SG11201403111XA - Electronic/photonic integrated circuit architecture and method of manufacture thereof - Google Patents

Electronic/photonic integrated circuit architecture and method of manufacture thereof

Info

Publication number
SG11201403111XA
SG11201403111XA SG11201403111XA SG11201403111XA SG11201403111XA SG 11201403111X A SG11201403111X A SG 11201403111XA SG 11201403111X A SG11201403111X A SG 11201403111XA SG 11201403111X A SG11201403111X A SG 11201403111XA SG 11201403111X A SG11201403111X A SG 11201403111XA
Authority
SG
Singapore
Prior art keywords
manufacture
electronic
integrated circuit
photonic integrated
circuit architecture
Prior art date
Application number
SG11201403111XA
Other languages
English (en)
Inventor
Long Chen
Pietro Bernasconi
Po Dong
Liming Zhang
Young-Kai Chen
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Publication of SG11201403111XA publication Critical patent/SG11201403111XA/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004Combinations of two or more optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002Three-dimensional structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1228Tapered waveguides, e.g. integrated spot-size transformers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/015Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on semiconductor elements having potential barriers, e.g. having a PN or PIN junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/026Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/026Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H01S5/0261Non-optical elements, e.g. laser driver components, heaters

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Semiconductor Lasers (AREA)
SG11201403111XA 2011-12-15 2012-12-07 Electronic/photonic integrated circuit architecture and method of manufacture thereof SG11201403111XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/326,583 US9423560B2 (en) 2011-12-15 2011-12-15 Electronic/photonic integrated circuit architecture and method of manufacture thereof
PCT/US2012/068437 WO2013090140A1 (en) 2011-12-15 2012-12-07 Electronic/photonic integrated circuit architecture and method of manufacture thereof

Publications (1)

Publication Number Publication Date
SG11201403111XA true SG11201403111XA (en) 2014-08-28

Family

ID=47501442

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201403111XA SG11201403111XA (en) 2011-12-15 2012-12-07 Electronic/photonic integrated circuit architecture and method of manufacture thereof

Country Status (7)

Country Link
US (1) US9423560B2 (de)
EP (1) EP2791720B1 (de)
JP (1) JP5984958B2 (de)
CN (1) CN103998960B (de)
SG (1) SG11201403111XA (de)
TW (1) TWI480607B (de)
WO (1) WO2013090140A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014041536A1 (en) * 2012-09-13 2014-03-20 Ben-Gurion University Of The Negev Research And Development Authority Integrated circuit with photonic elements
WO2014047443A1 (en) * 2012-09-21 2014-03-27 The Regents Of The University Of California Integrated dielectric waveguide and semiconductor layer and method therefor
KR20140095678A (ko) * 2013-01-25 2014-08-04 삼성전자주식회사 광소자 및 전자소자를 포함하는 반도체 장치 및 그 제조 방법
JP6130284B2 (ja) * 2013-10-30 2017-05-17 日本電信電話株式会社 光導波路の作製方法
SG10201805702QA (en) * 2014-01-14 2018-08-30 Massachusetts Inst Technology Method of forming an integrated circuit and related integrated circuit
TWI549259B (zh) * 2014-05-15 2016-09-11 國立清華大學 全集成主被動積體光學於矽基積體電路及其製作方法
DE102014219792A1 (de) * 2014-09-30 2016-03-31 Technische Universität Berlin Optoelektronisches Bauelement
US9459177B1 (en) * 2015-05-15 2016-10-04 Alcatel Lucent Wafer-level testing of optical circuit devices
US20180035090A1 (en) * 2016-03-15 2018-02-01 Sutherland Cook Ellwood, JR. Photonic signal converter
US10976491B2 (en) * 2016-11-23 2021-04-13 The Research Foundation For The State University Of New York Photonics interposer optoelectronics
US10162244B1 (en) * 2017-06-27 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Configurable heating device
US10371893B2 (en) 2017-11-30 2019-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Hybrid interconnect device and method
US10962710B2 (en) 2018-06-04 2021-03-30 The Boeing Company Multidimensional optical waveguide in planar dielectric structures
US11409139B2 (en) * 2019-12-13 2022-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device including waveguide heater, and method and system for generating layout diagram of same
WO2024049944A1 (en) * 2022-09-02 2024-03-07 Quantinuum Llc Low loss silicon nitride and waveguides comprising low loss silicon nitride

