SG11201403003SA - Structural adhesive compositions - Google Patents
Structural adhesive compositionsInfo
- Publication number
- SG11201403003SA SG11201403003SA SG11201403003SA SG11201403003SA SG11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA SG 11201403003S A SG11201403003S A SG 11201403003SA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive compositions
- structural adhesive
- structural
- compositions
- adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
- C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
- C08G59/4276—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J1/00—Adhesives based on inorganic constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Composite Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/315,518 US20120129980A1 (en) | 2010-11-19 | 2011-12-09 | Structural adhesive compositions |
| PCT/US2012/068378 WO2013086277A2 (en) | 2011-12-09 | 2012-12-07 | Structural adhesive compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201403003SA true SG11201403003SA (en) | 2014-07-30 |
Family
ID=47501441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201403003SA SG11201403003SA (en) | 2011-12-09 | 2012-12-07 | Structural adhesive compositions |
Country Status (12)
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010118580A (ja) | 2008-11-14 | 2010-05-27 | Toshiba Corp | 不揮発性半導体記憶装置 |
| US20140150970A1 (en) * | 2010-11-19 | 2014-06-05 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US8796361B2 (en) | 2010-11-19 | 2014-08-05 | Ppg Industries Ohio, Inc. | Adhesive compositions containing graphenic carbon particles |
| US20120128499A1 (en) * | 2010-11-19 | 2012-05-24 | Desai Umesh C | Structural adhesive compositions |
| US10294375B2 (en) * | 2011-09-30 | 2019-05-21 | Ppg Industries Ohio, Inc. | Electrically conductive coatings containing graphenic carbon particles |
| US20140038481A1 (en) * | 2012-08-03 | 2014-02-06 | Ocv Intellectual Capital, Llc | Fiberglass reinforced composites |
| KR101719944B1 (ko) * | 2013-03-04 | 2017-03-24 | 신닛테츠스미킨 카부시키카이샤 | 충격 흡수 부품 |
| KR101858370B1 (ko) * | 2013-06-14 | 2018-05-15 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 구조용 접착제 조성물 |
| CA2917693A1 (en) * | 2013-07-24 | 2015-01-29 | Dow Global Technologies Llc | Curable compositions |
| CN104004482A (zh) * | 2014-06-13 | 2014-08-27 | 江苏悦达新材料科技有限公司 | 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法 |
| GB201411586D0 (en) * | 2014-06-30 | 2014-08-13 | Hexcel Composites Ltd | Adhesive composition |
| DE102014226826A1 (de) * | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
| US11242427B2 (en) | 2015-10-20 | 2022-02-08 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10377928B2 (en) | 2015-12-10 | 2019-08-13 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10351661B2 (en) | 2015-12-10 | 2019-07-16 | Ppg Industries Ohio, Inc. | Method for producing an aminimide |
| CN106118571A (zh) * | 2016-06-28 | 2016-11-16 | 四川东树新材料有限公司 | 风电叶片用含石墨烯结构胶黏剂及其制备方法 |
| BR112019008520A2 (pt) * | 2016-10-28 | 2019-07-09 | Dow Global Technologies Llc | adesivo de epóxi durável em quebra que tem resistência ao impacto em baixa temperatura aprimorada |
| KR102454520B1 (ko) * | 2017-06-23 | 2022-10-17 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | 고온 에폭시 접착 제형 |
| US20200248050A1 (en) | 2017-09-20 | 2020-08-06 | Ppg Industries Ohio, Inc. | Two-Component Structural Adhesives |
| US11732125B2 (en) | 2018-02-09 | 2023-08-22 | Ppg Industries Ohio, Inc. | Coating compositions |
| CA3113053A1 (en) | 2018-09-20 | 2020-03-26 | Ppg Industries Ohio, Inc. | Thiol-containing composition |
| CA3115812C (en) | 2018-10-12 | 2023-08-01 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| EP4450581A3 (en) * | 2018-10-29 | 2025-01-08 | Zephyros, Inc. | Improved structural bonding adhesive |
