SG104977A1 - Discrete solder ball contact and circuit board assembly utilizing same - Google Patents

Discrete solder ball contact and circuit board assembly utilizing same

Info

Publication number
SG104977A1
SG104977A1 SG200204727A SG200204727A SG104977A1 SG 104977 A1 SG104977 A1 SG 104977A1 SG 200204727 A SG200204727 A SG 200204727A SG 200204727 A SG200204727 A SG 200204727A SG 104977 A1 SG104977 A1 SG 104977A1
Authority
SG
Singapore
Prior art keywords
pins
circuit board
solder
solder ball
board assembly
Prior art date
Application number
SG200204727A
Other languages
English (en)
Inventor
M Bogurskiy Robert
M Kennedy Craig
Krone Kenneth
J Lynch Joseph
Original Assignee
Autosplice Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/929,434 external-priority patent/US20030079911A1/en
Application filed by Autosplice Inc filed Critical Autosplice Inc
Publication of SG104977A1 publication Critical patent/SG104977A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • H01R4/024—Soldered or welded connections between cables or wires and terminals comprising preapplied solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SG200204727A 2001-08-13 2002-08-06 Discrete solder ball contact and circuit board assembly utilizing same SG104977A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/929,434 US20030079911A1 (en) 2001-08-13 2001-08-13 Discrete solder ball contact and circuit board assembly utilizing same
US10/084,125 US6700079B2 (en) 2001-08-13 2002-02-28 Discrete solder ball contact and circuit board assembly utilizing same

Publications (1)

Publication Number Publication Date
SG104977A1 true SG104977A1 (en) 2004-07-30

Family

ID=26770623

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200204727A SG104977A1 (en) 2001-08-13 2002-08-06 Discrete solder ball contact and circuit board assembly utilizing same

Country Status (7)

Country Link
US (1) US6700079B2 (fr)
EP (1) EP1284523B1 (fr)
JP (1) JP4521854B2 (fr)
KR (1) KR101029037B1 (fr)
DE (1) DE60209408T2 (fr)
HK (1) HK1053546A1 (fr)
SG (1) SG104977A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4744689B2 (ja) * 2000-12-11 2011-08-10 パナソニック株式会社 粘性流体転写装置及び電子部品実装装置
US7446261B2 (en) 2001-09-06 2008-11-04 Finisar Corporation Flexible circuit boards with tooling cutouts for optoelectronic modules
US7439449B1 (en) 2002-02-14 2008-10-21 Finisar Corporation Flexible circuit for establishing electrical connectivity with optical subassembly
US7115998B2 (en) 2002-08-29 2006-10-03 Micron Technology, Inc. Multi-component integrated circuit contacts
US7526207B2 (en) * 2002-10-18 2009-04-28 Finisar Corporation Flexible circuit design for improved laser bias connections to optical subassemblies
US6864694B2 (en) * 2002-10-31 2005-03-08 Agilent Technologies, Inc. Voltage probe
US7347750B2 (en) * 2003-09-02 2008-03-25 Interplex Nas, Inc. Solder-bearing contacts and method of manufacture thereof and use in connectors
US7311240B2 (en) * 2004-04-30 2007-12-25 Finisar Corporation Electrical circuits with button plated contacts and assembly methods
US7629537B2 (en) 2004-07-09 2009-12-08 Finisar Corporation Single layer flex circuit
US7462783B2 (en) * 2004-08-02 2008-12-09 Texas Instruments Incorporated Semiconductor package having a grid array of pin-attached balls
JP4369348B2 (ja) * 2004-11-08 2009-11-18 新光電気工業株式会社 基板及びその製造方法
US7684205B2 (en) * 2006-02-22 2010-03-23 General Dynamics Advanced Information Systems, Inc. System and method of using a compliant lead interposer
TWI334760B (en) * 2007-05-08 2010-12-11 Unimicron Technology Corp Circuit board and method of fabricating the same
JP2009064908A (ja) * 2007-09-05 2009-03-26 Ibiden Co Ltd 配線基板およびその製造方法
WO2009046428A2 (fr) * 2007-10-05 2009-04-09 Battery-Biz® Inc. Appareil et procédé de raccordement pour composants plats sur cartes de circuit imprimé
US8378231B2 (en) * 2008-07-31 2013-02-19 Ibiden Co., Ltd. Semiconductor device and method for manufacturing the same
TWM373598U (en) * 2009-09-07 2010-02-01 Power Mate Technology Co Ltd Surface-mounted terminal
TW201700208A (zh) * 2015-06-18 2017-01-01 Dtech Precision Industries Co Ltd 焊接扣件及其焊接在電路板的結構及方法
EP3332452B1 (fr) 2015-08-06 2021-06-02 Telefonaktiebolaget LM Ericsson (PUBL) Contact monté en surface, ensemble dispositif électronique
US11813701B2 (en) 2016-04-19 2023-11-14 Dtech Precision Industries Co., Ltd. Method of fitting the soldering component to board
US10393908B2 (en) 2016-12-15 2019-08-27 Rockwell Automation Technologies, Inc. Bobbin construction and coil winding method
KR102442279B1 (ko) * 2017-07-12 2022-09-15 주식회사 아모텍 기능성 컨택터
KR102651162B1 (ko) * 2022-03-15 2024-03-26 조인셋 주식회사 탄성을 갖는 전기접촉단자 및 그 실장 구조