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03168705A (ja) 1989-11-29 1991-07-22 Omron Corp 三次元光回路
JPH0682642A (ja) 1992-03-06 1994-03-25 Fujitsu Ltd 光回路デバイス、その製造方法およびそれを用いた多層光回路
JP4224897B2 (ja) 1999-07-13 2009-02-18 ソニー株式会社 光導波路の製造方法および光送受信装置の製造方法
DE10104563A1 (de) 2001-02-01 2002-08-22 Infineon Technologies Ag Halbleiterelement mit optoelektronischer Signalübertragung und Verfahren zum Erzeugen eines solchen Halbleiterelements
US20030026575A1 (en) 2001-08-02 2003-02-06 Motorola, Inc. Structure and method for fabricating semiconductor optical waveguide structures utilizing the formation of a compliant substrate
US7253091B2 (en) * 2001-09-28 2007-08-07 Hrl Laboratories, Llc Process for assembling three-dimensional systems on a chip and structure thus obtained
US6859571B2 (en) * 2001-10-26 2005-02-22 Massachusetts Institute Of Technology Hybrid integration of electrical and optical chips
US6895134B2 (en) * 2001-11-10 2005-05-17 Triquint Technology Holding Co. Integrated optoelectronics devices
JP4023285B2 (ja) * 2002-10-24 2007-12-19 ソニー株式会社 光・電気配線混載ハイブリッド回路基板及びその製造方法並びに光・電気配線混載ハイブリッド回路モジュール及びその製造方法
US7070207B2 (en) * 2003-04-22 2006-07-04 Ibiden Co., Ltd. Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication
US7203387B2 (en) * 2003-09-10 2007-04-10 Agency For Science, Technology And Research VLSI-photonic heterogeneous integration by wafer bonding
US7298949B2 (en) * 2004-02-12 2007-11-20 Sioptical, Inc. SOI-based photonic bandgap devices
EP1794805A1 (de) 2004-09-09 2007-06-13 RJ Mears, LLC Integrierte schaltung mit einer aktiven optischen einrichtung mit einem energiebandabgestimmten supergitter und assoziierte herstellungsverfahren
JP4646618B2 (ja) * 2004-12-20 2011-03-09 イビデン株式会社 光路変換部材、多層プリント配線板および光通信用デバイス
US7324720B2 (en) * 2005-02-25 2008-01-29 Nokia Corporation Protecting optical coupling between optical ports on opposing electronic components
US7778501B2 (en) * 2007-04-03 2010-08-17 Hewlett-Packard Development Company, L.P. Integrated circuits having photonic interconnect layers and methods for fabricating same
US20090078963A1 (en) 2007-07-09 2009-03-26 Salah Khodja Nano-optoelectronic chip structure and method
JP2009176875A (ja) 2008-01-23 2009-08-06 Nec Corp 半導体装置
US8260151B2 (en) 2008-04-18 2012-09-04 Freescale Semiconductor, Inc. Optical communication integration
JP5439080B2 (ja) * 2009-07-28 2014-03-12 株式会社日立製作所 光i/oアレイモジュール
US8428401B2 (en) * 2009-12-16 2013-04-23 Telefonaktiebolaget L M Ericsson (Publ) On-chip optical waveguide

Also Published As

Publication number Publication date
CN103998960A (zh) 2014-08-20
JP2015505067A (ja) 2015-02-16
US9423560B2 (en) 2016-08-23
EP2791720A1 (de) 2014-10-22
US20130156364A1 (en) 2013-06-20
JP5984958B2 (ja) 2016-09-06
EP2791720B1 (de) 2018-05-16
WO2013090140A1 (en) 2013-06-20
TW201333561A (zh) 2013-08-16
CN103998960B (zh) 2017-07-18
TWI480607B (zh) 2015-04-11

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