| FR3098817A1 (fr) | 2019-07-16 | 2021-01-22 | Ppg Industries Ohio, Inc. | Compositions contenant des charges thermiquement conductrices |
| CA3147442A1 (en) | 2019-08-23 | 2021-03-04 | Ppg Industries Ohio, Inc. | Coating compositions |
| US20220275240A1 (en) * | 2019-08-23 | 2022-09-01 | Ppg Industries Ohio, Inc. | Systems and methods for improved lap shear strength and displacement of two-component structural adhesives |
| KR102768956B1 (ko) * | 2019-08-23 | 2025-02-14 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 2-성분 구조적 접착제의 개선된 중첩전단 강도 및 변위를 위한 시스템 및 방법 |
| EP4017897A1 (en) * | 2019-08-23 | 2022-06-29 | PRC-Desoto International, Inc. | Coating compositions |
| EP4034584A1 (en) | 2019-09-23 | 2022-08-03 | PPG Industries Ohio Inc. | Curable compositions |
| EP4073158A1 (en) | 2019-12-11 | 2022-10-19 | PPG Industries Ohio Inc. | Compositions containing thermally conductive fillers |
| EP4110873A1 (en) | 2020-02-26 | 2023-01-04 | PPG Industries Ohio Inc. | Thermally conductive and electrically insulating powder coating compositions |
| WO2021174086A1 (en) | 2020-02-26 | 2021-09-02 | Ppg Industries Ohio, Inc. | Coated substrates and methods of preparing the same |
| KR20220143746A (ko) | 2020-02-26 | 2022-10-25 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 2-층 유전체 코팅 |
| CN115916882A (zh) | 2020-04-15 | 2023-04-04 | Ppg工业俄亥俄公司 | 含有导热填料的组合物 |
| WO2021211182A1 (en) | 2020-04-15 | 2021-10-21 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| MX2022012971A (es) | 2020-04-15 | 2023-01-18 | Ppg Ind Ohio Inc | Composiciones que contienen agentes de relleno térmicamente conductores. |
| AU2021257418B2 (en) | 2020-04-15 | 2024-04-04 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| WO2021211694A1 (en) | 2020-04-15 | 2021-10-21 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| WO2021211185A1 (en) | 2020-04-15 | 2021-10-21 | Ppg Industries Ohio, Inc. | Compositions containing thermally conductive fillers |
| JP7622228B2 (ja) | 2020-12-18 | 2025-01-27 | ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド | 熱伝導性かつ電気絶縁性及び／又は難燃性の電着性コーティング組成物 |
| WO2022204686A1 (en) | 2021-03-26 | 2022-09-29 | Ppg Industries Ohio, Inc. | Coating compositions |
| DE102021113089B4 (de) * | 2021-05-20 | 2023-05-11 | Jomoo Kitchen & Bath Deutschland Gmbh | Sanitär-Einrichtung |
| MX2024006742A (es) | 2021-12-02 | 2024-06-19 | Ppg Ind Ohio Inc | Composiciones de revestimiento. |
| CN114752334B (zh) * | 2022-04-11 | 2023-10-20 | 中国航发北京航空材料研究院 | 一种耐湿热贮存稳定的中温固化环氧结构胶膜及制备方法 |
| WO2023240057A1 (en) | 2022-06-06 | 2023-12-14 | Ppg Industries Ohio, Inc. | Coating compositions |
| EP4573143A1 (en) * | 2022-08-19 | 2025-06-25 | PPG Industries Ohio Inc. | Coating compositions |
| WO2024044576A1 (en) | 2022-08-22 | 2024-02-29 | Ppg Industries Ohio, Inc. | Coating compositions |
| CN116042150A (zh) * | 2022-12-30 | 2023-05-02 | 浙江抟原复合材料有限公司 | 一种lng船围护系统用低温环氧树脂及其制备方法 |
| WO2025107007A1 (en) | 2023-11-19 | 2025-05-22 | Ppg Industries Ohio, Inc. | Curable compositions |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3816365A (en) * | 1968-09-12 | 1974-06-11 | Ciba Geigy Ag | Adducts,containing epoxide groups,from polyglycidyl compounds and acid polyesters of aliphatic-cycloaliphatic dicarboxylic acids,process for their manufacture and use |
| US4668736A (en) * | 1984-07-18 | 1987-05-26 | Minnesota Mining And Manufacturing Company | Fast curing epoxy resin compositions |
| EP0305331A3 (de) * | 1987-08-25 | 1991-05-08 | Ciba-Geigy Ag | Epoxidflexibilisatoren |
| US5070119A (en) * | 1990-09-28 | 1991-12-03 | Ppg Industries, Inc. | Flexible intumescent coating composition |
