MXPA06004319A - Aparato y metodo para sujetar materiales para la formacion y union de los mismos. - Google Patents

Aparato y metodo para sujetar materiales para la formacion y union de los mismos.

Info

Publication number
MXPA06004319A
MXPA06004319A MXPA06004319A MXPA06004319A MXPA06004319A MX PA06004319 A MXPA06004319 A MX PA06004319A MX PA06004319 A MXPA06004319 A MX PA06004319A MX PA06004319 A MXPA06004319 A MX PA06004319A MX PA06004319 A MXPA06004319 A MX PA06004319A
Authority
MX
Mexico
Prior art keywords
joining
sheet material
forming
holding materials
lower nest
Prior art date
Application number
MXPA06004319A
Other languages
English (en)
Inventor
Jonathon R Campian
Original Assignee
Jonathon R Campian
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonathon R Campian filed Critical Jonathon R Campian
Publication of MXPA06004319A publication Critical patent/MXPA06004319A/es

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1858Handling of layers or the laminate using vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/02Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal by folding, e.g. connecting edges of a sheet to form a cylinder
    • B21D39/021Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of sheet metal by folding, e.g. connecting edges of a sheet to form a cylinder for panels, e.g. vehicle doors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B2038/1891Using a robot for handling the layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1002Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1028Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina by bending, drawing or stretch forming sheet to assume shape of configured lamina while in contact therewith
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1744Means bringing discrete articles into assembled relationship

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Braking Arrangements (AREA)
  • Replacement Of Web Rolls (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

Se describe una celda- maquina (10) para la formacion y union de una primer hoja de un material (A) a una segunda hoja de un material (B) que incluye una entrada superior (100) y un nicho inferior (200). El nicho inferior (200) incluye una almohadilla de vacio (208) que tiene un canal ranurado (210) definido en el mismo. Un sistema de vacio (204) se conecta al canal ranurado (210) para sujetar la primer hoja del material (A) al nicho inferior (200) durante la union de la primer y segunda hojas de materiales A y B. La celda-maquina (10) ademas comprende un arreglo para alinear la primer hoja del material a la segunda hoja del material.
MXPA06004319A 2003-10-15 2004-10-15 Aparato y metodo para sujetar materiales para la formacion y union de los mismos. MXPA06004319A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51164803P 2003-10-15 2003-10-15
PCT/US2004/034238 WO2005037517A1 (en) 2003-10-15 2004-10-15 Apparatus and method for holding materials for the forming and joining thereof

Publications (1)

Publication Number Publication Date
MXPA06004319A true MXPA06004319A (es) 2006-06-05

Family

ID=34465259

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA06004319A MXPA06004319A (es) 2003-10-15 2004-10-15 Aparato y metodo para sujetar materiales para la formacion y union de los mismos.

Country Status (5)