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945869U (ja) * 1982-09-17 1984-03-27 水野貴金属株式会社 電子デバイス接続端子用ピン
US4976626A (en) * 1988-12-21 1990-12-11 International Business Machines Corporation Connector for connecting flexible film circuit carrier to board or card
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
US5246391A (en) * 1991-09-19 1993-09-21 North American Specialties Corporation Solder-bearing lead
US5338208A (en) * 1992-02-04 1994-08-16 International Business Machines Corporation High density electronic connector and method of assembly
JPH06275328A (ja) * 1993-03-19 1994-09-30 Fuji Elelctrochem Co Ltd プリント基板用リード端子とその実装方法
JP3667786B2 (ja) * 1994-03-17 2005-07-06 インテル・コーポレーション Ｉｃソケットおよびそのプリント基板との導通接続状態の検査方法
US5562462A (en) * 1994-07-19 1996-10-08 Matsuba; Stanley Reduced crosstalk and shielded adapter for mounting an integrated chip package on a circuit board like member
US5742481A (en) * 1995-10-04 1998-04-21 Advanced Interconnections Corporation Removable terminal support member for integrated circuit socket/adapter assemblies
JP3843514B2 (ja) * 1995-12-15 2006-11-08 イビデン株式会社 電子部品搭載用基板及びその製造方法
JP3848723B2 (ja) * 1997-03-31 2006-11-22 株式会社日立製作所 半導体装置の実装構造体及びその検査方法
JPH11167944A (ja) * 1997-10-03 1999-06-22 Fujitsu Ltd 基板間接続用の半田ダム付きｉ／ｏピン
US6300678B1 (en) * 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
US6137164A (en) 1998-03-16 2000-10-24 Texas Instruments Incorporated Thin stacked integrated circuit device
JP4079527B2 (ja) * 1998-07-15 2008-04-23 富士通コンポーネント株式会社 リードピンの部分めっき方法
US6272741B1 (en) * 1998-07-24 2001-08-14 Autosplice, Inc. Hybrid solder ball and pin grid array circuit board interconnect system and method
US6189203B1 (en) 1999-04-08 2001-02-20 Lucent Technologies Inc. Method of manufacturing a surface mountable power supply module
US6848942B1 (en) * 2000-01-12 2005-02-01 Molex Incorporated Connectors having supportive barrier components

Also Published As

Publication number Publication date
KR20030015156A (ko) 2003-02-20
DE60209408D1 (de) 2006-04-27
US20030029638A1 (en) 2003-02-13
EP1284523B1 (fr) 2006-03-01
US6700079B2 (en) 2004-03-02
EP1284523A3 (fr) 2004-01-28
JP4521854B2 (ja) 2010-08-11
HK1053546A1 (en) 2003-10-24
EP1284523A2 (fr) 2003-02-19
DE60209408T2 (de) 2006-09-21
JP2003168853A (ja) 2003-06-13
KR101029037B1 (ko) 2011-04-15

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