SG11201503627WA - Three-zone carrier head and flexible membrane - Google Patents

Three-zone carrier head and flexible membrane

Info

Publication number
SG11201503627WA
SG11201503627WA SG11201503627WA SG11201503627WA SG11201503627WA SG 11201503627W A SG11201503627W A SG 11201503627WA SG 11201503627W A SG11201503627W A SG 11201503627WA SG 11201503627W A SG11201503627W A SG 11201503627WA SG 11201503627W A SG11201503627W A SG 11201503627WA
Authority
SG
Singapore
Prior art keywords
flexible membrane
carrier head
zone carrier
zone
head
Prior art date
Application number
SG11201503627WA
Other languages
English (en)
Inventor
Jamie Leighton
Jeonghoon Oh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201503627WA publication Critical patent/SG11201503627WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201503627WA 2012-11-30 2013-11-21 Three-zone carrier head and flexible membrane SG11201503627WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261731758P 2012-11-30 2012-11-30
PCT/US2013/071334 WO2014085203A1 (en) 2012-11-30 2013-11-21 Three-zone carrier head and flexible membrane

Publications (1)

Publication Number Publication Date
SG11201503627WA true SG11201503627WA (en) 2015-06-29

Family

ID=50824274

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503627WA SG11201503627WA (en) 2012-11-30 2013-11-21 Three-zone carrier head and flexible membrane

Country Status (8)

Country Link
US (3) US10532441B2 (zh)
EP (1) EP2926365B1 (zh)
JP (2) JP6360491B2 (zh)
KR (2) KR102256550B1 (zh)
CN (1) CN104854680B (zh)
SG (1) SG11201503627WA (zh)
TW (2) TWI613038B (zh)
WO (1) WO2014085203A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10532441B2 (en) * 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US9381613B2 (en) * 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head
CN108044484B (zh) * 2017-08-11 2024-02-13 清华大学 具有自适应性的抛光头
JP7003838B2 (ja) 2018-05-17 2022-01-21 株式会社Sumco 研磨ヘッド及びこれを用いたウェーハ研磨装置及び研磨方法
CN108838868A (zh) * 2018-05-23 2018-11-20 长江存储科技有限责任公司 晶圆研磨设备及其操作方法
KR102637832B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
KR102637833B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
CN112108990A (zh) * 2019-06-21 2020-12-22 清华大学 用于化学机械抛光头的气膜、化学机械抛光头及抛光设备
US11945073B2 (en) 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
CN112548848B (zh) * 2019-09-26 2022-09-23 清华大学 一种承载头和化学机械抛光设备
CN113118966B (zh) * 2019-12-31 2022-08-16 清华大学 一种用于化学机械抛光的承载头及其使用方法
CN111251177B (zh) * 2020-03-10 2021-11-16 北京烁科精微电子装备有限公司 承载头及具有其的抛光装置
CN111805418B (zh) * 2020-07-17 2021-09-21 中国科学院微电子研究所 研磨头气动装置及研磨头
JP2023516875A (ja) * 2020-11-10 2023-04-21 アプライド マテリアルズ インコーポレイテッド 局所的なウエハ圧力を有する研磨ヘッド
CN112775825B (zh) * 2021-02-03 2022-11-04 华海清科股份有限公司 一种用于化学机械抛光的柔性膜、承载头及抛光设备
CN112792725B (zh) * 2021-02-03 2022-09-30 华海清科股份有限公司 一种用于化学机械抛光的柔性膜、承载头及抛光设备
CN113910102A (zh) * 2021-11-02 2022-01-11 华海清科股份有限公司 一种用于化学机械抛光的承载头

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6241593B1 (en) * 1999-07-09 2001-06-05 Applied Materials, Inc. Carrier head with pressurizable bladder
US6450868B1 (en) * 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6666756B1 (en) * 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US7198561B2 (en) 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
KR100470227B1 (ko) 2001-06-07 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치의 캐리어 헤드
JP4583729B2 (ja) 2003-02-10 2010-11-17 株式会社荏原製作所 基板保持装置、研磨装置、及び該基板保持装置に用いられる弾性部材
KR100586018B1 (ko) 2004-02-09 2006-06-01 삼성전자주식회사 연마 헤드용 플렉서블 멤브레인 및 이를 포함하는 연마 장치
US7255771B2 (en) * 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
KR100621629B1 (ko) 2004-06-04 2006-09-19 삼성전자주식회사 화학적 기계적 연마 장치에 사용되는 연마 헤드 및 연마방법
JP4822744B2 (ja) * 2004-06-04 2011-11-24 三星電子株式会社 化学機械的研磨装置、キャリアヘッド及び区画リング
JP2006004993A (ja) 2004-06-15 2006-01-05 Seiko Epson Corp Ｃｍｐ装置、ｃｍｐ研磨方法、半導体装置及びその製造方法
JP5112614B2 (ja) 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
US8454413B2 (en) 2005-12-29 2013-06-04 Applied Materials, Inc. Multi-chamber carrier head with a textured membrane
US7575504B2 (en) 2006-11-22 2009-08-18 Applied Materials, Inc. Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly
US7699688B2 (en) 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7654888B2 (en) 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
KR101722540B1 (ko) 2008-03-25 2017-04-03 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드 멤브레인
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
US8460067B2 (en) 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
US20110189856A1 (en) * 2010-01-29 2011-08-04 Kun Xu High Sensitivity Real Time Profile Control Eddy Current Monitoring System
TWI574785B (zh) 2010-08-06 2017-03-21 應用材料股份有限公司 內扣環及外扣環
JP5648954B2 (ja) 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
CN102172888B (zh) 2011-02-16 2013-01-30 清华大学 一种抛光头
KR102014492B1 (ko) 2011-09-12 2019-08-26 어플라이드 머티어리얼스, 인코포레이티드 복합 플라스틱 부분들을 구비한 캐리어 헤드
KR20130131120A (ko) * 2012-05-23 2013-12-03 삼성전자주식회사 연마 헤드용 가요성 멤브레인
US10532441B2 (en) * 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US9381613B2 (en) * 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head

Also Published As

Publication number Publication date
TWI613038B (zh) 2018-02-01
WO2014085203A1 (en) 2014-06-05
CN104854680A (zh) 2015-08-19
KR20190120448A (ko) 2019-10-23
TWI683724B (zh) 2020-02-01
TW201827161A (zh) 2018-08-01
KR20150090199A (ko) 2015-08-05
JP6360491B2 (ja) 2018-07-18
JP2015536575A (ja) 2015-12-21
US20200223028A1 (en) 2020-07-16
KR102256550B1 (ko) 2021-05-25
EP2926365A4 (en) 2015-12-09
US20190210181A1 (en) 2019-07-11
US11338409B2 (en) 2022-05-24
CN104854680B (zh) 2018-02-02
US20140150974A1 (en) 2014-06-05
KR102035721B1 (ko) 2019-10-23
JP2018152607A (ja) 2018-09-27
EP2926365B1 (en) 2017-05-03
US11370079B2 (en) 2022-06-28
US10532441B2 (en) 2020-01-14
JP6574026B2 (ja) 2019-09-11
EP2926365A1 (en) 2015-10-07
TW201429624A (zh) 2014-08-01

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