Country Link
US (1) US8202388B2 (es)
CN (1) CN101426597B (es)
CA (1) CA2542480C (es)
MX (1) MXPA06004319A (es)
WO (1) WO2005037517A1 (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8359895B2 (en) * 2003-10-15 2013-01-29 Modern Body Engineering Corporation Machine cell with vacuum nest for holding a metal panel during a forming operation
US8633537B2 (en) 2007-05-25 2014-01-21 Cypress Semiconductor Corporation Memory transistor with multiple charge storing layers and a high work function gate electrode
US8093128B2 (en) * 2007-05-25 2012-01-10 Cypress Semiconductor Corporation Integration of non-volatile charge trap memory devices and logic CMOS devices
US8063434B1 (en) 2007-05-25 2011-11-22 Cypress Semiconductor Corporation Memory transistor with multiple charge storing layers and a high work function gate electrode
US20090179253A1 (en) 2007-05-25 2009-07-16 Cypress Semiconductor Corporation Oxide-nitride-oxide stack having multiple oxynitride layers
US8871595B2 (en) 2007-05-25 2014-10-28 Cypress Semiconductor Corporation Integration of non-volatile charge trap memory devices and logic CMOS devices
US8940645B2 (en) 2007-05-25 2015-01-27 Cypress Semiconductor Corporation Radical oxidation process for fabricating a nonvolatile charge trap memory device
US8614124B2 (en) * 2007-05-25 2013-12-24 Cypress Semiconductor Corporation SONOS ONO stack scaling
US8283261B2 (en) 2007-05-25 2012-10-09 Cypress Semiconductor Corporation Radical oxidation process for fabricating a nonvolatile charge trap memory device
US9299568B2 (en) 2007-05-25 2016-03-29 Cypress Semiconductor Corporation SONOS ONO stack scaling
US9449831B2 (en) 2007-05-25 2016-09-20 Cypress Semiconductor Corporation Oxide-nitride-oxide stack having multiple oxynitride layers
US9431549B2 (en) 2007-12-12 2016-08-30 Cypress Semiconductor Corporation Nonvolatile charge trap memory device having a high dielectric constant blocking region
US8222688B1 (en) 2009-04-24 2012-07-17 Cypress Semiconductor Corporation SONOS stack with split nitride memory layer
US8710578B2 (en) 2009-04-24 2014-04-29 Cypress Semiconductor Corporation SONOS stack with split nitride memory layer
US9352376B2 (en) 2011-05-24 2016-05-31 Comau S.P.A. Hemming head device and method
US20130111728A1 (en) * 2011-11-09 2013-05-09 Ford Global Technologies, Llc Component fastening location system
US8685813B2 (en) 2012-02-15 2014-04-01 Cypress Semiconductor Corporation Method of integrating a charge-trapping gate stack into a CMOS flow
ES2602328T3 (es) 2013-07-01 2017-02-20 Comau S.P.A. Cabezal de herramienta para realizar operaciones industriales que tiene un sistema de monitoreo inalámbrico
EP3305431B1 (en) 2016-10-10 2023-09-27 Comau S.p.A. Hemming apparatus and hemming method
DE102017120243B4 (de) * 2017-01-11 2022-01-05 Faist Chemtec Gmbh Verfahren und Vorrichtung zum Applizieren einer Komponente an einem Bauteil mittels eines Manipulators
RS59305B1 (sr) 2017-02-23 2019-10-31 Comau Spa Zglobni robot koji nosi glavu za elektrootporno zavarivanje sa elektrodama smeštenim na istoj strani; odgovarajući postupak elektrootpornog zavarivanja na komponenti koja se zavaruje

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501354A1 (de) * 1985-01-17 1986-07-17 Ford-Werke AG, 5000 Köln Innenverkleidungsteil fuer kraftfahrzeuge und vorrichtungen zu seiner herstellu ng
US4769100A (en) * 1986-09-22 1988-09-06 General Motors Corporation Method of applying carrier films prepainted with metallic paint to automobile body panels
JPH0230329A (ja) 1988-07-19 1990-01-31 Honda Motor Co Ltd ヘミング用金型装置
US5076880A (en) * 1988-09-16 1991-12-31 R + S Stanztechnik Gmbh Apparatus for manufacturing trim panels including several trim components
US5925207A (en) 1991-01-16 1999-07-20 Kasai Kogyo Co., Ltd. Automotive interior components, and method and device for manufacturing the same
US5375951A (en) * 1992-03-12 1994-12-27 California Technical Marketing, Inc. Method for making bed for automated milling machine
SG44936A1 (en) * 1992-07-09 1997-12-19 Triengineering Co Ltd Roller type hemming apparatus
JP3090245B2 (ja) * 1994-11-18 2000-09-18 河西工業株式会社 自動車用内装部品及びその製造方法
US5554252A (en) * 1995-01-27 1996-09-10 The Budd Company Hot and cool air bonding apparatus
JP3189969B2 (ja) * 1995-07-21 2001-07-16 新東工業株式会社 加飾体貼着木目込み方法及びその装置
US5660380A (en) * 1995-08-15 1997-08-26 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials

Also Published As

Publication number Publication date
WO2005037517A1 (en) 2005-04-28
CA2542480C (en) 2012-11-20
US20060081331A1 (en) 2006-04-20
CN101426597A (zh) 2009-05-06
CN101426597B (zh) 2012-07-25
US8202388B2 (en) 2012-06-19
CA2542480A1 (en) 2005-04-28

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