first suction force of the first suction part 101.
The first suction part 101 includes first vacuum suction members, at least two of which are arranged in a one-dimensional array or a two-dimensional array, and particularly, at least two of which are joined together to form the first suction part 101.
The second suction unit 102 includes second vacuum suction members, and at least two of the second vacuum suction members are arranged in a one-dimensional array or a two-dimensional array. Specifically, at least two of the second vacuum suction members are integrally joined to form the second suction portion 102.
The substrate adsorption apparatus further includes a vacuum suction unit connected to the first vacuum adsorption member and the second vacuum adsorption member, the vacuum suction unit being configured to suck a vacuum to the first vacuum adsorption member to cause the first adsorption member to generate the first adsorption force, and to suck a vacuum to the second vacuum adsorption member to cause the second vacuum adsorption member to generate the second adsorption force.
In the embodiment of the present invention, drawing vacuum means drawing air to reduce the air pressure in the first vacuum adsorption member and/or the second vacuum adsorption member or to form a vacuum state in the first vacuum adsorption member and/or the second vacuum adsorption member.
The vacuum suction device is configured to suck a vacuum to the first vacuum suction member for a first period of time to cause the first suction member to generate the first suction force for the first period of time, and to suck a vacuum to the second vacuum suction member for a second period of time to cause the second vacuum suction member to generate the second suction force for the second period of time.
The first suction unit 101 generates the first suction force at a time earlier than the second suction unit 102 generates the second suction force. In particular, the start time of the first time period precedes the start time of the second time period.
The first vacuum adsorption component comprises a first sucker and a first sucker, the first sucker is connected with one end of the first sucker, the other end of the first sucker is connected with the vacuum sucker, the second vacuum adsorption component comprises a second sucker and a second sucker, the second sucker is connected with one end of the second sucker, and the other end of the second sucker is connected with the vacuum sucker. The first suction cup and the second suction cup can be in a disc shape or a groove shape, and the material of the first suction cup and the material of the second suction cup can be flexible plastic and rubber.
In the first suction portion 101, the first suction forces of at least two first vacuum suction members are uniformly distributed (as shown in fig. 3 and 4) or gradually increase from the central region toward the peripheral region.
In the second suction portion 102, the second suction force of at least two of the second vacuum suction members increases (as shown in fig. 3) or decreases (as shown in fig. 4) in a direction from the central region toward the peripheral region.
In the first suction portion 101, the pipe diameter of the first suction pipe of the first vacuum suction means is kept constant or increased in a direction from the central region toward the peripheral region.
In the second suction portion 102, the pipe diameter of the second suction pipe of the second vacuum suction member is increased or decreased in a direction from the central region toward the peripheral region.
The substrate adsorption device further comprises a first valve, a second valve and a controller, wherein the first valve is connected with the first vacuum adsorption component, the second valve is adjacent to the second vacuum adsorption component, specifically, the first valve is arranged between the first suction pipe and the vacuum suction device, and the second valve is arranged between the second suction pipe and the vacuum suction pipe. The controller is electrically connected with the first valve and the second valve, and the controller is used for controlling at least one of the first valve and the second valve to be opened or closed. In particular, the controller is configured to control the first valve to be opened for a first period of time to cause the vacuum extractor to extract a vacuum to the first vacuum adsorbing member for the first period of time, thereby causing the first adsorbing member to generate the first adsorption force for the first period of time, and to control the second valve to be opened for a second period of time to cause the vacuum extractor to extract a vacuum to the second vacuum adsorbing member for the second period of time, thereby causing the second vacuum adsorbing member to generate the second adsorption force for the second period of time.
As an improvement, the first suction pipe has a pipe diameter smaller than that of the second suction pipe, so that the first suction force formed by the first vacuum suction member is smaller than the second suction force formed by the second vacuum suction member when the vacuum is sucked by the vacuum sucker to the first vacuum suction member and the second vacuum suction member.
As another improvement, the vacuum suction apparatus includes a first vacuum suction unit and a second vacuum suction unit, which are independent of each other, the first vacuum suction unit being connected to the first suction pipe, and the second vacuum suction unit being connected to the second suction pipe. That is, the first vacuum suction unit independently sucks the vacuum to the first vacuum suction member for the first period of time, and the second vacuum suction unit independently sucks the vacuum to the second vacuum suction member for the second period of time.
In the substrate suction device provided by the embodiment of the present invention, since the first suction part 101 is disposed in the middle region of the suction surface of the substrate suction device, and the second suction part 102 is disposed in the peripheral region of the suction surface, the second suction force of the second suction part 102 is greater than the first suction force of the first suction part 101. Therefore, in the case where the peripheral edge of the substrate warps to a large extent when being sucked, a larger suction force can be applied to the peripheral edge of the substrate, thereby preventing the occurrence of failure in sucking the substrate.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims (10)

1. A substrate adsorption apparatus, comprising:
the first adsorption part is arranged in the middle area of the adsorption surface of the substrate adsorption device;
the second adsorption parts are arranged in the peripheral area of the adsorption surface, wherein the peripheral area is positioned on at least one side of the middle area;
the second suction force of the second suction portion is larger than the first suction force of the first suction portion.
2. The substrate chucking device according to claim 1, wherein a time when said first chucking part generates said first chucking force precedes a time when said second chucking part generates said second chucking force.
