SG11201403362RA - Light-emitting diode and method of manufacturing the same - Google Patents
Light-emitting diode and method of manufacturing the sameInfo
- Publication number
- SG11201403362RA SG11201403362RA SG11201403362RA SG11201403362RA SG11201403362RA SG 11201403362R A SG11201403362R A SG 11201403362RA SG 11201403362R A SG11201403362R A SG 11201403362RA SG 11201403362R A SG11201403362R A SG 11201403362RA SG 11201403362R A SG11201403362R A SG 11201403362RA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- light
- same
- emitting diode
- diode
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/385—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending at least partially onto a side surface of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011277536A JP5865695B2 (ja) | 2011-12-19 | 2011-12-19 | 発光ダイオード及びその製造方法 |
PCT/JP2012/082790 WO2013094601A1 (ja) | 2011-12-19 | 2012-12-18 | 発光ダイオード及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201403362RA true SG11201403362RA (en) | 2014-10-30 |
Family
ID=48668488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201403362RA SG11201403362RA (en) | 2011-12-19 | 2012-12-18 | Light-emitting diode and method of manufacturing the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US9166110B2 (zh) |
EP (1) | EP2797126A4 (zh) |
JP (1) | JP5865695B2 (zh) |
KR (1) | KR101589855B1 (zh) |
CN (1) | CN103999246B (zh) |
SG (1) | SG11201403362RA (zh) |
TW (1) | TW201338206A (zh) |
WO (1) | WO2013094601A1 (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2111641B1 (en) | 2007-01-22 | 2017-08-30 | Cree, Inc. | Illumination devices using externally interconnected arrays of light emitting devices, and method of fabricating same |
US11792898B2 (en) | 2012-07-01 | 2023-10-17 | Ideal Industries Lighting Llc | Enhanced fixtures for area lighting |
US11160148B2 (en) | 2017-06-13 | 2021-10-26 | Ideal Industries Lighting Llc | Adaptive area lamp |
CN104377287B (zh) * | 2013-08-14 | 2017-04-26 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
CN104362240B (zh) * | 2014-10-31 | 2017-10-20 | 广东德力光电有限公司 | 一种LED芯片的Al2O3/SiON钝化层结构及其生长方法 |
DE102015117662B4 (de) * | 2015-10-16 | 2021-07-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
US10529696B2 (en) | 2016-04-12 | 2020-01-07 | Cree, Inc. | High density pixelated LED and devices and methods thereof |
CN105742433B (zh) * | 2016-04-29 | 2018-03-02 | 厦门市三安光电科技有限公司 | 一种AlGaInP发光二极管 |
KR101995161B1 (ko) * | 2017-02-23 | 2019-07-02 | 한국산업기술대학교산학협력단 | 조준경용 마이크로 발광다이오드 광원 및 이의 제조방법 |
CN111052387B (zh) | 2017-08-03 | 2023-11-28 | 科锐Led公司 | 高密度像素化的led芯片和芯片阵列装置及制造方法 |
US10734363B2 (en) | 2017-08-03 | 2020-08-04 | Cree, Inc. | High density pixelated-LED chips and chip array devices |
US10529773B2 (en) | 2018-02-14 | 2020-01-07 | Cree, Inc. | Solid state lighting devices with opposing emission directions |
CN111937164B (zh) * | 2018-04-06 | 2024-06-25 | 株式会社村田制作所 | 光半导体元件 |
CN111192944A (zh) * | 2018-11-15 | 2020-05-22 | 日亚化学工业株式会社 | 发光装置的制造方法 |
US10903265B2 (en) | 2018-12-21 | 2021-01-26 | Cree, Inc. | Pixelated-LED chips and chip array devices, and fabrication methods |
US20220166191A1 (en) * | 2019-03-12 | 2022-05-26 | Sony Group Corporation | Light emitting element and method for manufacturing the same |
JP6858899B2 (ja) * | 2019-03-26 | 2021-04-14 | Dowaエレクトロニクス株式会社 | 点光源型発光ダイオード及びその製造方法 |
