SG108948A1 - Daf tape adhering apparatus and daf tape adhering method - Google Patents

Daf tape adhering apparatus and daf tape adhering method

Info

Publication number
SG108948A1
SG108948A1 SG200400544A SG200400544A SG108948A1 SG 108948 A1 SG108948 A1 SG 108948A1 SG 200400544 A SG200400544 A SG 200400544A SG 200400544 A SG200400544 A SG 200400544A SG 108948 A1 SG108948 A1 SG 108948A1
Authority
SG
Singapore
Prior art keywords
daf tape
kiln
pressure
tape adhering
daf
Prior art date
Application number
SG200400544A
Other languages
English (en)
Inventor
Kobayashi Kazuo
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of SG108948A1 publication Critical patent/SG108948A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
SG200400544A 2003-03-13 2004-02-04 Daf tape adhering apparatus and daf tape adhering method SG108948A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003068253A JP2004281534A (ja) 2003-03-13 2003-03-13 Ｄａｆテープ貼付装置およびｄａｆテープ貼付方法

Publications (1)

Publication Number Publication Date
SG108948A1 true SG108948A1 (en) 2005-02-28

Family

ID=32767961

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200400544A SG108948A1 (en) 2003-03-13 2004-02-04 Daf tape adhering apparatus and daf tape adhering method

Country Status (6)

Country Link
US (1) US20040177811A1 (ja)
EP (1) EP1458014A1 (ja)
JP (1) JP2004281534A (ja)
KR (1) KR20040080960A (ja)
SG (1) SG108948A1 (ja)
TW (1) TWI234800B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071472A (ja) * 2009-08-31 2011-04-07 Hitachi Setsubi Eng Co Ltd 真空貼付け方法及び装置
WO2014201627A1 (en) * 2013-06-19 2014-12-24 Acm Research (Shanghai) Inc. Apparatus and method for taping adhesive film on semiconductor substrate
JP6518405B2 (ja) * 2014-03-28 2019-05-22 株式会社東京精密 半導体製造装置及び半導体の製造方法
CN104409384B (zh) * 2014-10-20 2017-06-09 上海技美电子科技有限公司 晶圆贴膜装置
WO2016169018A1 (zh) * 2015-04-23 2016-10-27 华为技术有限公司 一种压合装置及方法
JP2018064013A (ja) * 2016-10-12 2018-04-19 リンテック株式会社 シート貼付装置および貼付方法
US10236221B2 (en) 2017-05-19 2019-03-19 Analog Devices Global Forming an isolation barrier in an isolator
US10290532B2 (en) * 2017-05-19 2019-05-14 Analog Devices Global Forming an isolation barrier in an isolator
KR102448726B1 (ko) 2017-08-14 2022-09-28 삼성전자주식회사 라미네이팅 장치 및 그를 이용하는 반도체 패키지 제조 방법
CN110024102B (zh) 2019-02-26 2020-10-30 长江存储科技有限责任公司 用于在晶圆表面贴黏胶膜的方法和装置
CH719396A1 (fr) * 2022-02-03 2023-08-15 Pbmc Sa Equipement et procédé de pose d'un film sur porte-pièce en forme de plaque.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338705A (en) * 1992-09-10 1994-08-16 Texas Instruments Incorporated Pressure differential downset
US6030711A (en) * 1996-03-11 2000-02-29 Micron Technology, Inc. Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
JP2001148412A (ja) * 1999-11-19 2001-05-29 Takatori Corp 半導体ウエハへの保護テープ貼り付け方法及び装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113636A (ja) * 1982-12-20 1984-06-30 Disco Abrasive Sys Ltd 全自動ウエ−ハ−のテ−プ貼着機
JPS61139040A (ja) * 1984-12-11 1986-06-26 Toshiba Corp ウエハ保持具成形装置
JPH09219383A (ja) * 1996-02-13 1997-08-19 Fujitsu Ltd 半導体装置の製造方法及び製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5338705A (en) * 1992-09-10 1994-08-16 Texas Instruments Incorporated Pressure differential downset
US6030711A (en) * 1996-03-11 2000-02-29 Micron Technology, Inc. Method and apparatus for applying atomized adhesive to a leadframe for chip bonding
JP2001148412A (ja) * 1999-11-19 2001-05-29 Takatori Corp 半導体ウエハへの保護テープ貼り付け方法及び装置

Also Published As

Publication number Publication date
KR20040080960A (ko) 2004-09-20
US20040177811A1 (en) 2004-09-16
TW200425229A (en) 2004-11-16
JP2004281534A (ja) 2004-10-07
TWI234800B (en) 2005-06-21
EP1458014A1 (en) 2004-09-15

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