SG11201504298TA - Cooling system for electronic device storing apparatus and cooling system for electronic device storing building - Google Patents
Cooling system for electronic device storing apparatus and cooling system for electronic device storing buildingInfo
- Publication number
- SG11201504298TA SG11201504298TA SG11201504298TA SG11201504298TA SG11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA SG 11201504298T A SG11201504298T A SG 11201504298TA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- cooling system
- device storing
- building
- storing apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012264430 | 2012-12-03 | ||
PCT/JP2013/007069 WO2014087635A1 (ja) | 2012-12-03 | 2013-12-03 | 電子機器収納装置の冷却システム及び電子機器収納建屋の冷却システム |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201504298TA true SG11201504298TA (en) | 2015-07-30 |
Family
ID=50883077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201504298TA SG11201504298TA (en) | 2012-12-03 | 2013-12-03 | Cooling system for electronic device storing apparatus and cooling system for electronic device storing building |
Country Status (10)
Country | Link |
---|---|
US (1) | US9693485B2 (ko) |
EP (1) | EP2927778A4 (ko) |
JP (1) | JPWO2014087635A1 (ko) |
KR (1) | KR20150091506A (ko) |
CN (1) | CN104838329A (ko) |
AU (1) | AU2013356152B2 (ko) |
BR (1) | BR112015012796A2 (ko) |
IN (1) | IN2015DN03895A (ko) |
SG (1) | SG11201504298TA (ko) |
WO (1) | WO2014087635A1 (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6904704B2 (ja) * | 2014-08-27 | 2021-07-21 | 日本電気株式会社 | 相変化冷却装置および相変化冷却方法 |
US9552025B2 (en) * | 2014-09-23 | 2017-01-24 | Google Inc. | Cooling electronic devices in a data center |
JP5869646B1 (ja) | 2014-10-17 | 2016-02-24 | Necプラットフォームズ株式会社 | 冷媒供給装置および冷却装置および冷却システム |
CN105987468A (zh) * | 2015-02-06 | 2016-10-05 | 深圳易信科技股份有限公司 | 机房应急制冷装置 |
WO2016147615A1 (ja) * | 2015-03-13 | 2016-09-22 | 日本電気株式会社 | 冷媒供給装置、それを用いた相変化冷却装置、および冷媒供給方法 |
US10448543B2 (en) * | 2015-05-04 | 2019-10-15 | Google Llc | Cooling electronic devices in a data center |
CN106304752A (zh) * | 2015-05-19 | 2017-01-04 | 王玉富 | 一种适用于服务器分层配置的相变换热机柜 |
EP3366095B1 (en) * | 2015-10-21 | 2021-04-21 | Vertiv Corporation | Cooling systems for small equipment rooms and methods of cooling small equipment rooms |
US10349561B2 (en) | 2016-04-15 | 2019-07-09 | Google Llc | Cooling electronic devices in a data center |
CN105910600A (zh) * | 2016-06-14 | 2016-08-31 | 冯青元 | 微区域导航系统及其方法 |
CN105919301B (zh) * | 2016-06-17 | 2018-02-06 | 胡江 | 基于物联网的储米柜及其控制方法 |
JP6304420B1 (ja) * | 2017-03-23 | 2018-04-04 | 日本電気株式会社 | 冷媒分配装置、冷却装置及び冷媒分配装置における冷媒分配方法 |
JP6733630B2 (ja) * | 2017-09-13 | 2020-08-05 | 株式会社デンソー | サーモサイフォン |
US11359865B2 (en) * | 2018-07-23 | 2022-06-14 | Green Revolution Cooling, Inc. | Dual Cooling Tower Time Share Water Treatment System |
KR101995512B1 (ko) * | 2019-03-22 | 2019-07-02 | 엘제이테크 주식회사 | 산업용 기기의 냉각 장치 |
USD998770S1 (en) | 2020-10-19 | 2023-09-12 | Green Revolution Cooling, Inc. | Cooling system enclosure |
USD982145S1 (en) | 2020-10-19 | 2023-03-28 | Green Revolution Cooling, Inc. | Cooling system enclosure |
US11812587B2 (en) * | 2021-05-03 | 2023-11-07 | Microsoft Technology Licensing, Llc | Computer cooling |
US11805624B2 (en) | 2021-09-17 | 2023-10-31 | Green Revolution Cooling, Inc. | Coolant shroud |
US11925946B2 (en) | 2022-03-28 | 2024-03-12 | Green Revolution Cooling, Inc. | Fluid delivery wand |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3871995T2 (de) | 1987-03-12 | 1993-01-28 | Takenaka Komuten Co | Klimaanlage fuer gebaeude. |