WO2020196411A1 (ja) * | 2019-03-26 | 2020-10-01 | Dowaエレクトロニクス株式会社 | 点光源型発光ダイオード及びその製造方法 |
US11817526B2 (en) | 2019-10-29 | 2023-11-14 | Creeled, Inc. | Texturing for high density pixelated-LED chips and chip array devices |
KR102560008B1 (ko) | 2019-11-26 | 2023-07-25 | 티엔진 산안 옵토일렉트로닉스 컴퍼니 리미티드 | 적외선 발광다이오드 |
US11437548B2 (en) | 2020-10-23 | 2022-09-06 | Creeled, Inc. | Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods |
EP4089746A1 (en) * | 2021-05-11 | 2022-11-16 | Excellence Opto. Inc. | Vertical light-emitting diode structure with metal layer capable of testing and protecting sidewalls |
JP2023115682A (ja) * | 2022-02-08 | 2023-08-21 | 古河電気工業株式会社 | 半導体素子、半導体素子アレイ、およびウエハ |
CN116314245B (zh) * | 2023-05-10 | 2023-08-04 | 季华实验室 | 发光面板及其制作方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2783210B2 (ja) * | 1995-09-04 | 1998-08-06 | 日本電気株式会社 | 面発光型ダイオード |
GB2310316A (en) | 1996-02-15 | 1997-08-20 | Sharp Kk | Semiconductor laser |
JP2003031842A (ja) | 2001-07-17 | 2003-01-31 | Daido Steel Co Ltd | 半導体発光素子 |
US6784462B2 (en) | 2001-12-13 | 2004-08-31 | Rensselaer Polytechnic Institute | Light-emitting diode with planar omni-directional reflector |
JP2004111648A (ja) * | 2002-09-18 | 2004-04-08 | Hamamatsu Photonics Kk | 半導体発光素子 |
JP5376104B2 (ja) | 2005-07-04 | 2013-12-25 | ソニー株式会社 | 面発光型半導体レーザ |
JP2007221029A (ja) * | 2006-02-20 | 2007-08-30 | Sony Corp | 半導体発光素子およびその製造方法 |
KR100732191B1 (ko) | 2006-04-21 | 2007-06-27 | 한국과학기술원 | 다층 반사기 구조의 고효율 발광다이오드 및 그의 제조방법 |
JP2008053476A (ja) * | 2006-08-25 | 2008-03-06 | Sanyo Electric Co Ltd | 半導体チップおよびその製造方法 |
KR100684455B1 (ko) | 2006-11-30 | 2007-02-22 | (주)에피플러스 | 발광다이오드의 형성 방법 |
KR20080089860A (ko) * | 2007-04-02 | 2008-10-08 | 엘지이노텍 주식회사 | 반도체 발광소자 및 반도체 발광소자의 제조 방법 |
DE102008028886B4 (de) | 2008-06-18 | 2024-02-29 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements |
JP5024247B2 (ja) * | 2008-09-12 | 2012-09-12 | 日立電線株式会社 | 発光素子 |
JP2010114337A (ja) | 2008-11-10 | 2010-05-20 | Hitachi Cable Ltd | 発光素子 |
JP2011035017A (ja) | 2009-07-30 | 2011-02-17 | Hitachi Cable Ltd | 発光素子 |
KR100999733B1 (ko) * | 2010-02-18 | 2010-12-08 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
KR101769075B1 (ko) * | 2010-12-24 | 2017-08-18 | 서울바이오시스 주식회사 | 발광 다이오드 칩 및 그것을 제조하는 방법 |
-
2011
- 2011-12-19 JP JP2011277536A patent/JP5865695B2/ja not_active Expired - Fee Related
-
2012
- 2012-12-17 TW TW101147710A patent/TW201338206A/zh unknown
- 2012-12-18 KR KR1020147018885A patent/KR101589855B1/ko active IP Right Grant
- 2012-12-18 CN CN201280062289.9A patent/CN103999246B/zh not_active Expired - Fee Related
- 2012-12-18 EP EP12860019.4A patent/EP2797126A4/en not_active Withdrawn
- 2012-12-18 WO PCT/JP2012/082790 patent/WO2013094601A1/ja active Application Filing
- 2012-12-18 US US14/366,546 patent/US9166110B2/en not_active Expired - Fee Related
- 2012-12-18 SG SG11201403362RA patent/SG11201403362RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2013128072A (ja) | 2013-06-27 |
EP2797126A1 (en) | 2014-10-29 |
WO2013094601A1 (ja) | 2013-06-27 |
EP2797126A4 (en) | 2015-09-02 |
US9166110B2 (en) | 2015-10-20 |
JP5865695B2 (ja) | 2016-02-17 |
KR101589855B1 (ko) | 2016-02-12 |
TW201338206A (zh) | 2013-09-16 |
KR20140108550A (ko) | 2014-09-11 |
US20140291612A1 (en) | 2014-10-02 |
CN103999246B (zh) | 2017-06-13 |
CN103999246A (zh) | 2014-08-20 |
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