3. The substrate adsorption device of claim 1, wherein the first adsorption part comprises first vacuum adsorption members, and at least two of the first vacuum adsorption members are arranged in a one-dimensional array or a two-dimensional array;
the second suction part includes second vacuum suction members, and at least two of the second vacuum suction members are arranged in a one-dimensional array or a two-dimensional array.
4. The substrate chucking apparatus of claim 3, further comprising:
a vacuum suction connected to the first vacuum suction member and the second vacuum suction member, the vacuum suction for sucking a vacuum to the first vacuum suction member to cause the first suction member to generate the first suction force and for sucking a vacuum to the second vacuum suction member to cause the second vacuum suction member to generate the second suction force.
5. The substrate adsorption apparatus of claim 4, wherein the vacuum extractor is configured to extract a vacuum to the first vacuum adsorption member for a first period of time to cause the first adsorption member to generate the first adsorption force for the first period of time, and to extract a vacuum to the second vacuum adsorption member for a second period of time to cause the second vacuum adsorption member to generate the second adsorption force for the second period of time.
6. The substrate adsorption device of claim 4, wherein the first vacuum adsorption member comprises a first suction cup and a first suction pipe, the first suction cup is connected to one end of the first suction pipe, and the other end of the first suction pipe is connected to the vacuum extractor;
the second vacuum adsorption member comprises a second suction cup and a second suction pipe, the second suction cup is connected with one end of the second suction pipe, and the other end of the second suction pipe is connected with the vacuum suction device.
7. The substrate adsorption device of claim 1, wherein the projection of the first adsorption part and the second adsorption part on the adsorption surface is in the shape of one or more of a right triangle, a rectangle, a trapezoid, a fan and a ring.
8. The substrate chucking apparatus according to claim 1, wherein in the first chucking section, first chucking forces of at least two of the first vacuum chucking members are uniformly distributed or gradually increased from the central region toward the peripheral region.
9. The substrate chucking apparatus according to claim 1, wherein in the second chucking section, second chucking forces of at least two of the second vacuum chucking members are increased or decreased in a direction from the central region toward the peripheral region.
10. The substrate chucking apparatus of claim 1, further comprising:
and the first adsorption part and the second adsorption part are fixed on the supporting table.
CN201911351372.8A 2019-12-24 2019-12-24 Substrate adsorption device Pending CN111085954A (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN108227986A (en) * 2017-12-28 2018-06-29 武汉华星光电半导体显示技术有限公司 A kind of preparation method of laminating apparatus, display panel
TWM568305U (en) * 2018-07-11 2018-10-11 保捷車材有限公司 Multi-stage adsorption vacuum chuck
CN108705422A (en) * 2017-03-31 2018-10-26 株式会社荏原制作所 Vacuum suction pad and base plate keeping device
CN208759391U (en) * 2018-08-06 2019-04-19 广东正业科技股份有限公司 A kind of absorption platform that can be clamped on four sides
CN109901311A (en) * 2017-12-08 2019-06-18 上海和辉光电有限公司 a peeling device
CN210099255U (en) * 2019-05-29 2020-02-21 大族激光科技产业集团股份有限公司 Vacuum adsorption carrying platform
CN211225618U (en) * 2019-12-03 2020-08-11 芜湖益盈鼎裕自动化设备有限公司 Vacuum panel device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06143074A (en) * 1992-10-27 1994-05-24 Sumitomo Electric Ind Ltd Wafer fixing device
TW473626B (en) * 1997-10-24 2002-01-21 Sharp Kk Manufacturing method of liquid crystal display element and manufacturing apparatus of the same
CN1993208A (en) * 2004-05-27 2007-07-04 波音公司 Conformal vacuum cup apparatus and method for removably attaching a rail to a surface of a workpiece
WO2006072453A1 (en) * 2004-12-30 2006-07-13 Supfina Grieshaber Gmbh & Co. Kg Holder with porous gripper
TW200814243A (en) * 2006-09-08 2008-03-16 Advanced Semiconductor Eng Method and apparatus for holding a substrate by vacuum-absorption
CN1944203A (en) * 2006-11-03 2007-04-11 友达光电股份有限公司 Auxiliary mobile device, carrying device and its assembly
TW201250771A (en) * 2006-12-20 2012-12-16 Tokyo Electron Ltd Substrate cleaning apparatus
CN101295661A (en) * 2007-04-24 2008-10-29 东京毅力科创株式会社 Substrate attracting device and substrate transfer apparatus
CN101306521A (en) * 2007-05-17 2008-11-19 Icf科技有限公司 Fixing device and control method thereof
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TW201427796A (en) * 2012-12-28 2014-07-16 Shanghai Microelectronics Equi Warped silicon-chip adsorption device and adsorption method thereof
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CN109901311A (en) * 2017-12-08 2019-06-18 上海和辉光电有限公司 a peeling device
CN108227986A (en) * 2017-12-28 2018-06-29 武汉华星光电半导体显示技术有限公司 A kind of preparation method of laminating apparatus, display panel
TWM568305U (en) * 2018-07-11 2018-10-11 保捷車材有限公司 Multi-stage adsorption vacuum chuck
CN208759391U (en) * 2018-08-06 2019-04-19 广东正业科技股份有限公司 A kind of absorption platform that can be clamped on four sides
CN210099255U (en) * 2019-05-29 2020-02-21 大族激光科技产业集团股份有限公司 Vacuum adsorption carrying platform
CN211225618U (en) * 2019-12-03 2020-08-11 芜湖益盈鼎裕自动化设备有限公司 Vacuum panel device

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Application publication date: 20200501