| DE4317470C2 (de) * | 1993-05-26 | 2001-06-07 | Henkel Kgaa | Thermisch vernetzbarer Heißsiegel-Klebstoff und dessen Verwendung |
| JPH07309929A (ja) * | 1994-05-16 | 1995-11-28 | Dainippon Ink & Chem Inc | エポキシ樹脂及びその製造方法 |
| US7071258B1 (en) * | 2002-10-21 | 2006-07-04 | Nanotek Instruments, Inc. | Nano-scaled graphene plates |
| KR20040061909A (ko) * | 2002-12-31 | 2004-07-07 | 주식회사 금강고려화학 | 내후성 및 기계적 물성이 우수한 에폭시-폴리에스테르수지 조성과 분체 도료 조성물 |
| JP2006008730A (ja) * | 2004-06-22 | 2006-01-12 | Kyoeisha Chem Co Ltd | 油膜被覆鋼材と発泡した硬化エポキシ樹脂充填材との接着性の増強剤 |
| CN101517029B (zh) * | 2006-07-31 | 2013-10-16 | 汉高股份及两合公司 | 可固化的环氧树脂-基粘合剂组合物 |
| US8097119B2 (en) * | 2007-04-11 | 2012-01-17 | Dow Global Technologies Llc | Heat-resistant structural epoxy resins |
| EP2173810A4 (en) * | 2007-07-26 | 2012-07-25 | Henkel Corp | CURABLE ADHESIVE COMPOSITIONS BASED ON EPOXY RESIN |
| CN102102001B (zh) * | 2010-12-03 | 2013-04-17 | 烟台德邦科技有限公司 | 一种高导热石墨烯基环氧树脂胶粘剂及其制备方法 |
-
2011
- 2011-12-09 US US13/315,518 patent/US20120129980A1/en not_active Abandoned
-
2012
- 2012-12-07 EP EP12809911.6A patent/EP2788397A2/en active Pending
- 2012-12-07 IN IN4651DEN2014 patent/IN2014DN04651A/en unknown
- 2012-12-07 KR KR1020147018721A patent/KR101684752B1/ko active Active
- 2012-12-07 CA CA2858186A patent/CA2858186C/en active Active
- 2012-12-07 WO PCT/US2012/068378 patent/WO2013086277A2/en active Application Filing
- 2012-12-07 RU RU2014127905/04A patent/RU2595040C2/ru active
- 2012-12-07 MX MX2014006899A patent/MX380981B/es unknown
- 2012-12-07 BR BR112014013594-0A patent/BR112014013594B1/pt active IP Right Grant
- 2012-12-07 CN CN201280067282.6A patent/CN104053694B/zh active Active
- 2012-12-07 SG SG11201403003SA patent/SG11201403003SA/en unknown
- 2012-12-07 AU AU2012347650A patent/AU2012347650B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP2788397A2 (en) | 2014-10-15 |
| US20120129980A1 (en) | 2012-05-24 |
| BR112014013594B1 (pt) | 2021-01-05 |
| MX2014006899A (es) | 2015-05-15 |
| KR20140101838A (ko) | 2014-08-20 |
| CA2858186A1 (en) | 2013-06-13 |
| MX380981B (es) | 2025-03-12 |
| KR101684752B1 (ko) | 2016-12-08 |
| RU2595040C2 (ru) | 2016-08-20 |
| WO2013086277A2 (en) | 2013-06-13 |
| CA2858186C (en) | 2016-06-07 |
| AU2012347650A1 (en) | 2014-06-26 |
| BR112014013594A8 (pt) | 2017-06-13 |
| CN104053694B (zh) | 2016-08-17 |
| RU2014127905A (ru) | 2016-02-10 |
| IN2014DN04651A (enrdf_load_stackoverflow) | 2015-04-03 |
| BR112014013594A2 (pt) | 2017-06-13 |
| AU2012347650B2 (en) | 2015-09-17 |
| CN104053694A (zh) | 2014-09-17 |
| WO2013086277A3 (en) | 2013-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201403003SA (en) | Structural adhesive compositions | |
| EP2736998A4 (en) | ADHESIVE COMPOSITION | |
| ZA201206590B (en) | Adhesive compositions | |
| SI2738232T1 (sl) | Lepilni sestavek | |
| ZA201400330B (en) | Novel composition | |
| EP2933302A4 (en) | ADHESIVE COMPOSITION | |
| EP2674467A4 (en) | aDHESIVE MASS | |
| GB201120616D0 (en) | Composition | |
| ZA201403831B (en) | Borax-free starch adhesive compositions | |
| EP2752475A4 (en) | ADHESIVE COMPOSITION | |
| IL232063A0 (en) | Adhesive composition | |
| GB201119601D0 (en) | Composition | |
| EP2773714A4 (en) | ADHESIVE COMPOSITION | |
| GB201117037D0 (en) | Composition | |
| GB201121258D0 (en) | Composition | |
| GB201108912D0 (en) | Composition | |
| GB201103964D0 (en) | Composition | |
| GB2497114B (en) | Adhesive composition | |
| GB201322023D0 (en) | Composition | |
| EP2711011A4 (en) | COMPOSITION CONTAINING PANAXADIOL | |
| GB201204957D0 (en) | Composition | |
| GB201115211D0 (en) | Composition | |
| GB201216884D0 (en) | Composition | |
| LT2726579T (lt) | Kompozicija | |
| GB201121300D0 (en) | Novel composition |