JPS643447A (en) * | 1987-03-12 | 1989-01-09 | Takenaka Komuten Co | Cooling system |
JPH02259312A (ja) * | 1989-03-31 | 1990-10-22 | Nippon Steel Corp | 液体燃料の燃焼制御方法および装置 |
JPH05312361A (ja) * | 1991-11-20 | 1993-11-22 | Furukawa Electric Co Ltd:The | 空調システム |
JP2002199300A (ja) * | 2000-12-26 | 2002-07-12 | Matsushita Electric Ind Co Ltd | 画像データ送信方法、表示方法および画像データ送信装置 |
US6351381B1 (en) | 2001-06-20 | 2002-02-26 | Thermal Corp. | Heat management system |
JP4018384B2 (ja) * | 2001-12-25 | 2007-12-05 | 株式会社ブリヂストン | スチールワイヤ用オイル塗布装置 |
US6881142B1 (en) * | 2003-09-12 | 2005-04-19 | Degree C | Intelligent networked fan assisted tiles for adaptive thermal management of thermally sensitive rooms |
US7270174B2 (en) * | 2003-12-16 | 2007-09-18 | International Business Machines Corporation | Method, system and program product for automatically checking coolant loops of a cooling system for a computing environment |
US7963118B2 (en) * | 2007-09-25 | 2011-06-21 | International Business Machines Corporation | Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack |
JP2011224863A (ja) * | 2010-04-20 | 2011-11-10 | Seiko Epson Corp | 製膜装置および製膜方法 |
JP5424971B2 (ja) | 2010-04-22 | 2014-02-26 | 三機工業株式会社 | データセンターの空調制御システム |
US9038406B2 (en) * | 2010-05-26 | 2015-05-26 | International Business Machines Corporation | Dehumidifying cooling apparatus and method for an electronics rack |
JP5351097B2 (ja) * | 2010-06-18 | 2013-11-27 | 株式会社日立製作所 | 冷媒循環装置 |
US8351206B2 (en) * | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
JP5857964B2 (ja) * | 2010-08-31 | 2016-02-10 | 日本電気株式会社 | 電子機器冷却システム |
CN102143671A (zh) * | 2010-09-13 | 2011-08-03 | 华为技术有限公司 | 一种散热方法和装置 |
JP5500528B2 (ja) * | 2011-03-18 | 2014-05-21 | 清水建設株式会社 | ユニット型データセンター |
CN102736706B (zh) * | 2011-04-13 | 2015-07-01 | 英业达股份有限公司 | 伺服器机架系统 |
JP5836029B2 (ja) * | 2011-09-20 | 2015-12-24 | 株式会社日立製作所 | サーバラックの冷却システム及びサーバ機器 |
WO2013121772A1 (ja) | 2012-02-14 | 2013-08-22 | 日本電気株式会社 | 冷却装置および冷却システム |
US9638583B2 (en) * | 2014-05-21 | 2017-05-02 | Amazon Technologies, Inc. | Virtual data center environmental monitoring system |
-
2013
- 2013-12-03 CN CN201380063005.2A patent/CN104838329A/zh active Pending
- 2013-12-03 AU AU2013356152A patent/AU2013356152B2/en not_active Expired - Fee Related
- 2013-12-03 BR BR112015012796A patent/BR112015012796A2/pt not_active IP Right Cessation
- 2013-12-03 EP EP13860412.9A patent/EP2927778A4/en not_active Withdrawn
- 2013-12-03 SG SG11201504298TA patent/SG11201504298TA/en unknown
- 2013-12-03 US US14/646,599 patent/US9693485B2/en not_active Expired - Fee Related
- 2013-12-03 WO PCT/JP2013/007069 patent/WO2014087635A1/ja active Application Filing
- 2013-12-03 JP JP2014550921A patent/JPWO2014087635A1/ja active Pending
- 2013-12-03 IN IN3895DEN2015 patent/IN2015DN03895A/en unknown
- 2013-12-03 KR KR1020157017796A patent/KR20150091506A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP2927778A4 (en) | 2016-08-03 |
IN2015DN03895A (ko) | 2015-10-02 |
CN104838329A (zh) | 2015-08-12 |
BR112015012796A2 (pt) | 2017-07-11 |
EP2927778A1 (en) | 2015-10-07 |
KR20150091506A (ko) | 2015-08-11 |
AU2013356152B2 (en) | 2017-07-27 |
AU2013356152A1 (en) | 2015-05-28 |
US20150305209A1 (en) | 2015-10-22 |
WO2014087635A1 (ja) | 2014-06-12 |
US9693485B2 (en) | 2017-06-27 |
JPWO2014087635A1 (ja) | 2017-01-05 |
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